The Experts below are selected from a list of 2406 Experts worldwide ranked by ideXlab platform
Man Wong - One of the best experts on this subject based on the ideXlab platform.
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fabrication and packaging of inertia micro switch using low temperature photo resist molded metal Electroplating Technology
Sensors and Actuators A-physical, 2004Co-Authors: Yitshak Zohar, Man WongAbstract:Abstract Separate and non-interfering photo-resist molded metal-Electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches were designed using a simple but accurate lumped spring-mass model. With the application of an anti-stiction hydrophobic coating, un-encapsulated switches making over 100 million contacts have been demonstrated in room ambient.
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design and characterization of inertia activated electrical micro switches fabricated and packaged using low temperature photoresist molded metal Electroplating Technology
Journal of Micromechanics and Microengineering, 2003Co-Authors: Yitshak Zohar, Man WongAbstract:Inertia-activated electrical switches have been designed and realized using a low-temperature photoresist molded metal-Electroplating micro-fabrication Technology compatible with processed substrates containing micro-electronic signal-processing circuits. Packaging of the switches has also been implemented using this low-temperature plating process. A simple but accurate lumped spring-mass model is developed based on analytical and numerical analyses. Predictions of the behavior of switches with a range of different designs have been verified using both drop-hammer and shaker tests. With the application of an anti-stiction hydrophobic coating, susceptibility to stiction-induced storage and operational failure has been reduced. Unencapsulated switches making over 50 million contacts have been demonstrated at room ambient.
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fabrication and packaging of inertia micro switch using metal Electroplating Technology
International Conference on Micro Electro Mechanical Systems, 2003Co-Authors: Yitshak Zohar, Man WongAbstract:Separate and non-interfering photoresist-molded metal-Electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities formed using eutectic bonding. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches are based on a lateral mechanical resonator design responding to inertia change above a pre-determined threshold value. A simple but accurate lumped spring-mass model is developed based on analytical and numerical studies. Predictions of the behavior of switches with different geometric designs have been verified using both drop-hammer and shaker tests. Switches making over 100 million contacts have been demonstrated in room ambient.
Yitshak Zohar - One of the best experts on this subject based on the ideXlab platform.
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fabrication and packaging of inertia micro switch using low temperature photo resist molded metal Electroplating Technology
Sensors and Actuators A-physical, 2004Co-Authors: Yitshak Zohar, Man WongAbstract:Abstract Separate and non-interfering photo-resist molded metal-Electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches were designed using a simple but accurate lumped spring-mass model. With the application of an anti-stiction hydrophobic coating, un-encapsulated switches making over 100 million contacts have been demonstrated in room ambient.
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design and characterization of inertia activated electrical micro switches fabricated and packaged using low temperature photoresist molded metal Electroplating Technology
Journal of Micromechanics and Microengineering, 2003Co-Authors: Yitshak Zohar, Man WongAbstract:Inertia-activated electrical switches have been designed and realized using a low-temperature photoresist molded metal-Electroplating micro-fabrication Technology compatible with processed substrates containing micro-electronic signal-processing circuits. Packaging of the switches has also been implemented using this low-temperature plating process. A simple but accurate lumped spring-mass model is developed based on analytical and numerical analyses. Predictions of the behavior of switches with a range of different designs have been verified using both drop-hammer and shaker tests. With the application of an anti-stiction hydrophobic coating, susceptibility to stiction-induced storage and operational failure has been reduced. Unencapsulated switches making over 50 million contacts have been demonstrated at room ambient.
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fabrication and packaging of inertia micro switch using metal Electroplating Technology
International Conference on Micro Electro Mechanical Systems, 2003Co-Authors: Yitshak Zohar, Man WongAbstract:Separate and non-interfering photoresist-molded metal-Electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities formed using eutectic bonding. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches are based on a lateral mechanical resonator design responding to inertia change above a pre-determined threshold value. A simple but accurate lumped spring-mass model is developed based on analytical and numerical studies. Predictions of the behavior of switches with different geometric designs have been verified using both drop-hammer and shaker tests. Switches making over 100 million contacts have been demonstrated in room ambient.
Y Choi - One of the best experts on this subject based on the ideXlab platform.
