The Experts below are selected from a list of 4857 Experts worldwide ranked by ideXlab platform
A. I. Grabchenko - One of the best experts on this subject based on the ideXlab platform.
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Diamond Grinding of super-hard materials
Journal of Materials Processing Technology, 2000Co-Authors: A.g. Mamalis, M. Horvath, A. I. GrabchenkoAbstract:Abstract In this paper the results of investigations into the Grinding to super-hard polycrystalline materials using a Diamond-Grinding wheel are presented. The main properties of the Grinding process are clarified with special emphasis on the thermodynamic and structural changes of its parameters. The possibility of monitoring the static parameters of the Grinding wheel relief during the Grinding of materials of high and low hardness is indicated.
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Diamond Grinding of super-hard materials
Journal of Materials Processing Technology, 2000Co-Authors: A.g. Mamalis, M. Horvath, A. I. GrabchenkoAbstract:In this paper the results of investigations into the Grinding to super-hard polycrystalline materials using a Diamond-Grinding wheel are presented. The main properties of the Grinding process are clarified with special emphasis on the thermodynamic and structural changes of its parameters. The possibility of monitoring the static parameters of the Grinding wheel relief during the Grinding of materials of high and low hardness is indicated. (C) 2000 Published by Elsevier Science S.A. All rights reserved
A.g. Mamalis - One of the best experts on this subject based on the ideXlab platform.
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Diamond Grinding of super-hard materials
Journal of Materials Processing Technology, 2000Co-Authors: A.g. Mamalis, M. Horvath, A. I. GrabchenkoAbstract:Abstract In this paper the results of investigations into the Grinding to super-hard polycrystalline materials using a Diamond-Grinding wheel are presented. The main properties of the Grinding process are clarified with special emphasis on the thermodynamic and structural changes of its parameters. The possibility of monitoring the static parameters of the Grinding wheel relief during the Grinding of materials of high and low hardness is indicated.
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Diamond Grinding of super-hard materials
Journal of Materials Processing Technology, 2000Co-Authors: A.g. Mamalis, M. Horvath, A. I. GrabchenkoAbstract:In this paper the results of investigations into the Grinding to super-hard polycrystalline materials using a Diamond-Grinding wheel are presented. The main properties of the Grinding process are clarified with special emphasis on the thermodynamic and structural changes of its parameters. The possibility of monitoring the static parameters of the Grinding wheel relief during the Grinding of materials of high and low hardness is indicated. (C) 2000 Published by Elsevier Science S.A. All rights reserved
Shang Gao - One of the best experts on this subject based on the ideXlab platform.
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Grinding Performance of Diamond Grinding Tools for Sapphire Crystal
Advanced Materials Research, 2014Co-Authors: Yu Zhang, Shang Gao, Renke Kang, Xiaoguang Guo, Zhi Fu LinAbstract:In order to improve the efficiency and reduce the cost of sapphire crystal machined by loose abrasive lapping, the fixed-abrasive Diamond Grinding tools for sapphire Grinding were investigated in this paper. Four vitrified-resin composite bond Diamond Grinding tools with different grain sizes (40μm, 20μm, 7μm, 2.5μm) were developed. The Grinding experiments were performed with the developed Diamond Grinding tools and the Grinding performance of four Grinding tools were evaluated by comparing the surface roughness and the material removal rate (MRR) of sapphire. The experiment results show that with the increase in grain size, both the MRR and the surface roughness increase. A high-efficiency and high-quality ultra-precision Grinding process using Diamond Grinding tools with different grain sizes was proposed.
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Edge chipping of silicon wafers in Diamond Grinding
International Journal of Machine Tools and Manufacture, 2013Co-Authors: Shang Gao, Renke Kang, Zhigang Dong, Bi ZhangAbstract:Abstract Although Diamond Grinding is the most commonly used machining technique in silicon wafer thinning, it often induces edge chipping which leads to wafer breakage. This study investigates edge chipping of silicon wafer in Diamond Grinding. The study correlates edge chipping with the crystallographic orientation and thickness of a silicon wafer, as well as Grinding process conditions, such as wheel grit size, Grinding mode and feed rate. It identifies edge chipping in terms of critical thickness, geometry and dimensions. The study discusses the mechanisms of edge chipping based on machining mechanics and energy theories. Conclusions are drawn to summarize the study.
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Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel
Key Engineering Materials, 2011Co-Authors: Shang Gao, Renke Kang, Hang GaoAbstract:Surface and subsurface damage affect the preparation of high-resolution HgCdTe and CdZnTe detectors. Grinding experiments were performed on CdZnTe substrates with the Grinding wheels of different abrasive sizes. The surface topography and subsurface damages of CdZnTe substrates ground by Diamond Grinding wheels with different grit sizes were studied. The effects of the grit sizes of Grinding wheels on the surface topography and subsurface damage of CdZnTe substrates were discussed. The surface roughness and subsurface damage layer depth of CdZnTe after Grinding with #3000 Diamond Grinding wheel are only Ra 7 nm and 100 nm, proved that Grinding is of great potential for CdZnTe substrate processing.
