The Experts below are selected from a list of 24 Experts worldwide ranked by ideXlab platform
Mary Ann B. Meador - One of the best experts on this subject based on the ideXlab platform.
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Addition curing thermosets endcapped with 4-amino (2. 2) paracyclophane
Journal of Polymer Science Part A, 1991Co-Authors: John F. Waters, James K. Sutter, Mary Ann B. Meador, Larry J. BaldwinAbstract:A new family of addition curing polyimides were prepared that contained 4-amino (2.2)-paracyclophane as the endcap. An improved synthesis of the endcap 4-amino-(2.2) cyclophane was accomplished increasing the yield to 60 percent and simplifying the procedure. DSC and rheological analysis of endcapped polyimide oligomers confirmed that the onset for polymerization of the ethylene bridge was 250 C. C-13 CP/MAS NMR was used to determine the structural changes of the oligomers after thermal treatment. The cyclophane capped polyimides were successfully compression molded to Form Void free neat resin specimens. Tg's as high as 353 C were obtained by thermomechanical analysis for postcured samples. Preliminary thermal stability studies suggest that these resins have a high onset of decomposition ranging from 549 to 567 C. 16 refs.
Hidekazu Yagi - One of the best experts on this subject based on the ideXlab platform.
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use of non conductive film ncf with nano sized filler particles for solder interconnect research and development on ncf material and process characterization
Electronic Components and Technology Conference, 2016Co-Authors: Tatsuo Nagamatsu, Keiji Honjo, Katsuyuki Ebisawa, Tomoyuki Ishimatsu, Takayuki Saito, Daichi Mori, Daisuke Motomura, Hidekazu YagiAbstract:As three-dimensional Through-Silicon Via (3D-TSV) packaging is emerging in the semiconductor market to integrate multiple functions in a system for further miniaturization, thermal compression bonding (TCB), which stacks multiple bare chips on top of each other with Cu pillar bumps with solder cap, has become an indispensable new packaging technology. The novel non-conductive film (NCF) described in this paper is an epoxy-type thermosetting material in film Form, with lower density of Nano-sized silica filler particles (average particle size is 100 Nano meters). Advantages of this NCF material with Nano-sized fillers include: transparency of the NCF material so that the TCB bonder's image recognition system can easily identify fiducial marks on the chip, ability of the Nano-filler to flow out with the NCF resin during thermal compression bonding, to mitigate filler entrapment between solder joints, which is critical to ensure reliable solder connections, compatibility with fine pitch applications with extremely narrow chip-to-chip and chip-to-substrate gaps to Form Void-free underfill. Instead of the previous processes of die attach, fluxing, traditional oven mass re-flow, flux cleaning, and capillary underfill (CUF), the current process involves the use of NCF & TCB. The NCF is applied on a wafer in a film Form by lamination, and then a wafer is diced with the pre-laminated NCF in pieces. Then they are joined by TCB, with typical parameters of 250°C for 10 seconds with 80N (solder cap on 15µm diameter Cu pillar, 40µm pitch, 1000 bumps). NCF heated by TCB is quickly liquidized to lower its viscosity after a few seconds. Other advantages of NCF is that it has a fluxing function included in the material, which eliminates the need for separate flux apply and flux clean steps, which simplifies process and costs. Also, NCF can control extrusion along the package's edge line since NCF is a half-cured B-stage material which has some mechanical rigidity during handling and lamination. Thus NCF Thermal Compression Flip Chip Bonding method is the vital solution to ensure good reliability with mass productivity for next generation's packaging. The characterization of NCF material and the importance of controlling viscosity and elastic modulus during thermal-compression will be analyzed and discussed in this paper. Process and reliability data on test vehicles will be shown.
Laura Letinsky - One of the best experts on this subject based on the ideXlab platform.
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untitled 47 from the series ill Form and Void full
Image ( if available) derived from original artwork owned by the McIninch Art Gallery Southern New Hampshire University., 2013Co-Authors: Laura LetinskyAbstract:Throughout her career, Laura Letinsky has engaged with the fundamental question of what precisely constitutes a photograph. Investigating photography’s relationship with reality, Letinsky began by photographing people but shifted to focusing almost exclusively on objects in the Form of the still life. Her large-scale, carefully crafted scenes often focus on the remnants of a meal or party, as she plays with ideas about perception and the transFormative qualities of the photograph. For one of her earlier, long-term series, Hardly More Than Ever (1997-2004), Letinsky arranged and photographed leftover food and used crockery, along with various objects such as vases or fruit bowls. Thinking of the photographs in this series as observations of overlooked or forgotten details and remnants of daily existence, Letinsky ultimately transForms this refuse into a subject worthy of close study - objects of real beauty. Her more recent series Ill Form & Void Full (2010-2014), explores the tension between material and image, as Letinsky extracts elements from already existing imagery in magazines of food and domestic wares, calling attention to the constructed nature of all photographs. Letinsky was born in 1962 in Winnipeg, Canada. She received her BFA from the University of Manitoba in 1986, and MFA from Yale University’s School of Art in 1991. Letinsky has held teaching positions at a number of prestigious American colleges, and since 1994 she has been a Professor in the Department of Visual Art at the University of Chicago. Further inFormation is available on the artist website.
