The Experts below are selected from a list of 1536 Experts worldwide ranked by ideXlab platform
Anders Kristensen - One of the best experts on this subject based on the ideXlab platform.
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All-silica nanofluidic devices for DNA-analysis fabricated by imprint of sol–gel silica with silicon stamp
Lab Chip, 2012Co-Authors: Morten Bo Lindholm Mikkelsen, Alban Letailleur, Elin Sondergard, Etienne Barthel, Jérémie Teisseire, Rodolphe Marie, Anders KristensenAbstract:We present a simple and cheap method for fabrication of silica nanofluidic devices for single-molecule studies. By imprinting sol-gel materials with a multi-level stamp comprising micro- and nanofeatures, channels of different depth are produced in a single process step. Calcination of the imprinted hybrid sol-gel material produces purely inorganic silica, which has very low autofluorescence and can be fusion bonded to a Glass Lid. Compared to top-down processing of fused silica or silicon substrates, imprint of sol-gel silica enables fabrication of high-quality nanofluidic devices without expensive high-vacuum lithography and etching techniques. The applicability of the fabricated device for single-molecule studies is demonstrated by measuring the extension of DNA molecules of different lengths confined in the nanochannels.
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All-silica nanofluidic devices for DNA-analysis fabricated by imprint of sol-gel silica with silicon stamp
Lab on a Chip, 2012Co-Authors: Morten Bo Mikkelsen, Alban Letailleur, Elin Sondergard, Etienne Barthel, Jérémie Teisseire, Rodolphe Marie, Anders KristensenAbstract:We present a simple and cheap method for fabrication of silica nanofluidic devices for single-molecule studies. By imprinting sol-gel materials with a multi-level stamp comprising micro- and nanofeatures, channels of different depth are produced in a single process step. Calcination of the imprinted hybrid sol-gel material produces purely inorganic silica, which has very low autofluorescence and can be fusion bonded to a Glass Lid. Compared to top-down processing of fused silica or silicon substrates, imprint of sol-gel silica enables fabrication of high-quality nanofluidic devices without expensive high-vacuum lithography and etching techniques. The applicability of the fabricated device for single-molecule studies is demonstrated by measuring the extension of DNA molecules of different lengths confined in the nanochannels.
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A coupled cavity micro-fluidic dye ring laser
Microelectronic Engineering, 2005Co-Authors: Morten Gersborg-hansen, Søren Balslev, Niels Asger Mortensen, Anders KristensenAbstract:We present a laterally emitting, coupled cavity micro-fluidic dye ring laser, suitable for integration into lab-on-a-chip micro-systems. The micro-fluidic laser has been successfully designed, fabricated, characterized and modelled. The resonator is formed by a micro-fluidic channel bounded by two isosceles triangle mirrors. The micro-fluidic laser structure is defined using photo lithography in [email protected] thick SU-8 polymer on a Glass substrate. The micro-fluidic channel is sealed by a Glass Lid, using PMMA adhesive bonding. The laser is characterized using the laser dye Rhodamine 6G dissolved in ethanol or ethylene glycol as the active gain medium, which is pumped through the micro-fluidic channel and laser resonator. The dye laser is optically pumped normal to the chip plane at 532 nm by a pulsed, frequency doubled Nd:YAG laser and lasing is observed with a threshold pump pulse energy flux of around [email protected]/mm^2. The lasing is multi-mode, and the laser has switchable output coupling into an integrated polymer planar waveguide. Tuning of the lasing wavelength is feasible by changing the dye/solvent properties.
Goran Stemme - One of the best experts on this subject based on the ideXlab platform.
