The Experts below are selected from a list of 87063 Experts worldwide ranked by ideXlab platform
Peter Ryser - One of the best experts on this subject based on the ideXlab platform.
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ultra low pressure sensor for neonatal resuscitator
Sensors and Actuators A-physical, 2011Co-Authors: Caroline Jacq, Thomas Maeder, Enrico Haemmerle, Nicolas Craquelin, Peter RyserAbstract:A Venturi-type flow sensor has been designed and fabricated for neonatal respiratory assistance to control airway pressure and tidal volume. As the low flow range and sensing principle require the measurement of correspondingly very low pressures, a very responsive sensor, based on a polymer membrane acting onto a piezoresistive cantilever force sensor based on low-temperature co-fired ceramic (LTCC), was developed. This paper details the 3D modelling, manufacture, assembly and characterisation of the sensor. Compared to expensive and fragile MEMS-based devices, this sensor, based on LTCC, thick-Film Technology and polymer parts, provides an accurate and robust, yet low-cost alternative.
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thick Film multi dof force torque sensor for wrist rehabilitation
Sensors and Actuators A-physical, 2010Co-Authors: Caroline Jacq, B Luthi, Th Maeder, Olivier Lambercy, Roger Gassert, Peter RyserAbstract:Abstract A complete six degree of freedom (6 DOF) force/torque sensor has been designed and fabricated, adapted to wrist rehabilitation applications, with the focus laid on simple, straightforward manufacturing processes. This paper details the mechanical design, 3D modeling, manufacture and characterisation of the sensor. Compared to previous work [1] , this design has the advantage of simple, fully planar machining, and the load-sensing elements all lie on the same plane, making the device compatible with single-Film deposition or a foil bonding process. The sensor was machined from steel, and the piezoresistive load-sensing bridges were deposited using thick-Film Technology. We used commercial thick-Film materials in the work described here. A new lead-free materials system compatible with low processing temperatures (
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ultra low pressure sensor for neonatal resuscitator
Procedia Engineering, 2010Co-Authors: Caroline Jacq, Thomas Maeder, Enrico Haemmerle, Nicolas Craquelin, Peter RyserAbstract:A Venturi-type flow sensor has been designed and fabricated for neonatal respiratory assistance to control airway pressure and tidal volume. As the low flow range and sensing principle require the measurement of correspondingly very low pressures, a very responsive sensor, based on a polymer membrane acting onto a piezoresistive cantilever force sensor based on low-temperature co-fired ceramic (LTCC), was developed. This paper details the 3D modelling, manufacture, assembly and characterisation of the sensor. Compared to expensive and fragile MEMS-based devices, this sensor, based on LTCC, thick-Film Technology and polymer parts, provides an accurate and robust, yet low-cost alternative. Keywords: pressure sensor; Venturi flow sensor; LTCC; thick-Film Technology.
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Formulation of composite resistive pastes for micro-heater manufacturing
Procedia Chemistry, 2009Co-Authors: Nathalie Serra, Pierre Lemaire, Thomas Maeder, Peter RyserAbstract:We investigate in this work the formulation of composite resistive pastes based on epoxy resins and graphite for micro-heater manufacturing via thick-Film Technology. The resistive paste is first screen-printed onto a printed circuit board (PCB) substrate, and then coated with expandable polydimethylsiloxane (PDMS), a composite based on an elastomeric matrix and expandable microspheres, resulting into one-shot thermal actuators allowing pumping and sealing in microfluidic devices. The resistive paste must therefore have controlled properties, such as rheology, resistivity and temperature stability. This paper details the formulation and characterization of suitable epoxy-graphite resistive composites, and the control of their properties through additives.
M.a. Green - One of the best experts on this subject based on the ideXlab platform.
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consolidation of thin Film photovoltaic Technology the coming decade of opportunity
Progress in Photovoltaics, 2006Co-Authors: M.a. GreenAbstract:The previous decade, particularly its latter half, has been an exhilarating period for photovoltaics. Companies have entered a new era of profitability with photovoltaic company stocks now some of the most eagerly sought. The challenge for the next decade is for the industry to take advantage of the increased resources made available by the recent boom to position photovoltaics for an onslaught into wholesale electricity markets. It is argued that only the best of the thin-Film technologies are likely to be able to lead such a charge. Criteria for the success of thin-Film Technology in the long term are discussed. Copyright © 2006 John Wiley & Sons, Ltd.