Tatsuo Nagamatsu - One of the best experts on this subject based on the ideXlab platform.
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use of non conductive film ncf with nano sized filler particles for solder interconnect research and development on ncf material and process characterization
Electronic Components and Technology Conference, 2016Co-Authors: Tatsuo Nagamatsu, Keiji Honjo, Katsuyuki Ebisawa, Tomoyuki Ishimatsu, Takayuki Saito, Daichi Mori, Daisuke Motomura, Hidekazu YagiAbstract:As three-dimensional Through-Silicon Via (3D-TSV) packaging is emerging in the semiconductor market to integrate multiple functions in a system for further miniaturization, thermal compression bonding (TCB), which stacks multiple bare chips on top of each other with Cu pillar bumps with solder cap, has become an indispensable new packaging technology. The novel non-conductive film (NCF) described in this paper is an epoxy-type thermosetting material in film Form, with lower density of Nano-sized silica filler particles (average particle size is 100 Nano meters). Advantages of this NCF material with Nano-sized fillers include: transparency of the NCF material so that the TCB bonder's image recognition system can easily identify fiducial marks on the chip, ability of the Nano-filler to flow out with the NCF resin during thermal compression bonding, to mitigate filler entrapment between solder joints, which is critical to ensure reliable solder connections, compatibility with fine pitch applications with extremely narrow chip-to-chip and chip-to-substrate gaps to Form Void-free underfill. Instead of the previous processes of die attach, fluxing, traditional oven mass re-flow, flux cleaning, and capillary underfill (CUF), the current process involves the use of NCF & TCB. The NCF is applied on a wafer in a film Form by lamination, and then a wafer is diced with the pre-laminated NCF in pieces. Then they are joined by TCB, with typical parameters of 250°C for 10 seconds with 80N (solder cap on 15µm diameter Cu pillar, 40µm pitch, 1000 bumps). NCF heated by TCB is quickly liquidized to lower its viscosity after a few seconds. Other advantages of NCF is that it has a fluxing function included in the material, which eliminates the need for separate flux apply and flux clean steps, which simplifies process and costs. Also, NCF can control extrusion along the package's edge line since NCF is a half-cured B-stage material which has some mechanical rigidity during handling and lamination. Thus NCF Thermal Compression Flip Chip Bonding method is the vital solution to ensure good reliability with mass productivity for next generation's packaging. The characterization of NCF material and the importance of controlling viscosity and elastic modulus during thermal-compression will be analyzed and discussed in this paper. Process and reliability data on test vehicles will be shown.
Daisuke Motomura - One of the best experts on this subject based on the ideXlab platform.
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use of non conductive film ncf with nano sized filler particles for solder interconnect research and development on ncf material and process characterization
Electronic Components and Technology Conference, 2016Co-Authors: Tatsuo Nagamatsu, Keiji Honjo, Katsuyuki Ebisawa, Tomoyuki Ishimatsu, Takayuki Saito, Daichi Mori, Daisuke Motomura, Hidekazu YagiAbstract:As three-dimensional Through-Silicon Via (3D-TSV) packaging is emerging in the semiconductor market to integrate multiple functions in a system for further miniaturization, thermal compression bonding (TCB), which stacks multiple bare chips on top of each other with Cu pillar bumps with solder cap, has become an indispensable new packaging technology. The novel non-conductive film (NCF) described in this paper is an epoxy-type thermosetting material in film Form, with lower density of Nano-sized silica filler particles (average particle size is 100 Nano meters). Advantages of this NCF material with Nano-sized fillers include: transparency of the NCF material so that the TCB bonder's image recognition system can easily identify fiducial marks on the chip, ability of the Nano-filler to flow out with the NCF resin during thermal compression bonding, to mitigate filler entrapment between solder joints, which is critical to ensure reliable solder connections, compatibility with fine pitch applications with extremely narrow chip-to-chip and chip-to-substrate gaps to Form Void-free underfill. Instead of the previous processes of die attach, fluxing, traditional oven mass re-flow, flux cleaning, and capillary underfill (CUF), the current process involves the use of NCF & TCB. The NCF is applied on a wafer in a film Form by lamination, and then a wafer is diced with the pre-laminated NCF in pieces. Then they are joined by TCB, with typical parameters of 250°C for 10 seconds with 80N (solder cap on 15µm diameter Cu pillar, 40µm pitch, 1000 bumps). NCF heated by TCB is quickly liquidized to lower its viscosity after a few seconds. Other advantages of NCF is that it has a fluxing function included in the material, which eliminates the need for separate flux apply and flux clean steps, which simplifies process and costs. Also, NCF can control extrusion along the package's edge line since NCF is a half-cured B-stage material which has some mechanical rigidity during handling and lamination. Thus NCF Thermal Compression Flip Chip Bonding method is the vital solution to ensure good reliability with mass productivity for next generation's packaging. The characterization of NCF material and the importance of controlling viscosity and elastic modulus during thermal-compression will be analyzed and discussed in this paper. Process and reliability data on test vehicles will be shown.