The Experts below are selected from a list of 57 Experts worldwide ranked by ideXlab platform
Cabrera Marrero, José M. - One of the best experts on this subject based on the ideXlab platform.
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Microstructure influencing physical and mechanical properties of Electrolytic tough pitch Copper produced by equal channel angular pressing
2013Co-Authors: Higuera Cobos, Oscar Fabián, Cabrera Marrero, José M.Abstract:Samples of Electrolytic tough pitch (ETP) Copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties were analyzed. Results show that the stored energy increases on increasing ECAP deformation, while the recrystallization temperature decreases signi¿cantly. From a mechanical point of view a stable state is attained after 4 passes. Similarly, electrical conductivity slightly decreases down to a saturation state.Postprint (published version
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Microstructure influencing physical and mechanical properties of Electrolytic tough pitch Copper produced by equal channel angular pressing
2026Co-Authors: Higuera Cobos, Oscar Fabián, Cabrera Marrero, José M.Abstract:Samples of Electrolytic tough pitch (ETP) Copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties were analyzed. Results show that the stored energy increases on increasing ECAP deformation, while the recrystallization temperature decreases signi¿cantly. From a mechanical point of view a stable state is attained after 4 passes. Similarly, electrical conductivity slightly decreases down to a saturation state
K P Rao - One of the best experts on this subject based on the ideXlab platform.
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processing maps and rate controlling mechanisms of hot deformation of Electrolytic tough pitch Copper in the temperature range 300 950 c
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2005Co-Authors: Y V R K Prasad, K P RaoAbstract:Abstract The hot deformation behavior of Electrolytic touch pitch (ETP) Copper has been studied in the temperature range 300–950 °C and strain rate range 0.001–100 s −1 using isothermal hot compression tests. Processing maps are developed at different plastic strains with a view to characterize the dynamics of hot deformation while the standard kinetic analysis has been applied to evaluate the rate controlling mechanisms. The processing maps have exhibited three deterministic domains representing dynamic recrystallization (DRX) of ETP Copper and occurring in the following temperature and strain rate ranges: (1) 400–600 °C and 0.001–0.01 s −1 , (2) 650–950 °C and 0.001–3 s −1 and (3) 700–950 °C and 10–100 s −1 . While all these domains merge with increasing plastic strain, the first domain has a lower efficiency of power dissipation, the second domain appears early in deformation (strain of 0.1) and the third domain occurs at larger strains (>0.2). The results on processing maps have correlated well with those obtained from kinetic analysis and the apparent activation energy values estimated in these DRX domains are 159, 198 and 91 kJ/mol, respectively, which suggest that dislocation core diffusion, lattice self-diffusion and grain boundary self-diffusion are the rate controlling mechanisms. In all the three DRX domains, the average grain diameter varies linearly with the Zener–Hollomon parameter.
Higuera Cobos, Oscar Fabián - One of the best experts on this subject based on the ideXlab platform.
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Microstructure influencing physical and mechanical properties of Electrolytic tough pitch Copper produced by equal channel angular pressing
2013Co-Authors: Higuera Cobos, Oscar Fabián, Cabrera Marrero, José M.Abstract:Samples of Electrolytic tough pitch (ETP) Copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties were analyzed. Results show that the stored energy increases on increasing ECAP deformation, while the recrystallization temperature decreases signi¿cantly. From a mechanical point of view a stable state is attained after 4 passes. Similarly, electrical conductivity slightly decreases down to a saturation state.Postprint (published version
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Microstructure influencing physical and mechanical properties of Electrolytic tough pitch Copper produced by equal channel angular pressing
2026Co-Authors: Higuera Cobos, Oscar Fabián, Cabrera Marrero, José M.Abstract:Samples of Electrolytic tough pitch (ETP) Copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties were analyzed. Results show that the stored energy increases on increasing ECAP deformation, while the recrystallization temperature decreases signi¿cantly. From a mechanical point of view a stable state is attained after 4 passes. Similarly, electrical conductivity slightly decreases down to a saturation state
Y V R K Prasad - One of the best experts on this subject based on the ideXlab platform.
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processing maps and rate controlling mechanisms of hot deformation of Electrolytic tough pitch Copper in the temperature range 300 950 c
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2005Co-Authors: Y V R K Prasad, K P RaoAbstract:Abstract The hot deformation behavior of Electrolytic touch pitch (ETP) Copper has been studied in the temperature range 300–950 °C and strain rate range 0.001–100 s −1 using isothermal hot compression tests. Processing maps are developed at different plastic strains with a view to characterize the dynamics of hot deformation while the standard kinetic analysis has been applied to evaluate the rate controlling mechanisms. The processing maps have exhibited three deterministic domains representing dynamic recrystallization (DRX) of ETP Copper and occurring in the following temperature and strain rate ranges: (1) 400–600 °C and 0.001–0.01 s −1 , (2) 650–950 °C and 0.001–3 s −1 and (3) 700–950 °C and 10–100 s −1 . While all these domains merge with increasing plastic strain, the first domain has a lower efficiency of power dissipation, the second domain appears early in deformation (strain of 0.1) and the third domain occurs at larger strains (>0.2). The results on processing maps have correlated well with those obtained from kinetic analysis and the apparent activation energy values estimated in these DRX domains are 159, 198 and 91 kJ/mol, respectively, which suggest that dislocation core diffusion, lattice self-diffusion and grain boundary self-diffusion are the rate controlling mechanisms. In all the three DRX domains, the average grain diameter varies linearly with the Zener–Hollomon parameter.
Małgorzata Lewandowska - One of the best experts on this subject based on the ideXlab platform.
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Enhancing the Electrical Conductivity of Electrolytic Tough Pitch Copper Rods Processed by Incremental Equal Channel Angular Pressing
Metallurgical and Materials Transactions A, 2020Co-Authors: Marta Ciemiorek, Łukasz Pawliszak, Witold Chromiński, Lech Olejnik, Małgorzata LewandowskaAbstract:Electrolytic tough pitch Copper rods were processed by Incremental Equal Channel Angular Pressing and subjected to short-term annealing. Conductivity of 94 pct IACS without significant changes in the material’s microstructure and mechanical properties, up to 130 HV0.2, was achieved, which gives a very good ratio of electrical conductivity to strength in comparison with other processing methods. The proposed method offers a solution for manufacturing rods of significant sizes with good mechanical strength and electrical conductivity.