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Low-cost Glass-Lid packaging by adhesive full-wafer bonding with two-step etched electrical feedthroughs
2010Co-Authors: Joachim Oberhammer, Goran StemmeAbstract:Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. RF~MEMS switches are characterized by their high isolation, low insertion loss, large bandwidth and by their unparalleled signal linearity. They are relatively simple to control, are very small and have almost zero power consumption. Despite these benefits, RF~MEMS switches are not yet seen in commercial products because of reliability issues, limits in signal power handling and questions in packaging and integration. Also, the actuation voltages are typically too high for electronics applications and require additional drive circuitry. This thesis presents a novel MEMS switch concept based on an S-shaped film actuator, which consists of a thin and flexible membrane rolling between a top and a bottom electrode. The special design makes it possible to have high RF isolation due to the large contact distance in the off-state, while maintaining low operation voltages due to the zipper-like movement of the electrostatic dual-actuator. The switch comprises two separately fabricated parts which allows simple integration even with RF circuits incompatible with certain MEMS fabrication processes. The two parts are assembled by chip or wafer bonding which results in an encapsulated, ready-to-dice package. The thesis discusses the concept of the switch and reports on the successful fabrication and evaluation of prototype devices. Furthermore, this thesis presents research results in wafer-level packaging of (RF) MEMS devices by full-wafer bonding with an adhesive intermediate layer, which is structured before bonding to create defined cavities for housing MEMS devices. This technique has the advantage of simple, robust and low temperature fabrication, and is highly tolerant to surface non-uniformities and particles in the bonding interface. It allows cavities with a height of up to many tens of micrometers to be created directly in the bonding interface. In contrast to conventional wafer-level packaging methods with individual chip-capping, the encapsulation is done using a single wafer-bonding step. The thesis investigates the process parameters for patterned adhesive wafer bonding with benzocyclobutene, describes the fabrication of Glass Lid packages based on this technique, and introduces a method to create through-wafer electrical interconnections in Glass substrates by a two-step etch technique, involving powder-blasting and chemical etching. Also, it discusses a technique of improving the hermetic properties of adhesive bonded structures by additional passivation layers. Finally, it presents a method to substantially improve the bond strength of patterned adhesive bonding by using the soLid/liquid phase combination of a patterned polymer layer with a contact-printed thin adhesive film.
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BCB contact printing for patterned adhesive full-wafer bonded 0-level packages
Journal of Microelectromechanical Systems, 2005Co-Authors: Joachim Oberhammer, Goran StemmeAbstract:Adhesive wafer bonding with a patterned polymer layer is increasingly attracting attention as cheap and simple 0-level packaging technology for microstructures, because the patterned polymer both fulfills the bonding function and determines the volumes between the two wafers housing the devices to be packaged. To be able to pattern a polymer, it has to be cross-linked to a certain degree which makes the material rigid and less adhesive for the bonding afterward. In this paper, a simple method is presented which combines the advantages of a patterned adhesive layer with the advantages of a liquid polymer phase before the bonding. The pattern in the adhesive layer is "inked" with viscous polymer by pressing the substrate toward an auxiliary wafer with a thin liquid polymer layer. Then, the substrate with the inked pattern is finally bonded to the top wafer. Benzocyclobuene (BCB) was used both for the patterned structures and as the "ink". Tensile bond strength tests were carried out on patterned adhesive bonded samples fabricated with and without this contact printing method. The bonding yield is significantly improved with the contact printing method, the fabrication procedure is more robust and the test results show that the bond strength is at least 2 times higher. An investigation of the samples' failure mechanisms revealed that the bond strength even exceeds the adhesion forces of the BCB to the substrate. Furthermore, the BCB contact printing method was successfully applied for 0-level Glass-Lid packaging done by full-wafer bonding with a patterned adhesive layer. Here, the encapsulating Lids are separated after the bonding by dicing the top wafer independently of the bottom wafer.
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Contact printing for improved bond-strength of patterned adhesive full-wafer bonded 0-level packages
17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest, 2004Co-Authors: Joachim Oberhammer, Goran StemmeAbstract:This paper reports on a novel technology using Benzocyclobutene (BCB) contact printing to significantly improve the bond strength of a full-wafer adhesive bond with patterned BCB structures. The BCB pattern on the first wafer acts as a stamp which is 'inked' by an auxiliary wafer containing a thin layer of uncured BCB. The wafer with the 'inked' stamp is then bonded to the second wafer. Tensile strength test are carried out on patterned adhesive bonded samples with and without the contact printing method. The tests show that the contact printing technique makes the bond strength of patterned BCB stronger by a factor of at least 2.3, and the bond strength even exceeds the adhesion forces of the BCB spun onto the substrate. Furthermore, this paper presents a way of how this technique is used for 0-level Glass-Lid packaging by full-wafer adhesive bonding. Here, the encapsulating Lids are separated after the bonding by dicing the top wafer independently of the bottom wafer.
