The Experts below are selected from a list of 36 Experts worldwide ranked by ideXlab platform
Jin Zhong - One of the best experts on this subject based on the ideXlab platform.
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design on a low noise acquisition circuit of infrared Focal Plane Device
Infrared Technology, 2010Co-Authors: Jin ZhongAbstract:the design methods on drive circuit and analog output digitization of 384×288 uncooled infrared Focal Plane UL03162 were presented,the impact of the bias voltage on the Focal Plane Device performance were discussed in theory and practice,the bias voltage generation programs were clarified,and methods of the timing control generation and selecting converter were described in brief.It provided the necessary conditions on working high-performance stably and reliably for Focal Plane.Through measuring using the test system,RMS noise is 312.4 μV,the superior performance of the Device had been performed.
Lei Peng - One of the best experts on this subject based on the ideXlab platform.
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Theoretical analysis of thermal-stress effect of HgCdTe infrared Focal Plane Device induced by 10.6 μm laser
Laser & Infrared, 2020Co-Authors: Lei PengAbstract:Muti-layer theoretical Model of HgCdTe Infrared Focal Plane Device was established.With the method of finite element analysis,temperature field and thermal-stress field induced by 10.6 μm laser were simulated.By considering experiments carried out in other papers as reference,the rationality and feasibility of the muti-layer model are proved.Results of theoretical analysis indicates that the temperature field changes greatly when irradiated by laser.With CW laser of 200 W/cm2 power density irradiating the sensor for 1 s,thermal-stress of HgCdTe photo-sensitive surface is-986MPa;With pulsed laser of 100 ns and 15 MW/cm2 irradiating the sensor,thermal-stress of HgCdTe photo-sensitive surface is-1300 MPa.The thermal-stress mentioned above are both beyond that caused by thermal-mismatch in the production process.Besides,the probability of thermal-stress damage increases and may happen before thermal damage,which should be an important factor in the research of laser damage to HgCdTe Infrared Focal Plane Device.
Shin-nosuke Ishikawa - One of the best experts on this subject based on the ideXlab platform.
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The soft x-ray photon-counting telescope for solar observations
Proceedings of SPIE, 2014Co-Authors: Taro Sakao, Noriyuki Narukage, Yoshinori Suematsu, Kyoko Watanabe, Masumi Shimojo, Shinsuke Imada, Shin-nosuke Ishikawa, Edward E. DelucaAbstract:We present overview and development activities of a soft X-ray photon-counting spectroscopic imager for the solar corona that we conceive as a possible scientific payload for future space solar missions including Japanese Solar-C. The soft X-ray imager will employ a Wolter I grazing-incidence sector mirror with which images of the corona (1 MK to beyond 10 MK) will be taken with the highest-ever angular resolution (0.5"/pixel for a Focal length of 4 m) as a solar Xray telescope. In addition to high-resolution imagery, we attempt to implement photon-counting capability for the imager by employing a backside-illuminated CMOS image sensor as the Focal-Plane Device. Imaging-spectroscopy of the X-ray corona will be performed for the first time in the energy range from ~0.5 keV up to 10 keV. The imaging-spectroscopic observations with the soft X-ray imager will provide a noble probe for investigating mechanism(s) of magnetic reconnection and generation of supra-thermal (non-thermal) electrons associated with flares. Ongoing development activities in Japan towards the photon-counting imager is described with emphasis on that for sub-arcsecond-resolution grazing-incidence mirrors.
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The soft x-ray photon-counting spectroscopic imager for the sun
Proceedings of SPIE, 2013Co-Authors: Taro Sakao, Noriyuki Narukage, Yoshinori Suematsu, Kyoko Watanabe, Masumi Shimojo, Shinsuke Imada, Shin-nosuke IshikawaAbstract:We present science and development activities of the soft X-ray photon-counting spectroscopic imager for the solar corona that we conceive as a possible scientific payload for the Japanese Solar-C mission. The imager employs a grazing-incidence sector mirror of Wolter-I type with which images of the corona are to be taken in a wide temperature range (1 MK to beyond 10 MK) with the highest-ever angular resolution (0.5"/pixel for a Focal length of 4 m) as an Xray telescope for the Sun. Moreover, by employing a back-thinned CMOS image sensor as the Focal-Plane Device, we attempmt to implement photon-counting capability with which imaging-spectroscopy of the X-ray corona will be performed for the first time, in the energy range from ~0.5 keV up to 10 keV. The imaging-spectroscopic observations will provide totally-new information on mechanism(s) for magnetic reconnection, generation of supra-thermal electrons in the reconnecting magnetic structure during flares, and for the generation of hot coronal plasmas (heated beyond a few MK) which may be responsible for the formation of the hot cores of solar active regions.
