The Experts below are selected from a list of 147 Experts worldwide ranked by ideXlab platform

David J Beebe - One of the best experts on this subject based on the ideXlab platform.

  • A silicon force sensor for robotics and medicine
    "Sensors and Actuators A: Physical", 1995
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide-based Package. The fabrication process is compatible with standard integrated circuit processes and produces a Flexible Package that sandwiches the metal leads between protective polyimide layers. Silicon direct bonding and bulk micromachining (both isotropic and anisotropic) are utilized to fabricate the silicon sensing element. The sensing element consists of a circular diaphragm (200 μm thick with a 200 μm radius) over a 10 μm deep sealed cavity. The shallow capacity depth provides built-in overforce protection. The diaphragm is instrumented with piezoresistors in a Wheatstone bridge configuration. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. The dome transmits the applied force to the diaphragm. Torlon and epoxy domes are bench tested. The epoxy dome produces significant hysteresis, while the Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (

  • a Flexible polyimide based Package for silicon sensors
    Sensors and Actuators A-physical, 1994
    Co-Authors: David J Beebe, Denice D Denton
    Abstract:

    Abstract This paper describes the development of a Flexible polyimide-based Package for silicon sensors. The fabrication process is compatible with standard integrated-circuit processes and produces a Flexible Package that sandwiches the metal leads between polyimide layers. Polyimide (DuPont PI-2611) is found to be resistant to the isotropic etchant (hydrofluoric acid/nitric acid) used to realize the sensing islands. Factors affecting Package reliability, which include lead layout, island size and support material at the silicon/polyimide interface, are identified and investigated. Packages are tested in an automated test setup and on human subjects. A factor of three increase in lead width produces a two-fold increase in reliability. The use of epoxy as a support material between the rigid silicon island and the Flexible polyimide produces a 50-fold increase in reliability on human subjects.

  • Silicon force sensor in a Flexible Package
    American Society of Mechanical Engineers Dynamic Systems and Control Division (Publication) DSC, 1994
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide Package. Silicon direct bonding and bulk micromachining are utilized to fabricate the silicon sensing element based on circular diaphragm structure. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. An epoxy dome produces significant hysteresis, while a Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (< 2.8% of the mean output). For all load cases, force accounts for at least 99.2% of the total variance. Output sensitivities of 1.4 mV/V/N are typical. The response is linear for low forces (< 10-N) and becomes curvilinear at higher forces when the diaphragm bottoms out. Details of the microfabrication and micromachining processes are presented along with characterization of the force sensor system. Preliminary finger-mounted results are presented.

Robert G Radwin - One of the best experts on this subject based on the ideXlab platform.

  • A silicon force sensor for robotics and medicine
    "Sensors and Actuators A: Physical", 1995
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide-based Package. The fabrication process is compatible with standard integrated circuit processes and produces a Flexible Package that sandwiches the metal leads between protective polyimide layers. Silicon direct bonding and bulk micromachining (both isotropic and anisotropic) are utilized to fabricate the silicon sensing element. The sensing element consists of a circular diaphragm (200 μm thick with a 200 μm radius) over a 10 μm deep sealed cavity. The shallow capacity depth provides built-in overforce protection. The diaphragm is instrumented with piezoresistors in a Wheatstone bridge configuration. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. The dome transmits the applied force to the diaphragm. Torlon and epoxy domes are bench tested. The epoxy dome produces significant hysteresis, while the Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (

  • Silicon force sensor in a Flexible Package
    American Society of Mechanical Engineers Dynamic Systems and Control Division (Publication) DSC, 1994
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide Package. Silicon direct bonding and bulk micromachining are utilized to fabricate the silicon sensing element based on circular diaphragm structure. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. An epoxy dome produces significant hysteresis, while a Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (< 2.8% of the mean output). For all load cases, force accounts for at least 99.2% of the total variance. Output sensitivities of 1.4 mV/V/N are typical. The response is linear for low forces (< 10-N) and becomes curvilinear at higher forces when the diaphragm bottoms out. Details of the microfabrication and micromachining processes are presented along with characterization of the force sensor system. Preliminary finger-mounted results are presented.

Arthur S. Hsieh - One of the best experts on this subject based on the ideXlab platform.

