The Experts below are selected from a list of 119391 Experts worldwide ranked by ideXlab platform
John E. Haddock - One of the best experts on this subject based on the ideXlab platform.
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Using Electrical Resistance to evaluate the chip seal curing process
Road Materials and Pavement Design, 2017Co-Authors: Miguel A. Montoya, W. Jason Weiss, John E. HaddockAbstract:Chip seals are among the most cost-effective surface treatments available for pavement preventive maintenance. However, frequent issues associated with asphalt emulsion early mechanical strength development, resulting in premature surface treatment failure, have led to the need to improve the characterisation of the chip seal curing process. As such, the use of an Electrical Resistance measurement has been studied to develop a sound construction methodology that prevents common failures that occur soon after construction. This paper presents a novel approach, based on Electrical Resistance measurements, to determine when a chip seal has developed enough binder adhesive strength to bond to the existing pavement while keeping the aggregate chips in place. The Electrical Resistance measurements provide a rapid, non-destructive indication of the amount of curing that has occurred. By implementing this methodology the user can determine when a chip seal has gained sufficient mechanical strength to allow for br...
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Using Electrical Resistance to Evaluate the Chip Seal Curing Process
2017Co-Authors: Miguel A. Montoya, W. Jason Weiss, John E. HaddockAbstract:Chip seals are among the most cost-effective surface treatments available for pavement preventive maintenance. However, frequent issues associated with asphalt emulsion early mechanical strength development, resulting in premature surface treatment failure, have led to the need to improve the characterization of the chip seal curing process. As such, the use of an Electrical Resistance measurement has been studied to develop a sound construction methodology that prevents common failures that occur soon after construction. This paper presents a novel approach, based on Electrical Resistance measurements, to determine when a chip seal has developed enough binder adhesive strength to bond to the existing pavement while keeping the aggregate chips in place. The Electrical Resistance measurements provide a rapid, non-destructive indication of the amount of curing that has occurred. By implementing this methodology, the user can determine when a chip seal has gained sufficient mechanical strength to allow for brooming or opening to unrestricted traffic without an undue loss of cover aggregate. Laboratory and full-scale field trials were conducted using a variety of materials. The Electrical properties of the fresh seal coats were quantified by employing a handheld Electrical device with a two-point probe Resistance measurement. The experimental results suggest that chip seal systems have gained significant mechanical strength when the initial Electrical Resistance measurement increases by a factor of 10. As a result, this study establishes that Electrical Resistance measurements can be used to determine when a fresh chip seal has sufficiently cured to withstand the shear forces of brooms and uncontrolled traffic. The implementation of the technique could potentially impact chip seal construction quality, as well as service life performance.
Joungman Park - One of the best experts on this subject based on the ideXlab platform.
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interfacial evaluation of carbon fiber epoxy composites using Electrical Resistance measurements at room and a cryogenic temperature
Composites Part A-applied Science and Manufacturing, 2015Co-Authors: Dongjun Kwon, Jinyeong Choi, Zuojia Wang, Pyeongsu Shin, Lawrence K Devries, Joungman ParkAbstract:Abstract Interfacial properties between fiber and matrix were evaluated using an Electrical Resistance (ER) fragmentation method. The single carbon fiber (CF) tensile test was performed in conjunction with Electrical Resistance measurements. The relationship between tensile properties of single carbon fiber specimens and the Electrical Resistance ratio (ERR) was investigated. The data showed a linear relationship between these properties. Fragmentation specimens were tested under tensile loading, and it was observed that, due to stress transfer from the matrix to the reinforcing fiber, the single carbon fiber broke first. The stress distribution along the carbon fiber was monitored via Electrical Resistance changes. ER fragmentation measurements were performed to predict CF fractured strength embedded in epoxy by an empirical formula of CF tensile results. These interfacial properties of CF epoxy composites were measured at room and a cryogenic temperature. Work of adhesion between the carbon fiber and the matrix was measured to verify the results of the ER fragmentation method, and the two procedures yielded consistent results and conclusions.
Tianhuai Ding - One of the best experts on this subject based on the ideXlab platform.
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creep of Electrical Resistance under uniaxial pressures for carbon black silicone rubber composite
Journal of Materials Science, 2010Co-Authors: Peng Wang, Tianhuai DingAbstract:A composite comprised of dispersed conductive particles in an insulating polymer matrix is an excellent sensing material and could be used in flexible pressure sensors and tactile sensors. In this study, we investigated the variation of Electrical Resistance as a function of pressure for carbon black–silicone rubber composite. Samples were fabricated with different carbon black volume fractions. From experimental results, it was found that the composite has not only piezoresistivity but also Electrical Resistance creep behavior, which illustrates the relationship between Electrical Resistance and time. To describe and predict the above two phenomena, a mathematical model was established for particles filled polymer composites. When the piezoresistive composite was applied as a pressure-sensing unit, errors were seen due to “Resistance creep” behavior. Based on this study, a method to inhibit such errors were investigated, developed, and realized.
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changes in Electrical Resistance of carbon black filled silicone rubber composite during compression
Journal of Polymer Science Part B, 2007Co-Authors: Tianhuai Ding, Luheng Wang, Peng WangAbstract:We studied the changes in the Electrical Resistance of carbon black filled silicone rubber composite, which is the sensitive element of the flexible force sensor, as a function of time during compression. The experimental results show that there is a sudden increase of the Electrical Resistance along with the sudden increase of the stress immediately after the compression. When the sample strain is kept constant, the Electrical Resistance and the stress both decay with time. The data of the stress relaxation and the Resistance relaxation both can be fitted by the linear combination of two exponential functions. Based on the shell structure theory, the experimental phenomena are explained from the view that the uniaxial pressure induces the changes in the effective conductive paths. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2700–2706, 2007
Montoya Rodriguez, Miguel A - One of the best experts on this subject based on the ideXlab platform.
