The Experts below are selected from a list of 37551 Experts worldwide ranked by ideXlab platform

Yang Yang - One of the best experts on this subject based on the ideXlab platform.

  • A Broadband Near-Field UHF RFID Reader Antenna with Flexible Substrate Material
    2019 IEEE International Conference on Computational Electromagnetics (ICCEM), 2019
    Co-Authors: Xiangyu Qian, Ying Dong, Mingqian Jia, Yang Yang
    Abstract:

    A broadband near-field UHF RFID reader antenna with Flexible Substrate material is proposed in this paper. The proposed antenna exhibits a uniform magnetic field distribution in a large reading region and has a bandwidth from 820 to 960 MHz with Flexible Substrate material. Simulated results have shown a good performance of the antenna.

  • ink jet printing self assembled polyelectrolytes and electroless plating low cost fabrication of circuits on a Flexible Substrate at room temperature
    Macromolecular Rapid Communications, 2005
    Co-Authors: Kevin Cheng, Minghuan Yang, Wanda W W Chiu, Chiehyi Huang, Jane Chang, Taifa Ying, Yang Yang
    Abstract:

    The driving forces behind the development of Flexible electronics are their flexibility, lightweightedness, and potential for low-cost manufacturing. However, because of physical locations, traditional thermal processes cause deformations in the Flexible Substrate. As a result, the adhesion quality of the printed wires is deteriorated. This article reviews recent developments in printing circuits on a Flexible Substrate by combining self-assembled polyelectrolytes, ink-jet printing of a catalyst, and electroless plating of metals. The limitations and potential applications of this technology are also discussed. Experiments implementing this technology demonstrated significant results. By a vibration-induced assistance during an ink-jet printing catalyst process, line width and blurring can be controlled to within ′3% variation. Following the IPC 6013 standard for Flexible electronics, the results after thermal cycling (288 °C, 6 times) and a hot oil test (260 °C, 3 times) indicated that the metallic circuit had retained excellent adhesion properties and electric characteristics. We also report the first successful demonstration of a metal film in a via-hole inner wall on a Flexible Substrate. This novel fabrication method is ideal for the realization of large area, Flexible electronics and furore multilayer Flexible Substrate Application, such as Flexible display, chip on Flexible Substrate, etc. particularly where traditional lithographic processes can not be applied.

Duck Joo Yang - One of the best experts on this subject based on the ideXlab platform.

  • coating of carbon nanotubes on Flexible Substrate and its adhesion study
    Applied Surface Science, 2009
    Co-Authors: Abdelaziz Rahy, Pooja Ajaj, Inga H Musselma, Soon Hyung Hong, Duck Joo Yang
    Abstract:

    Abstract The primary goal of this project was to develop a Flexible transparent conductor with 100 Ω/sq and 90% transmittance in the wavelength range of 400–700 nm on a Flexible Substrate. The best result achieved so far was 110 Ω/sq at 88% transmittance using purified single-walled carbon nanotubes (SWNTs) coated on a polyethylene naphthalate (PEN) Substrate. The secondary goal was to simplify the overall coating procedure; we successfully reduced the process from five (prior art method) to three steps utilizing a sonication method. We also found that the use of metallic SWNTs significantly improved the conductivity and transmittance compared with the use of mixed SWNTs, i.e., unseparated SWNTs. Furthermore, a possible adhesion mechanism between SWNTs and the surface of PEN was studied; we concluded that a π–π stacking effect and a hydrophobic interaction are the major contributing factors for SWNTs to adhere to the surface of the Substrate.

Bahgat Sammakia - One of the best experts on this subject based on the ideXlab platform.

  • Bending Fatigue Study of Sputtered ITO on Flexible Substrate
    Journal of Display Technology, 2011
    Co-Authors: Khalid Alzoubi, Mohammad M. Hamasha, Bahgat Sammakia
    Abstract:

    Recently, there has been a tremendous rise in production of portable electronic devices. To produce Flexible devices, Flexible Substrates should replace conventional glass Substrates. Indium-tin-oxide (ITO) is the preferred transparent conducting layer used in the display technology. Although ITO has excellent sheet resistance and very good optical properties, ITO can crack at very low tensile strains which might cause failure in the conductive layer because of the unusual structure of a very thin film of brittle ceramic material applied to a polymer Substrate. Therefore, the mechanics of ITO on Flexible Substrates has been thoroughly considered in the design and manufacturing of Flexible devices. In a typical roll-to-roll manufacturing process, many challenges exist during the travel of the coated web over the rollers which produce bending stresses that might cause failure even if the stresses are below the yield strength of the material. Therefore, the high cycle bending fatigue of ITO thin films on Flexible Substrates is of a significant importance. In this work, high cycle bending fatigue experiments were conducted on ITO coated PET Substrate. The effect of bending diameter, bending frequency, and sample width on the change in electrical resistance was investigated. High magnification images were obtained to observe crack initiation and propagating in the ITO layer. The goal of this work is to establish a baseline for a comprehensive reliability study of ITO thin films on Flexible Substrate. It was found that bending diameters as well as the number of bending cycles have a great influence on the electrical conductivity of the ITO layer.