  • A silicon force sensor for robotics and medicine
    "Sensors and Actuators A: Physical", 1995
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide-based Package. The fabrication process is compatible with standard integrated circuit processes and produces a Flexible Package that sandwiches the metal leads between protective polyimide layers. Silicon direct bonding and bulk micromachining (both isotropic and anisotropic) are utilized to fabricate the silicon sensing element. The sensing element consists of a circular diaphragm (200 μm thick with a 200 μm radius) over a 10 μm deep sealed cavity. The shallow capacity depth provides built-in overforce protection. The diaphragm is instrumented with piezoresistors in a Wheatstone bridge configuration. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. The dome transmits the applied force to the diaphragm. Torlon and epoxy domes are bench tested. The epoxy dome produces significant hysteresis, while the Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (

  • Silicon force sensor in a Flexible Package
    American Society of Mechanical Engineers Dynamic Systems and Control Division (Publication) DSC, 1994
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide Package. Silicon direct bonding and bulk micromachining are utilized to fabricate the silicon sensing element based on circular diaphragm structure. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. An epoxy dome produces significant hysteresis, while a Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (< 2.8% of the mean output). For all load cases, force accounts for at least 99.2% of the total variance. Output sensitivities of 1.4 mV/V/N are typical. The response is linear for low forces (< 10-N) and becomes curvilinear at higher forces when the diaphragm bottoms out. Details of the microfabrication and micromachining processes are presented along with characterization of the force sensor system. Preliminary finger-mounted results are presented.

D.d. Denton - One of the best experts on this subject based on the ideXlab platform.

  • A silicon force sensor for robotics and medicine
    "Sensors and Actuators A: Physical", 1995
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide-based Package. The fabrication process is compatible with standard integrated circuit processes and produces a Flexible Package that sandwiches the metal leads between protective polyimide layers. Silicon direct bonding and bulk micromachining (both isotropic and anisotropic) are utilized to fabricate the silicon sensing element. The sensing element consists of a circular diaphragm (200 μm thick with a 200 μm radius) over a 10 μm deep sealed cavity. The shallow capacity depth provides built-in overforce protection. The diaphragm is instrumented with piezoresistors in a Wheatstone bridge configuration. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. The dome transmits the applied force to the diaphragm. Torlon and epoxy domes are bench tested. The epoxy dome produces significant hysteresis, while the Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (

  • Silicon force sensor in a Flexible Package
    American Society of Mechanical Engineers Dynamic Systems and Control Division (Publication) DSC, 1994
    Co-Authors: David J Beebe, Arthur S. Hsieh, D.d. Denton, Robert G Radwin
    Abstract:

    This paper describes the development of a silicon-based force sensor Packaged in a Flexible polyimide Package. Silicon direct bonding and bulk micromachining are utilized to fabricate the silicon sensing element based on circular diaphragm structure. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. An epoxy dome produces significant hysteresis, while a Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability (< 2.8% of the mean output). For all load cases, force accounts for at least 99.2% of the total variance. Output sensitivities of 1.4 mV/V/N are typical. The response is linear for low forces (< 10-N) and becomes curvilinear at higher forces when the diaphragm bottoms out. Details of the microfabrication and micromachining processes are presented along with characterization of the force sensor system. Preliminary finger-mounted results are presented.

Felix Escher - One of the best experts on this subject based on the ideXlab platform.

  • Aluminium foil as a food packaging material in comparison with other materials
    Food Reviews International, 2007
    Co-Authors: Manuela Lamberti, Felix Escher
    Abstract:

    Aluminium foil is an important material in laminates and has wide application in food packaging. Its barrier function against the migration of moisture, oxygen and other gases, and volatile aroma, as well as against the impact of light is generally higher than any plastic laminate material. Therefore, aluminium foil is used in the laminates when insufficient barrier properties are the limiting factor for shelf-life stability of food. The barrier properties of aluminium-coated plastic laminates, which can offer an alternative to aluminium foil laminates, are somewhat less efficient. The use of alumin-ium foil in rigid, semirigid, and Flexible Package for in-pack thermal processing allows the selection of Package geometries that ensure rapid heating and minimum heat dam-age during processing. On the tightness of Packages, the mechanical stability and quality of sealing is of particular importance. The chemical stability of aluminium foil in contact with food depends on the composition of the food items. With present toxico-logical knowledge, the use of aluminium in packaging material is considered to be safe, and inner-coating of the foil is recommended in specific cases.