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Quantifying asphalt emulsion-based chip seal curing times using Electrical Resistance measurements
'Purdue University (bepress)', 2016Co-Authors: Montoya Rodriguez, Miguel AAbstract:Chip seals are among the most cost-effective surface treatments available for asphalt pavement preventive maintenance. Chip sealing typically consists of covering a pavement surface with asphalt emulsion into which aggregate chips are embedded. The asphalt emulsion cures through the evaporation of water, which helps to provide mechanical strength for the chip seal. Ultimately, the curing process enables the emulsion to adhere to the pavement while keeping the aggregate chips in place. The curing time for the chip seal depends on many factors, such as the asphalt emulsion and aggregate types, aggregate moisture content, emulsion and aggregate application rates, and environmental conditions (e.g., temperature, wind speed, relative humidity, and solar radiation). Currently, no field technique is available that can quantify when sufficient mechanical strength has developed in the binder to allow traffic on a newly sealed roadway or to remove the surplus aggregate from a fresh chip seal. Such decisions are made by empirical factors that rely on the experience of field personnel. Consequently, frequent problems associated with the lack of early mechanical strength development of asphalt emulsion, which can result in premature surface treatment failure, have led to the need to improve the characterization of the chip seal curing process. As such, this study investigated the use of an Electrical Resistance measurement to develop a sound construction methodology to prevent common failures that occur soon after construction. First, full frequency, two-point, uniaxial Electrical impedance spectroscopy was used to characterize the Electrical properties of asphalt emulsions and various asphalt emulsion-aggregate combinations. The laboratory test results suggest a relationship between the changes in the Electrical Resistance of an asphalt emulsion and the amount of curing that has occurred in a chip seal system. In addition, standardized mechanical strength tests and full-scale field trials were conducted using a variety of materials. The Electrical properties of the fresh seal coats were quantified by employing a handheld Electrical device with a two-point probe to measure Resistance. The findings suggest that chip seal systems gain significant mechanical strength when the initial Electrical Resistance measurement increases by a factor of 10. Finally, the implementation of the methodology for five full-scale chip seal systems in Indiana indicates that curing times for the chip seal projects range from 3.5 to 4.0 hours. Electrical Resistance measurements can provide a rapid, nondestructive, low-cost indication of the amount of curing that has occurred in a chip seal. The application of this methodology will result in more accurate, robust, and timely decisions with regard to when a chip seal has gained sufficient mechanical strength to allow brooming or opening to unrestricted traffic without undue loss of cover aggregate. Furthermore, implementing this construction technique could positively impact chip seal construction quality as well as extend the service life of the chip seal. Lastly, the findings of this study can be extended to include a variety of asphalt emulsion applications
Miguel A. Montoya - One of the best experts on this subject based on the ideXlab platform.
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Using Electrical Resistance to evaluate the chip seal curing process
Road Materials and Pavement Design, 2017Co-Authors: Miguel A. Montoya, W. Jason Weiss, John E. HaddockAbstract:Chip seals are among the most cost-effective surface treatments available for pavement preventive maintenance. However, frequent issues associated with asphalt emulsion early mechanical strength development, resulting in premature surface treatment failure, have led to the need to improve the characterisation of the chip seal curing process. As such, the use of an Electrical Resistance measurement has been studied to develop a sound construction methodology that prevents common failures that occur soon after construction. This paper presents a novel approach, based on Electrical Resistance measurements, to determine when a chip seal has developed enough binder adhesive strength to bond to the existing pavement while keeping the aggregate chips in place. The Electrical Resistance measurements provide a rapid, non-destructive indication of the amount of curing that has occurred. By implementing this methodology the user can determine when a chip seal has gained sufficient mechanical strength to allow for br...
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Using Electrical Resistance to Evaluate the Chip Seal Curing Process
2017Co-Authors: Miguel A. Montoya, W. Jason Weiss, John E. HaddockAbstract:Chip seals are among the most cost-effective surface treatments available for pavement preventive maintenance. However, frequent issues associated with asphalt emulsion early mechanical strength development, resulting in premature surface treatment failure, have led to the need to improve the characterization of the chip seal curing process. As such, the use of an Electrical Resistance measurement has been studied to develop a sound construction methodology that prevents common failures that occur soon after construction. This paper presents a novel approach, based on Electrical Resistance measurements, to determine when a chip seal has developed enough binder adhesive strength to bond to the existing pavement while keeping the aggregate chips in place. The Electrical Resistance measurements provide a rapid, non-destructive indication of the amount of curing that has occurred. By implementing this methodology, the user can determine when a chip seal has gained sufficient mechanical strength to allow for brooming or opening to unrestricted traffic without an undue loss of cover aggregate. Laboratory and full-scale field trials were conducted using a variety of materials. The Electrical properties of the fresh seal coats were quantified by employing a handheld Electrical device with a two-point probe Resistance measurement. The experimental results suggest that chip seal systems have gained significant mechanical strength when the initial Electrical Resistance measurement increases by a factor of 10. As a result, this study establishes that Electrical Resistance measurements can be used to determine when a fresh chip seal has sufficiently cured to withstand the shear forces of brooms and uncontrolled traffic. The implementation of the technique could potentially impact chip seal construction quality, as well as service life performance.