Zexiang Shen - One of the best experts on this subject based on the ideXlab platform.

  • raman mapping investigation of graphene on transparent Flexible Substrate the strain effect
    Journal of Physical Chemistry C, 2008
    Co-Authors: Yumeng You, Yingying Wang, Zexiang Shen
    Abstract:

    We report a Raman mapping investigation of strain effects on graphene on transparent and Flexible Substrate. Raman mappings reveal a significant red-shift of the 2D mode with introduction of tensile strain, distribution of local strain in the strained graphene, and immediate recovery after strain relaxation. The systematic fitting and statistical analysis quantify the tensile strain sensitivity of graphene, which is comparable to the single-walled carbon nanotubes (SWNTs) and implies the potential of graphene as an ultrasensitive strain sensor. The uniaxial strain will break the sublattice symmetry of graphene, hence changing its electronic band structures, for example, bandgap opening. This suggests the potential to desirably tune electronic band structures of graphene by controllably introducing strain.

  • Bendability of single-crystal Si MOSFETs investigated on Flexible Substrate
    IEEE Electron Device Letters, 2006
    Co-Authors: L.h. Guo, W.y. Loh, L.k. Bera, Q.x. Zhang, N. Hwang, E.b. Liao, K. W. Teoh, H. M. Chua, Zexiang Shen
    Abstract:

    This letter reports on a device layer transfer (based on thermal bonding and grinding backside Si) process and device characteristics of Si MOSFETs on a Flexible Substrate, focusing mainly on the mechanical bendability of the device and resistance to fatigue. The results demonstrated a well-optimized bonding process, as indicated by the nearly indiscernible performance difference (e.g., subthreshold slope, V/sub th/, and I/sub dsat/) before and after the bonding of Si with the Flexible Substrate. The device characteristics indicate excellent bendability of Si MOSFETs on Flexible Substrate (e.g., for radius tested down to /spl plusmn/72 mm) and good immunity to fatigue (e.g., negligible performance drift tested up to /spl sim/10/sup 3/ bending cycles with a radius of /spl plusmn/126 mm). Results suggest the feasibility of this approach in achieving high-performance MOSFETs for applications in performance-sensitive and Flexible electronics.

Hongrui Jiang - One of the best experts on this subject based on the ideXlab platform.

  • micro fresnel zone plate array on Flexible Substrate for large field of view and focus scanning
    Scientific Reports, 2015
    Co-Authors: Mohammad J. Moghimi, Jayer Fernandes, Aditi Kanhere, Hongrui Jiang
    Abstract:

    Field of view and accommodative focus are two fundamental attributes of many imaging systems, ranging from human eyes to microscopes. Here, we present arrays of Fresnel zone plates fabricated on a Flexible Substrate, which allows for the adjustment of both the field of view and optical focus. Such zone plates function as compact and lightweight microlenses and are fabricated using silicon nanowires. Inspired by compound eyes in nature, these microlenses are designed to point along various angles in order to capture images, offering an exceptionally wide field of view. Moreover, by flexing the Substrate, the lens position can be adjusted, thus achieving axial focus scanning. An array of microlenses on a Flexible Substrate was incorporated into an optical system to demonstrate high resolution imaging of objects located at different axial and angular positions. These silicon based microlenses could be integrated with electronics and have a wide range of potential applications, from medical imaging to surveillance.

  • Microscale Fresnel zone plate array on Flexible Substrate
    2015 Transducers - 2015 18th International Conference on Solid-State Sensors Actuators and Microsystems (TRANSDUCERS), 2015
    Co-Authors: Mohammad J. Moghimi, Jayer Fernandes, Aditi Kanhere, Hongrui Jiang
    Abstract:

    This paper describes microlens arrays implemented on a Flexible Substrate. For the first time, we have demonstrated binary Fresnel zone plates fabricated from silicon nanowires embedded in a PDMS matrix. Lens arrays on Flexible Substrates can potentially benefit from an increased field of view, which is important for applications such as microscopy and surveillance. Lens arrays have wide applications in 3D displays, LCD projectors, optical switches and tunable lasers. We report our design, fabrication and imaging demonstration for silicon based microlens arrays.