The Experts below are selected from a list of 144 Experts worldwide ranked by ideXlab platform
Ching-ping Wong - One of the best experts on this subject based on the ideXlab platform.
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one step preparation of silver hexagonal microsheets as Electrically Conductive Adhesive fillers for printed electronics
ACS Applied Materials & Interfaces, 2015Co-Authors: Huming Ren, Shengyun Huang, Shuhui Yu, Xianzhu Fu, Matthew Ming Fai Yuen, Rong Sun, Kai Zhang, Ying Guo, Ching-ping WongAbstract:A facile one-step solution-phase chemical reduction method has been developed to synthesize Ag microsheets at room temperature. The morphology of Ag sheets is a regular hexagon more than 1 μm in size and about 200 nm in thickness. The hexagonal Ag microsheets possess a smoother and straighter surface compared with that of the commercial Ag micrometer-sized flakes prepared by ball milling for Electrically Conductive Adhesives (ECAs). The function of the reagents and the formation mechanism of Ag hexagonal microsheets are also investigated. For the polyvinylpyrrolidone (PVP) and citrate facet-selective capping, the Ag atoms freshly reduced by N2H4 would orientationally grow alone on the {111} facet of Ag seeds, with the synergistically selective etching of irregular and small Ag particles by H2O2, to form Ag hexagonal microsheets. The hexagonal Ag microsheet-filled epoxy Adhesives, as Electrically Conductive materials, can be easily printed on various substrates such as polyethylene terephthalate (PET), epo...
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Rational design of a printable, highly Conductive silicone-based Electrically Conductive Adhesive for stretchable radio-frequency antennas
Advanced Functional Materials, 2015Co-Authors: Zhuo Li, Zhenkun Wu, Taoran Le, Liyi Li, Yagang Yao, M.m. Manos M. Tentzeris, Kyoung-sik Moon, Ching-ping WongAbstract:Stretchable radio-frequency electronics are gaining popularity as a result of the increased functionality they gain through their flexible nature, impossible within the confines of rigid and planar substrates. One approach to fabricating stretchable antennas is to embed stretchable or flowable Conductive materials, such as Conductive polymers, Conductive polymer composites, and liquid metal alloys as stretchable conduction lines. However, these Conductive materials face many challenges, such as low electrical conductivity under mechanical deformation and delamination from substrates. In the present study, a silicone-based Electrically Conductive Adhesive (silo-ECA) is developed that have a conductivity of 1.51 x 10(4) S cm(-1) and can maintain conductivity above 1.11 x 10(3) S cm(-1), even at a large stain of 240%. By using the stretchable silo-ECAs as a conductor pattern and pure silicone elastomers as a base substrate, stretchable antennas can be fabricated by stencil printing or soft-lithography. The resulting antenna's resonant frequency is tunable over a wide range by mechanical modulation. This fabrication method is low-cost, can support large-scale production, has high reliability over a wide temperature range, and eliminates the concerns of leaking or delamination between conductor and substrate experienced in previously reported micro-fluidic antennas.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
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review of recent advances in Electrically Conductive Adhesive materials and technologies in electronic packaging
Journal of Adhesion Science and Technology, 2008Co-Authors: Myung Jin Yim, Kyoung-sik Moon, Kyungwook Paik, Ching-ping WongAbstract:Electrically Conductive Adhesives (ICAs: Isotropic Conductive Adhesives; ACAs: An-isotropic Conductive Adhesives; and NCAs: Non-Conductive Adhesives) offer promising material solutions for fine pitch interconnects, low cost, low-temperature process and environmentally clean approaches in the electronic packaging technology. ICAs have been developed and used widely for traditional solder replacement, especially in surface mount devices and flip chip application. These also need to be lower cost with higher electrical/mechanical and reliability performances. ACAs have been widely used in flat panel display modules for high resolution, lightweight, thin profile and low power consumption in film forms (Anisotropic Conductive Films: ACFs) for last decades. Multi-layered ACF structures such as double and triple-layered ACFs were developed to meet fine pitch interconnection, low-temperature curing and strong adhesion requirements. Also, ACAs have been attracting much attention for their simple and lead-free proc...
Zhuo Li - One of the best experts on this subject based on the ideXlab platform.
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Rational design of a printable, highly Conductive silicone-based Electrically Conductive Adhesive for stretchable radio-frequency antennas
Advanced Functional Materials, 2015Co-Authors: Zhuo Li, Zhenkun Wu, Taoran Le, Liyi Li, Yagang Yao, M.m. Manos M. Tentzeris, Kyoung-sik Moon, Ching-ping WongAbstract:Stretchable radio-frequency electronics are gaining popularity as a result of the increased functionality they gain through their flexible nature, impossible within the confines of rigid and planar substrates. One approach to fabricating stretchable antennas is to embed stretchable or flowable Conductive materials, such as Conductive polymers, Conductive polymer composites, and liquid metal alloys as stretchable conduction lines. However, these Conductive materials face many challenges, such as low electrical conductivity under mechanical deformation and delamination from substrates. In the present study, a silicone-based Electrically Conductive Adhesive (silo-ECA) is developed that have a conductivity of 1.51 x 10(4) S cm(-1) and can maintain conductivity above 1.11 x 10(3) S cm(-1), even at a large stain of 240%. By using the stretchable silo-ECAs as a conductor pattern and pure silicone elastomers as a base substrate, stretchable antennas can be fabricated by stencil printing or soft-lithography. The resulting antenna's resonant frequency is tunable over a wide range by mechanical modulation. This fabrication method is low-cost, can support large-scale production, has high reliability over a wide temperature range, and eliminates the concerns of leaking or delamination between conductor and substrate experienced in previously reported micro-fluidic antennas.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
Kyoung-sik Moon - One of the best experts on this subject based on the ideXlab platform.