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Third generation photovoltaics
2002 Conference on Optoelectronic and Microelectronic Materials and Devices. COMMAD 2002. Proceedings (Cat. No.02EX601), 2002Co-Authors: K.r. Catchpole, M.a. GreenAbstract:While the photovoltaics industry is currently dominated by silicon wafer-based "first generation" Technology, there is a clear move towards "second generation" thin-Film Technology. Second generation Technology has significant cost advantages over wafer-based modules, due to reduced materials usage and large-area processing. Even with second generation Technology, however, materials costs are likely to eventually dominate. To further reduce cost, a third-generation of high efficiency thin-Film Technology will be necessary, with energy conversion efficiencies double or triple the 15 to 20% presently targeted. Tandem cells are the best known example of such approaches, but a range of more integrated approaches is possible, as described in this paper.
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third generation photovoltaics ultra high conversion efficiency at low cost
Progress in Photovoltaics, 2001Co-Authors: M.a. GreenAbstract:Since the early days of terrestrial photovoltaics, a common perception has been that ‘first generation’ silicon wafer-based solar cells eventually would be replaced by a ‘second generation’ of lower cost thin-Film Technology, probably also involving a different semiconductor. Historically, cadmium sulphide, amorphous silicon, copper indium diselenide, cadmium telluride and now thin-Film polycrystalline silicon have been regarded as key thin-Film candidates. Any mature solar cell Technology seems likely to evolve to the stage where costs are dominated by those of the constituent materials, be they silicon wafers or glass sheet. It is argued, therefore, that photovoltaics is likely to evolve, in its most mature form, to a ‘third generation’ of high-efficiency thin-Film Technology. By high efficiency, what is meant is energy conversion values double or triple the 15–20% range presently targeted, closer to the thermodynamic limit of 93%. Tandem cells are the best known of such high-efficiency approaches, where efficiency can be increased merely by adding more cells of different bandgap to a cell stack, at the expense of increased complexity and spectral sensitivity. However, a range of other more ‘paralleled’ approaches offer similar efficiency to an infinite stack of tandem cells. These options are reviewed together with possible approaches for practical implementation, likely to become more feasible with the evolution of materials Technology over the next two decades. Copyright © 2001 John Wiley & Sons, Ltd.
Caroline Jacq - One of the best experts on this subject based on the ideXlab platform.
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ultra low pressure sensor for neonatal resuscitator
Sensors and Actuators A-physical, 2011Co-Authors: Caroline Jacq, Thomas Maeder, Enrico Haemmerle, Nicolas Craquelin, Peter RyserAbstract:A Venturi-type flow sensor has been designed and fabricated for neonatal respiratory assistance to control airway pressure and tidal volume. As the low flow range and sensing principle require the measurement of correspondingly very low pressures, a very responsive sensor, based on a polymer membrane acting onto a piezoresistive cantilever force sensor based on low-temperature co-fired ceramic (LTCC), was developed. This paper details the 3D modelling, manufacture, assembly and characterisation of the sensor. Compared to expensive and fragile MEMS-based devices, this sensor, based on LTCC, thick-Film Technology and polymer parts, provides an accurate and robust, yet low-cost alternative.
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thick Film multi dof force torque sensor for wrist rehabilitation
Sensors and Actuators A-physical, 2010Co-Authors: Caroline Jacq, B Luthi, Th Maeder, Olivier Lambercy, Roger Gassert, Peter RyserAbstract:Abstract A complete six degree of freedom (6 DOF) force/torque sensor has been designed and fabricated, adapted to wrist rehabilitation applications, with the focus laid on simple, straightforward manufacturing processes. This paper details the mechanical design, 3D modeling, manufacture and characterisation of the sensor. Compared to previous work [1] , this design has the advantage of simple, fully planar machining, and the load-sensing elements all lie on the same plane, making the device compatible with single-Film deposition or a foil bonding process. The sensor was machined from steel, and the piezoresistive load-sensing bridges were deposited using thick-Film Technology. We used commercial thick-Film materials in the work described here. A new lead-free materials system compatible with low processing temperatures (
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ultra low pressure sensor for neonatal resuscitator
Procedia Engineering, 2010Co-Authors: Caroline Jacq, Thomas Maeder, Enrico Haemmerle, Nicolas Craquelin, Peter RyserAbstract:A Venturi-type flow sensor has been designed and fabricated for neonatal respiratory assistance to control airway pressure and tidal volume. As the low flow range and sensing principle require the measurement of correspondingly very low pressures, a very responsive sensor, based on a polymer membrane acting onto a piezoresistive cantilever force sensor based on low-temperature co-fired ceramic (LTCC), was developed. This paper details the 3D modelling, manufacture, assembly and characterisation of the sensor. Compared to expensive and fragile MEMS-based devices, this sensor, based on LTCC, thick-Film Technology and polymer parts, provides an accurate and robust, yet low-cost alternative. Keywords: pressure sensor; Venturi flow sensor; LTCC; thick-Film Technology.