Taro Sakao - One of the best experts on this subject based on the ideXlab platform.
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The soft x-ray photon-counting telescope for solar observations
Proceedings of SPIE, 2014Co-Authors: Taro Sakao, Noriyuki Narukage, Yoshinori Suematsu, Kyoko Watanabe, Masumi Shimojo, Shinsuke Imada, Shin-nosuke Ishikawa, Edward E. DelucaAbstract:We present overview and development activities of a soft X-ray photon-counting spectroscopic imager for the solar corona that we conceive as a possible scientific payload for future space solar missions including Japanese Solar-C. The soft X-ray imager will employ a Wolter I grazing-incidence sector mirror with which images of the corona (1 MK to beyond 10 MK) will be taken with the highest-ever angular resolution (0.5"/pixel for a Focal length of 4 m) as a solar Xray telescope. In addition to high-resolution imagery, we attempt to implement photon-counting capability for the imager by employing a backside-illuminated CMOS image sensor as the Focal-Plane Device. Imaging-spectroscopy of the X-ray corona will be performed for the first time in the energy range from ~0.5 keV up to 10 keV. The imaging-spectroscopic observations with the soft X-ray imager will provide a noble probe for investigating mechanism(s) of magnetic reconnection and generation of supra-thermal (non-thermal) electrons associated with flares. Ongoing development activities in Japan towards the photon-counting imager is described with emphasis on that for sub-arcsecond-resolution grazing-incidence mirrors.
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The soft x-ray photon-counting spectroscopic imager for the sun
Proceedings of SPIE, 2013Co-Authors: Taro Sakao, Noriyuki Narukage, Yoshinori Suematsu, Kyoko Watanabe, Masumi Shimojo, Shinsuke Imada, Shin-nosuke IshikawaAbstract:We present science and development activities of the soft X-ray photon-counting spectroscopic imager for the solar corona that we conceive as a possible scientific payload for the Japanese Solar-C mission. The imager employs a grazing-incidence sector mirror of Wolter-I type with which images of the corona are to be taken in a wide temperature range (1 MK to beyond 10 MK) with the highest-ever angular resolution (0.5"/pixel for a Focal length of 4 m) as an Xray telescope for the Sun. Moreover, by employing a back-thinned CMOS image sensor as the Focal-Plane Device, we attempmt to implement photon-counting capability with which imaging-spectroscopy of the X-ray corona will be performed for the first time, in the energy range from ~0.5 keV up to 10 keV. The imaging-spectroscopic observations will provide totally-new information on mechanism(s) for magnetic reconnection, generation of supra-thermal electrons in the reconnecting magnetic structure during flares, and for the generation of hot coronal plasmas (heated beyond a few MK) which may be responsible for the formation of the hot cores of solar active regions.
X. Chen - One of the best experts on this subject based on the ideXlab platform.
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A FEA study on thermal stress of HgCdTe infrared Focal Plane arrays detector
Infrared Technology and Applications XLIV, 2018Co-Authors: Wenjing Zhang, Z. H. Ye, X. ChenAbstract:The infrared Focal Plane arrays detector is a multilayer structure which is mainly composed of detector chip, Si-ROIC, and fan out layer. In view of the different thermal expansion coefficients between the material layers, considerable thermal stress will be generated in this Device among the cooling cycle which could lead to physical breakdown of the chip under extreme circumstances. Models of finite element analysis (FEA) were established to explore the thermal stress of HgCdTe infrared Focal Plane Devices at low temperature. According to the characteristics of the expansion alloy, the two kinds of Focal Plane Device structures were simulated: one is that with invar layer below the Al2O3 piece, the other is that kovar layer between the Si-ROIC and Al2O3 pieces. Both of them can reduce the thermal stress effectively, and improve the reliability of IRFPAs detector.