The Experts below are selected from a list of 133221 Experts worldwide ranked by ideXlab platform
Ronald Kline - One of the best experts on this subject based on the ideXlab platform.
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An overview of twenty-five years of electrical and Electronics Engineering in the proceedings of the IEEE, 1963-1987
Proceedings of the IEEE, 2005Co-Authors: Ronald KlineAbstract:The article presents a survey of the history of electrical and Electronics Engineering as seen in the 136 special issues and special sections of the Proceedings of the IEEE, from 1963 to 1987, in seven areas: Circuits and Devices(microElectronics and lasers and electrooptics); Computers; Communications; Signals, Systems, and Control; Electromagnetics; Energy, Power, and Industry and Engineering and Human Environment. Special attention is paid to the incremental nature of technological change, the relationship between electrophysics and electrotechnology, and the role of government funding in supporting Electronics R & D. It is hoped that setting the "snapshots" of the special issues and special sections in an historical framework will assist future researchers seeking to reach a better understanding of the Electronics "revolution" of the post-Sputnik period.
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An overview of twenty-five years of electrical and Electronics Engineering in the Proceedings of the IEEE, 1963-87
Proceedings of the IEEE, 1990Co-Authors: Ronald KlineAbstract:A survey is presented of the history of electrical and Electronics Engineering as seen in the 136 special issues and special sections of the Proceedings of the IEEE, from 1963 to 1987, in seven areas: circuits and devices (microElectronics and lasers and electrooptics); computers; communications; signals, systems, and control; electromagnetics; energy, power, and industry and Engineering and human environment. Special attention is paid to the incremental nature of technological change, the relationship between electrophysics and electrotechnology, and the role of government funding in supporting Electronics R&D. It is hoped that setting the `snapshots' of the special issues and special sections in an historical framework will assist future researchers seeking to reach a better understanding of the Electronics revolution of the post-Sputnik period
E Suhir - One of the best experts on this subject based on the ideXlab platform.
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Novel test methodology for the most consistent and accurate characterization of solder materials in Electronics Engineering
2009 59th Electronic Components and Technology Conference, 2009Co-Authors: T Reinikainen, E SuhirAbstract:Predictive modeling tools and techniques, whether computer-aided, such as, e.g., finite-element analysis (FEA), or analytical (ldquomathematicalrdquo), are currently widely used in physical design and reliability evaluations in Electronics Engineering. The implementation of these tools and techniques requires accurate input data for obtaining trustworthy output information that is intended to be used in the subsequent physical design and reliability evaluations efforts. Confidence in the consistency and accuracy of this information depends on the consistency and accuracy of the input data. One should always be mindful of the possibility of a ldquogarbage in - garbage outrdquo situation, no matter how good the model itself might be. It is equally important that one possesses a clear understanding of the physics and mechanics of the material behavior. With the continuing trend for miniaturization of packaging technologies, solder joint interconnections remain the weakest link, as far as the thermal-mechanical reliability is concerned. This is due, to a great extent, to the complexity of the mechanical behavior of the solder material, and particularly to its inelastic and time-dependent performance: various plasticity and creep mechanisms in the presence of significant stress concentration affect considerably the usage of the products containing solder. The behavior of solder materials depends strongly on their microstructure, as well as on the amount and the type of the alloying elements. In addition, the composition of the solder material in a solder joint structure may be different than that in the bulk solder material, primarily because of the dissolution of alloying elements from the joint interfaces. These effects should be considered when determining the constitutive properties of solder materials in the reliability modeling and physical design efforts. In the analysis that follows we present a novel methodology for material characterization. Although this methodology is developed in application to solders employed in electronic packaging, we believe that it might have an impact on the materials Engineering in general. The methodology takes into account various major requirements for testing solder deformation properties important for the subsequent physical design and reliability analyses, including modeling and experimental efforts, whether carried out on the joint level, board level or product level. The specimens are essentially single-lap shear joints (LSJs) with deliberately introduced transverse grooves. These grooves "separate" the solder joint area ("structure") from the outside portions of the "adherends" (test pins). It has been demonstrated, first by the finite-element analysis (FEA) and then by analytical stress modeling, that deep enough transverse grooves in small size LSJs can lead to a nearly uniform shear stress distribution and, as the consequence of that, to very low "peeling" stresses in the joint, thereby facilitating significantly the assessment of the stress-strain relationships for the materials.
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novel test methodology for the most consistent and accurate characterization of solder materials in Electronics Engineering
Electronic Components and Technology Conference, 2009Co-Authors: T Reinikainen, E SuhirAbstract:Predictive modeling tools and techniques, whether computer-aided, such as, e.g., finite-element analysis (FEA), or analytical (“mathematical”), are currently widely used in physical design and reliability evaluations in Electronics Engineering. The implementation of these tools and techniques requires accurate input data for obtaining trustworthy output information that is intended to be used in the subsequent physical design and reliability evaluations efforts. Confidence in the consistency and accuracy of this information depends on the consistency and accuracy of the input data. One should always be mindful of the possibility of a “garbage in - garbage out” situation, no matter how good the model itself might be. It is equally important that one possesses a clear understanding of the physics and mechanics of the material behavior.