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Rational design of a printable, highly Conductive silicone-based Electrically Conductive Adhesive for stretchable radio-frequency antennas
Advanced Functional Materials, 2015Co-Authors: Zhuo Li, Zhenkun Wu, Taoran Le, Liyi Li, Yagang Yao, M.m. Manos M. Tentzeris, Kyoung-sik Moon, Ching-ping WongAbstract:Stretchable radio-frequency electronics are gaining popularity as a result of the increased functionality they gain through their flexible nature, impossible within the confines of rigid and planar substrates. One approach to fabricating stretchable antennas is to embed stretchable or flowable Conductive materials, such as Conductive polymers, Conductive polymer composites, and liquid metal alloys as stretchable conduction lines. However, these Conductive materials face many challenges, such as low electrical conductivity under mechanical deformation and delamination from substrates. In the present study, a silicone-based Electrically Conductive Adhesive (silo-ECA) is developed that have a conductivity of 1.51 x 10(4) S cm(-1) and can maintain conductivity above 1.11 x 10(3) S cm(-1), even at a large stain of 240%. By using the stretchable silo-ECAs as a conductor pattern and pure silicone elastomers as a base substrate, stretchable antennas can be fabricated by stencil printing or soft-lithography. The resulting antenna's resonant frequency is tunable over a wide range by mechanical modulation. This fabrication method is low-cost, can support large-scale production, has high reliability over a wide temperature range, and eliminates the concerns of leaking or delamination between conductor and substrate experienced in previously reported micro-fluidic antennas.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
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review of recent advances in Electrically Conductive Adhesive materials and technologies in electronic packaging
Journal of Adhesion Science and Technology, 2008Co-Authors: Myung Jin Yim, Kyoung-sik Moon, Kyungwook Paik, Ching-ping WongAbstract:Electrically Conductive Adhesives (ICAs: Isotropic Conductive Adhesives; ACAs: An-isotropic Conductive Adhesives; and NCAs: Non-Conductive Adhesives) offer promising material solutions for fine pitch interconnects, low cost, low-temperature process and environmentally clean approaches in the electronic packaging technology. ICAs have been developed and used widely for traditional solder replacement, especially in surface mount devices and flip chip application. These also need to be lower cost with higher electrical/mechanical and reliability performances. ACAs have been widely used in flat panel display modules for high resolution, lightweight, thin profile and low power consumption in film forms (Anisotropic Conductive Films: ACFs) for last decades. Multi-layered ACF structures such as double and triple-layered ACFs were developed to meet fine pitch interconnection, low-temperature curing and strong adhesion requirements. Also, ACAs have been attracting much attention for their simple and lead-free proc...
Taoran Le - One of the best experts on this subject based on the ideXlab platform.
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Rational design of a printable, highly Conductive silicone-based Electrically Conductive Adhesive for stretchable radio-frequency antennas
Advanced Functional Materials, 2015Co-Authors: Zhuo Li, Zhenkun Wu, Taoran Le, Liyi Li, Yagang Yao, M.m. Manos M. Tentzeris, Kyoung-sik Moon, Ching-ping WongAbstract:Stretchable radio-frequency electronics are gaining popularity as a result of the increased functionality they gain through their flexible nature, impossible within the confines of rigid and planar substrates. One approach to fabricating stretchable antennas is to embed stretchable or flowable Conductive materials, such as Conductive polymers, Conductive polymer composites, and liquid metal alloys as stretchable conduction lines. However, these Conductive materials face many challenges, such as low electrical conductivity under mechanical deformation and delamination from substrates. In the present study, a silicone-based Electrically Conductive Adhesive (silo-ECA) is developed that have a conductivity of 1.51 x 10(4) S cm(-1) and can maintain conductivity above 1.11 x 10(3) S cm(-1), even at a large stain of 240%. By using the stretchable silo-ECAs as a conductor pattern and pure silicone elastomers as a base substrate, stretchable antennas can be fabricated by stencil printing or soft-lithography. The resulting antenna's resonant frequency is tunable over a wide range by mechanical modulation. This fabrication method is low-cost, can support large-scale production, has high reliability over a wide temperature range, and eliminates the concerns of leaking or delamination between conductor and substrate experienced in previously reported micro-fluidic antennas.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
Kristen Hansen - One of the best experts on this subject based on the ideXlab platform.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.
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highly Conductive flexible polyurethane based Adhesives for flexible and printed electronics
Advanced Functional Materials, 2013Co-Authors: Zhuo Li, Kristen Hansen, Taoran Le, Rongwei Zhang, Kyoung-sik Moon, Yan Liu, Ching-ping WongAbstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, Adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based Electrically Conductive Adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10−5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a Conductive paste for wearable radio-frequency devices.