Bi Zhang - One of the best experts on this subject based on the ideXlab platform.
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Edge chipping of silicon wafers in Diamond Grinding
International Journal of Machine Tools and Manufacture, 2013Co-Authors: Shang Gao, Renke Kang, Zhigang Dong, Bi ZhangAbstract:Abstract Although Diamond Grinding is the most commonly used machining technique in silicon wafer thinning, it often induces edge chipping which leads to wafer breakage. This study investigates edge chipping of silicon wafer in Diamond Grinding. The study correlates edge chipping with the crystallographic orientation and thickness of a silicon wafer, as well as Grinding process conditions, such as wheel grit size, Grinding mode and feed rate. It identifies edge chipping in terms of critical thickness, geometry and dimensions. The study discusses the mechanisms of edge chipping based on machining mechanics and energy theories. Conclusions are drawn to summarize the study.
Renke Kang - One of the best experts on this subject based on the ideXlab platform.
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Grinding Performance of Diamond Grinding Tools for Sapphire Crystal
Advanced Materials Research, 2014Co-Authors: Yu Zhang, Shang Gao, Renke Kang, Xiaoguang Guo, Zhi Fu LinAbstract:In order to improve the efficiency and reduce the cost of sapphire crystal machined by loose abrasive lapping, the fixed-abrasive Diamond Grinding tools for sapphire Grinding were investigated in this paper. Four vitrified-resin composite bond Diamond Grinding tools with different grain sizes (40μm, 20μm, 7μm, 2.5μm) were developed. The Grinding experiments were performed with the developed Diamond Grinding tools and the Grinding performance of four Grinding tools were evaluated by comparing the surface roughness and the material removal rate (MRR) of sapphire. The experiment results show that with the increase in grain size, both the MRR and the surface roughness increase. A high-efficiency and high-quality ultra-precision Grinding process using Diamond Grinding tools with different grain sizes was proposed.
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Edge chipping of silicon wafers in Diamond Grinding
International Journal of Machine Tools and Manufacture, 2013Co-Authors: Shang Gao, Renke Kang, Zhigang Dong, Bi ZhangAbstract:Abstract Although Diamond Grinding is the most commonly used machining technique in silicon wafer thinning, it often induces edge chipping which leads to wafer breakage. This study investigates edge chipping of silicon wafer in Diamond Grinding. The study correlates edge chipping with the crystallographic orientation and thickness of a silicon wafer, as well as Grinding process conditions, such as wheel grit size, Grinding mode and feed rate. It identifies edge chipping in terms of critical thickness, geometry and dimensions. The study discusses the mechanisms of edge chipping based on machining mechanics and energy theories. Conclusions are drawn to summarize the study.
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Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel
Key Engineering Materials, 2011Co-Authors: Shang Gao, Renke Kang, Hang GaoAbstract:Surface and subsurface damage affect the preparation of high-resolution HgCdTe and CdZnTe detectors. Grinding experiments were performed on CdZnTe substrates with the Grinding wheels of different abrasive sizes. The surface topography and subsurface damages of CdZnTe substrates ground by Diamond Grinding wheels with different grit sizes were studied. The effects of the grit sizes of Grinding wheels on the surface topography and subsurface damage of CdZnTe substrates were discussed. The surface roughness and subsurface damage layer depth of CdZnTe after Grinding with #3000 Diamond Grinding wheel are only Ra 7 nm and 100 nm, proved that Grinding is of great potential for CdZnTe substrate processing.
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Recognition of Diamond grains on surface of fine Diamond Grinding wheel
Frontiers of Mechanical Engineering in China, 2008Co-Authors: Fengwei Huo, Renke Kang, Zhuji Jin, Dongming Guo, Chun YangAbstract:The accurate evaluation of Grinding wheel surface topography, which is necessary for the investigation of the Grinding principle, optimism, modeling, and simulation of a Grinding process, significantly depends on the accurate recognition of abrasive grains from the measured wheel surface. A detailed analysis of the grain size distribution characteristics and grain profile wavelength of the fine Diamond Grinding wheel used for ultra-precision Grinding is presented. The requirements of the spatial sampling interval and sampling area for instruments to measure the surface topography of a Diamond Grinding wheel are discussed. To recognize Diamond grains, digital filtering is used to eliminate the high frequency disturbance from the measured 3D digital surface of the Grinding wheel, the geometric features of Diamond grains are then extracted from the filtered 3D digital surface, and a method based on the grain profile frequency characteristics, Diamond grain curvature, and distance between two adjacent Diamond grains is proposed. A 3D surface profiler based on scanning white light interferometry is used to measure the 3D surface topography of a #3000 mesh resin bonded Diamond Grinding wheel, and the Diamond grains are then recognized from the 3D digital surface. The experimental result shows that the proposed method is reasonable and effective.