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characterization of intermediate cr c layer fabricated by electrodeposition in hexavalent and trivalent chromium baths
Surface & Coatings Technology, 2004Co-Authors: Sikchol Kwon, Myounggyun Kim, S U Park, Dongyoung Kim, Dooin Kim, Keeseok Nam, Y ChoiAbstract:Abstract The effect of formic acid and current density on the crystal structure, surface morphology and crystallization of intermediate Cr-C layers deposited in both hexavalent and trivalent chromium baths were studied to observe chrome-carbide formation behavior and to develop an environmental protective Cr-C Electroplating Technology. Formic acid in hexavalent and trivalent chromium baths effectively produces intermediate Cr-C layers. The intermediate Cr-C layers has initially amorphous type microstructure. Crystallization of the intermediate Cr-C layer occurs at a current density above 27.5 A/dm 2 in a trivalent chromium bath and above 100 A/dm 2 in an hexavalent chromium bath, respectively. The carbon content of the intermediate Cr-C layer prepared in hexavalent chromium bath is twice as much as that of the layer prepared in trivalent chromium bath. Cr 23 C 6 and Cr 7 C 3 were observed in the intermediate Cr-C layer prepared in hexavalent chromium bath, whereas, Cr 23 C 6 was formed in the layer prepared in trivalent chromium bath after vacuum annealing at 800 °C.
Aimin Liang - One of the best experts on this subject based on the ideXlab platform.
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method for preparing chromium based composite coating in environment protection type trivalent chromium plating bath
2009Co-Authors: Junyan Zhang, Zhixiang Zeng, Aimin LiangAbstract:The invention discloses a method for preparing a chromium-based composite plating layer in an environment-friendly trivalent chromium plating bath. The method adds different particles in a basic electrolyte containing chromium chloride to prepare the chromium-based composite plating layer which has even surface and is firmly combined with a substrate by selecting appropriate process conditions. The method has the advantage that the thickness of the prepared chromium-based composite plating layer is more than 50mu m. The composite plating layer has the hardness higher than that of a hexavalent chrome Electroplating layer and the tribological property equivalent to that of the hexavalent chrome Electroplating layer, and can substitute the prior hexavalent chrome Electroplating Technology under various friction working conditions.
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method for electrodeposition of chromium phosphor alloy coating in environment protection type trivalent chromium plating bath
2009Co-Authors: Junyan Zhang, Zhixiang Zeng, Aimin LiangAbstract:The invention discloses a method for electrodepositing a chromium-phosphorus alloy plating layer in an environment-friendly trivalent chromium plating bath. The method, in an electrolyte containing chromium chloride, prepares the chromium-phosphorus alloy plating layer which has even surface, is firmly combined with a substrate, and has the corrosion resistance superior to that of a hexavalent chrome Electroplating layer by selecting an additive and controlling appropriate process conditions. The method has the advantages of steady process, wide operating conditions, and low energy consumption, and the dispersive capacity, the covering capacity and the current efficiency of the method are higher than those of hexavalent chrome Electroplating Technology. The method can partially substitute the prior hexavalent chrome Electroplating Technology which seriously pollutes the environment and endangers the health of human bodies.
Sikchol Kwon - One of the best experts on this subject based on the ideXlab platform.
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characterization of intermediate cr c layer fabricated by electrodeposition in hexavalent and trivalent chromium baths
Surface & Coatings Technology, 2004Co-Authors: Sikchol Kwon, Myounggyun Kim, S U Park, Dongyoung Kim, Dooin Kim, Keeseok Nam, Y ChoiAbstract:Abstract The effect of formic acid and current density on the crystal structure, surface morphology and crystallization of intermediate Cr-C layers deposited in both hexavalent and trivalent chromium baths were studied to observe chrome-carbide formation behavior and to develop an environmental protective Cr-C Electroplating Technology. Formic acid in hexavalent and trivalent chromium baths effectively produces intermediate Cr-C layers. The intermediate Cr-C layers has initially amorphous type microstructure. Crystallization of the intermediate Cr-C layer occurs at a current density above 27.5 A/dm 2 in a trivalent chromium bath and above 100 A/dm 2 in an hexavalent chromium bath, respectively. The carbon content of the intermediate Cr-C layer prepared in hexavalent chromium bath is twice as much as that of the layer prepared in trivalent chromium bath. Cr 23 C 6 and Cr 7 C 3 were observed in the intermediate Cr-C layer prepared in hexavalent chromium bath, whereas, Cr 23 C 6 was formed in the layer prepared in trivalent chromium bath after vacuum annealing at 800 °C.