I D Robertson - One of the best experts on this subject based on the ideXlab platform.
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design and performance of a 60 ghz multi chip module receiver employing substrate integrated waveguides
Iet Microwaves Antennas & Propagation, 2007Co-Authors: Kartick K Samanta, D Stephens, I D RobertsonAbstract:The design, fabrication and performance of a 60-GHz multi-chip module receiver employing a substrate integrated waveguide filter and antenna are presented. The receiver is integrated onto a single multilayer substrate, fabricated using photoimageable thick-Film Technology. The module incorporates a GaAs monolithic microwave integrated circuit low-noise amplifier and downconverter, with lumped elements for intermediate frequency (IF) filtering embedded into the substrate. The chip cavities for mounting of the MMICs are photo-imaged as part of the standard process, giving precise dimensional control for short bond-wire lengths. The complete module including integrated antenna measures only 22.5 mm x 5.4 mm x 0.3 mm and works from 58 to 64 GHz.
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millimeter wave substrate integrated waveguides and filters in photoimageable thick Film Technology
IEEE Transactions on Microwave Theory and Techniques, 2005Co-Authors: D Stephens, Paul R Young, I D RobertsonAbstract:This paper presents the design and fabrication of substrate-integrated waveguides and filters for use at millimeter-wave frequencies. The components described are fabricated using photoimageable thick-Film materials. Measurements on V- and W-band waveguide-to-microstrip transitions are presented. Losses resulting from the reduced-height nature of the waveguides are extracted from thru-relect-line calibration standards illustrating the effect of current losses in the broadwalls of the waveguides. The design of fourth-order 0.01-dB ripple Chebyshev resonant cavity filters operating at V-, W-, D-, and G-band is presented. The measured results of all components are in excellent agreement with simulated predictions.
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microwave circuits in photoimageable thick Film Technology
IEE Seminar Microwave Thick Film Materials and Circuits, 2002Co-Authors: M S Aftanasar, I D Robertson, J MinalgieneAbstract:This paper demonstrates the feasibility of using thick-Film photoimageable materials for microwave applications as well as the potential of using this material system for developing cost-effective mm-wave wireless systems. A range of microwave circuits realised in photoimageable thick-Film Technology is presented. It is shown that the photoimageable material with its fine-line capability, low-loss property and multilayer capability can achieve comparable performance to that of the more expensive thin-Film Technology. This material system has been further investigated in the mm-wave region for the first time, with measurements to 220 GHz having been performed. (4 pages)
B E Mccandless - One of the best experts on this subject based on the ideXlab platform.
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cdte thin Film Technology leading thin Film pv into the future
Current Opinion in Solid State & Materials Science, 2010Co-Authors: R W Birkmire, B E MccandlessAbstract:Abstract CdTe is a near perfect material for PV application with a direct band gap of ∼1.5 eV that is closely matched to the terrestrial solar spectrum and a high optical absorption coefficient where less than 1 μm thickness is adequate to absorb the incident light. CdTe thin Film solar cell and module Technology has validated the economies of scale that were projected for thin Film PV technologies since the early 1980s where manufacturing costs are now below $0.84 with module efficiencies of 11.1%. Additionally, the low-temperature coefficient of CdTe modules results in a high annualized output. A critical issue for CdTe manufacturers is that there is not a clear pathway to increase the module performance to 15% or beyond based on current laboratory results and efficiency improvements will require fundamental improvements in the CdTe semiconductor properties and/or developing an alternative device structure.