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A low-pressure encapsulated deep reactive ion etched resonant pressure sensor electrically excited and detected using `burst' technology
Journal of Micromechanics and Microengineering, 2000Co-Authors: Jessica Melin, Peter Enoksson, Thierry Corman, Goran StemmeAbstract:A purely silicon resonant pressure sensor fabricated using deep reactive ion etching (DRIE) and encapsulated at low pressure by two Glass Lids is presented. The sensor consists of a vibrating dual-diaphragm capsule suspended at four points in a fixed frame. The support beams are hollow and act as pressure inlet ports. As the ambient gas pressure changes, the resonator shape changes, thereby changing its resonance frequency. The sensor integrates corner holes and is encapsulated at low pressure to reduce squeezed-film damping effects between the resonating structure and the Glass Lid. The sensor is electrostatically excited into a balanced mode of oscillation and capacitively detected using a novel `burst' technology. This technique is based on independently exciting the structure and detecting the resulting output frequency at separate periods in time. Several sizes and design variations of the sensor have been fabricated and evaluated. Measurements show the smallest structure (5 mm membrane diameter width) to have a Q factor of 14 000 after low-pressure encapsulation, pressure sensitivity of 15 ppm/mbar-1 over the range 0.1-1500 mbar, and expected temperature sensitivity of -34 ppm °C-1. The structure had a resonance frequency of 35 078 Hz in atmospheric air pressure. If higher sensitivity is desired, a larger sensor can be chosen (140 ppm/mbar-1 for a sensor with a 10 mm wide membrane), however, at the expense of a lower Q factor.
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A low-pressure encapsulated resonant fluid density sensor with feedback control electronics
Measurement Science and Technology, 2000Co-Authors: Thierry Corman, Peter Enoksson, Kjell Norén, Goran StemmeAbstract:In this paper we present a fully low-pressure encapsulated and closed-loop operated resonant fluid density sensor. The device consists of a tube in silicon, which is vibrating in a selected balanced torsion mode. The resonance frequency changes with the density of the fluid in the tube due to the change of the inertial mass of the vibrating system. The sensor is fabricated and encapsulated at wafer level using silicon micromachining techniques. The encapsulation is performed by anodically bonding the silicon densitometer in vacuum between two Glass Lids with metal electrodes for electrostatic excitation and capacitive detection. The sample volume is only 0.035 ml and the size of the encapsulated device is 14 mm × 23 mm × 1.85 mm. The measurements were performed using a novel excitation and detection technique based on discontinuous, `burst' excitation. This principle enabled us to eliminate the electrical crosstalk between excitation and detection. The electrodes could be placed on top of the Glass Lids without using electrical feedthroughs, and a cavity gap of 100 µm could be formed between the recessed Glass Lid surface and the silicon tube to reduce squeeze-film damping. The closed-loop `burst' technology enabled us to make continuous measurements of fluid densities. The sensor showed high density sensitivities of the order of -200 ppm (kg m-3 )-1 , a high mechanical Q -factor of 3400 for air in the tube and low temperature sensitivities of -29 ppm °C-1 in the range 20-100 °C.
Morten Bo Mikkelsen - One of the best experts on this subject based on the ideXlab platform.
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All-silica nanofluidic devices for DNA-analysis fabricated by imprint of sol-gel silica with silicon stamp
Lab on a Chip, 2012Co-Authors: Morten Bo Mikkelsen, Alban Letailleur, Elin Sondergard, Etienne Barthel, Jérémie Teisseire, Rodolphe Marie, Anders KristensenAbstract:We present a simple and cheap method for fabrication of silica nanofluidic devices for single-molecule studies. By imprinting sol-gel materials with a multi-level stamp comprising micro- and nanofeatures, channels of different depth are produced in a single process step. Calcination of the imprinted hybrid sol-gel material produces purely inorganic silica, which has very low autofluorescence and can be fusion bonded to a Glass Lid. Compared to top-down processing of fused silica or silicon substrates, imprint of sol-gel silica enables fabrication of high-quality nanofluidic devices without expensive high-vacuum lithography and etching techniques. The applicability of the fabricated device for single-molecule studies is demonstrated by measuring the extension of DNA molecules of different lengths confined in the nanochannels.