Jingming Xia - One of the best experts on this subject based on the ideXlab platform.
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Unifying Electrical Engineering and Electronics Engineering - Unifying Electrical Engineering and Electronics Engineering
Lecture Notes in Electrical Engineering, 2014Co-Authors: Song Jin-xing, Suting Chen, Zhanming Wei, Jingming XiaAbstract:Unifying Electrical Engineering and Electronics Engineering is based on the Proceedings of the 2012 International Conference on Electrical and Electronics Engineering (ICEE 2012). This book collects the peer reviewed papers presented at the conference. The aim of the conference is to unify the two areas of Electrical and Electronics Engineering. The book examines trends and techniques in the field as well as theories and applications. The editors have chosen to include the following topics; biotechnology, power Engineering, superconductivity circuits, antennas technology, system architectures and telecommunication
Chia-chiang Chang - One of the best experts on this subject based on the ideXlab platform.
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The Effect of Oxgen Species on the ZnO TFT Prepared by Atmosphere Pressure Plasma Jet
ECS Transactions, 2012Co-Authors: Chien-hung Wu, Kow-ming Chang, Sung-hung Huang, I-chung Deng, Chin-jyi Wu, Chia-chiang ChangAbstract:Department of Electronics Engineering, Chung Hua University, Hsinchu, Taiwan Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan College of Electrical and Information Engineering, I-Shou University, Kaohsiung County, Taiwan Department of Electronics Engineering, Technology and Science Institute of Northern Taiwan, Taipei, Taiwan Industrial Technology Research Institute, Mechanical and Systems Research Laboratories, Hsinchu, Taiwan
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The effect of thermal annealing on the properties of IGZO TFT prepared by atmospheric pressure plasma jet
ECS Transactions, 2012Co-Authors: Chien-hung Wu, Kow-ming Chang, Sung-hung Huang, I-chung Deng, Chin-jyi Wu, Wei-han Chiang, Chia-chiang ChangAbstract:Department of Electronics Engineering, Chung Hua University, Hsinchu, Taiwan Department of Electronics Engineering & Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan College of Electrical and Information Engineering, I-Shou University, Kaohsiung County, Taiwan Department of Electronics Engineering, Technology and Science Institute of Northern Taiwan, Taipei, Taiwan Industrial Technology Research Institute, Mechanical and Systems Research Laboratories, Hsinchu, Taiwan
Cuneyt Guzelis - One of the best experts on this subject based on the ideXlab platform.
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A problem based learning scenario example for control education in electrical-Electronics Engineering programs
2011Co-Authors: Cuneyt GuzelisAbstract:The problem based learning is an active learning strategy which has been implemented in Engineering education either in a program fully structered as a sequence of staged modules or in a part of the courses found as suitable to this learning strategy. The paper presents an evaluation of the experience of implementing a scenario in a control analysis module in an electrical-Electronics Engineering program which had conducted problem based learning for 6 years as the main strategy in its entire undergraduate program. The conclusions on the use of such a problem based scenario in a control module and possible applications in a control course within a classical program are also given in the paper.
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A problem based learning scenario example for control education in electrical-Electronics Engineering programs
2011 7th International Conference on Electrical and Electronics Engineering (ELECO), 2011Co-Authors: Cuneyt GuzelisAbstract:Summary form only given. The problem based learning is an active learning strategy which has been implemented in Engineering education either in a program fully structered as a sequence of staged modules or in a part of the courses found as suitable to this learning strategy. The paper presents an evaluation of the experience of implementing a scenario in a control analysis module in an electrical-Electronics Engineering program which had conducted problem based learning for 6 years as the main strategy in its entire undergraduate program. The conclusions on the use of such a problem based scenario in a control module and possible applications in a control course within a classical program are also given in the paper.
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Problem based learning versus project based learning in electrical-Electronics Engineering programs
2011 7th International Conference on Electrical and Electronics Engineering (ELECO), 2011Co-Authors: Cuneyt GuzelisAbstract:The problem based learning and project based learning are two different but closely related examples of active learning methods used in Engineering education programs as well as in non-Engineering programs. The problem based learning is based on introducing a real Engineering problem usually within a scenario to the students so that the students are asked to define the problem first and then produce a number of alternative solutions by brain storming in structured problem based learning sessions and then converge to a solution by elimination based on getting new information and on conducting analysis and/or experimentation. In the project based learning, a real problem is also given to the students but with a mini scenario defining the targets which might be a design and/or implementation task to be accomplished within economical, technical constraints concerning also environmental issues. The paper presents an evaluation of both methods in a comparative way with considering the experience in an electrical-Electronics Engineering program which had conducted problem based learning for 6 years. A discussion on meeting ABET and MUDEK criteria in problem based learning and in project based learning is also included in the paper.