Alban Letailleur - One of the best experts on this subject based on the ideXlab platform.
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All-silica nanofluidic devices for DNA-analysis fabricated by imprint of sol–gel silica with silicon stamp
Lab Chip, 2012Co-Authors: Morten Bo Lindholm Mikkelsen, Alban Letailleur, Elin Sondergard, Etienne Barthel, Jérémie Teisseire, Rodolphe Marie, Anders KristensenAbstract:We present a simple and cheap method for fabrication of silica nanofluidic devices for single-molecule studies. By imprinting sol-gel materials with a multi-level stamp comprising micro- and nanofeatures, channels of different depth are produced in a single process step. Calcination of the imprinted hybrid sol-gel material produces purely inorganic silica, which has very low autofluorescence and can be fusion bonded to a Glass Lid. Compared to top-down processing of fused silica or silicon substrates, imprint of sol-gel silica enables fabrication of high-quality nanofluidic devices without expensive high-vacuum lithography and etching techniques. The applicability of the fabricated device for single-molecule studies is demonstrated by measuring the extension of DNA molecules of different lengths confined in the nanochannels.
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All-silica nanofluidic devices for DNA-analysis fabricated by imprint of sol-gel silica with silicon stamp
Lab on a Chip, 2012Co-Authors: Morten Bo Mikkelsen, Alban Letailleur, Elin Sondergard, Etienne Barthel, Jérémie Teisseire, Rodolphe Marie, Anders KristensenAbstract:We present a simple and cheap method for fabrication of silica nanofluidic devices for single-molecule studies. By imprinting sol-gel materials with a multi-level stamp comprising micro- and nanofeatures, channels of different depth are produced in a single process step. Calcination of the imprinted hybrid sol-gel material produces purely inorganic silica, which has very low autofluorescence and can be fusion bonded to a Glass Lid. Compared to top-down processing of fused silica or silicon substrates, imprint of sol-gel silica enables fabrication of high-quality nanofluidic devices without expensive high-vacuum lithography and etching techniques. The applicability of the fabricated device for single-molecule studies is demonstrated by measuring the extension of DNA molecules of different lengths confined in the nanochannels.
Elin Sondergard - One of the best experts on this subject based on the ideXlab platform.
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All-silica nanofluidic devices for DNA-analysis fabricated by imprint of sol–gel silica with silicon stamp
Lab Chip, 2012Co-Authors: Morten Bo Lindholm Mikkelsen, Alban Letailleur, Elin Sondergard, Etienne Barthel, Jérémie Teisseire, Rodolphe Marie, Anders KristensenAbstract:We present a simple and cheap method for fabrication of silica nanofluidic devices for single-molecule studies. By imprinting sol-gel materials with a multi-level stamp comprising micro- and nanofeatures, channels of different depth are produced in a single process step. Calcination of the imprinted hybrid sol-gel material produces purely inorganic silica, which has very low autofluorescence and can be fusion bonded to a Glass Lid. Compared to top-down processing of fused silica or silicon substrates, imprint of sol-gel silica enables fabrication of high-quality nanofluidic devices without expensive high-vacuum lithography and etching techniques. The applicability of the fabricated device for single-molecule studies is demonstrated by measuring the extension of DNA molecules of different lengths confined in the nanochannels.
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All-silica nanofluidic devices for DNA-analysis fabricated by imprint of sol-gel silica with silicon stamp
Lab on a Chip, 2012Co-Authors: Morten Bo Mikkelsen, Alban Letailleur, Elin Sondergard, Etienne Barthel, Jérémie Teisseire, Rodolphe Marie, Anders KristensenAbstract:We present a simple and cheap method for fabrication of silica nanofluidic devices for single-molecule studies. By imprinting sol-gel materials with a multi-level stamp comprising micro- and nanofeatures, channels of different depth are produced in a single process step. Calcination of the imprinted hybrid sol-gel material produces purely inorganic silica, which has very low autofluorescence and can be fusion bonded to a Glass Lid. Compared to top-down processing of fused silica or silicon substrates, imprint of sol-gel silica enables fabrication of high-quality nanofluidic devices without expensive high-vacuum lithography and etching techniques. The applicability of the fabricated device for single-molecule studies is demonstrated by measuring the extension of DNA molecules of different lengths confined in the nanochannels.