The Experts below are selected from a list of 4053 Experts worldwide ranked by ideXlab platform
Pei Chen - One of the best experts on this subject based on the ideXlab platform.
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In-process measurement of the Grinding Force in silicon wafer self-rotating Grinding process
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020Co-Authors: Lixiang Zhang, Pei Chen, Tong An, Zhongbo Yi, Haiming WangAbstract:Silicon wafer thinning is mostly performed by self-rotating Grinding process. In Grinding, the Grinding Force is a crucial factor of affecting the machining accuracy and surface/subsurface quality. In this paper, a novel apparatus and method are developed to measure the Grinding Force in silicon wafer self-rotating Grinding process. Four thin film Force sensors are equidistantly embedded beneath the silicon wafer along radial direction and the measured signal is transmitted wirelessly through WiFi protocol. Based on the proposed method, the normal Grinding Force and its distribution along wafer radial are obtained. The test data indicates that the proposed approach is effective to measure the Grinding Force with high reliability, high precision and low cost.
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a predictive model of Grinding Force in silicon wafer self rotating Grinding
International Journal of Machine Tools & Manufacture, 2016Co-Authors: Jinglong Sun, Fei Qin, Pei ChenAbstract:Abstract Silicon wafer thinning is mostly performed by the method of self-rotating Grinding. In Grinding, the Grinding Force is a crucial factor of affecting the Grinding performance, form accuracy and surface/subsurface thinning quality. To control the thinning quality of ground wafer, Grinding Force is the most essential factor need to be controlled. However, no theoretical model is developed to correlate Grinding parameters to Grinding Force yet. In this article, a theoretical model is established based on the removal behavior of silicon, including cutting and sliding. For the first time, the effects of processing parameters, wafer radial distance and crystal orientation on Grinding Force are quantitatively described in a theoretical model. Excess Grinding Force causes local damage of wafer in the form of subsurface cracks, as a determinant factor on the quality of wafer. Therefore, nine sets of self-rotating Grinding experiments with variable processing parameters are performed, and the depth of subsurface cracks h are measured to evaluate the damage of ground wafer. Based on the scratching theory of single abrasive grain, the relationship between h and the normal Grinding Force Fnt is found, which is also validated by the experimental results. Finally, an optimized two-stage process is proposed to control subsurface cracks and improve material removal rate simultaneously, according to the predictive model of Grinding Force.
Chenbing Ni - One of the best experts on this subject based on the ideXlab platform.
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the Grinding Force modeling and experimental study of zro2 ceramic materials in ultrasonic vibration assisted Grinding
Ceramics International, 2019Co-Authors: Zhichao Yang, Guixiang Zhang, Chenbing NiAbstract:Abstract As an advanced structural ceramic, zirconia ceramics are gradually used in the fields of manufacturing, aerospace and other fields with their excellent properties. However, the mechanism of material removal is complex for zirconia ceramics but it is generally accepted that the brittle-and-hard material is removed by plastic removal and brittle removal. In this paper, ultrasonic vibration assisted Grinding is used as non-traditional processing to machine the ceramic materials. Firstly, a single abrasive grain scratch test was first carried out on the ZrO2 ceramic materials. It can be obtained through experimental analysis that the removal mode of the zirconia ceramic material is changed with the increase of load. When the applied load is greater than 500 mN, the zirconia ceramic materials are removed by brittle removal. Then, based on analysis of scratch test and kinematics of ultrasonic vibration assisted Grinding (UVAG), a Grinding Force prediction model is developed and the validity of the model is verified by the experiment designed. It can be found that the Grinding Force is decreased with the increase of spindle speed (n) and amplitude (Aa). And the Grinding Force is increased with the increase of feed rate (vf) and Grinding depth (ap). In addition, compared with the Grinding Force of the common Grinding (CG), the Grinding Force is significantly reduced in the UVAG. And the surface quality of the workpiece is improved and the wear of the Grinding head is reduced in the UVAG by the analysis of experiment.
Xiaoshuang Rao - One of the best experts on this subject based on the ideXlab platform.
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Material removal mechanism and Grinding Force modelling of ultrasonic vibration assisted Grinding for SiC ceramics
Ceramics International, 2017Co-Authors: Chen Li, Binbin Meng, Lifei Liu, Feihu Zhang, Xiaoshuang RaoAbstract:In this paper, a varied-depth nano-scratch test of single grain is carried out on a nano indentation system. The critical depth of the elastic-plastic transition for SiC ceramics is 7.27 nm, as calculated by Hertz contact theory, and the critical depth of the brittle-to-ductile transition is 76.304 nm, as measured by AFM and SEM. Based on the varied-depth nano scratch test and the grain trajectory of ultrasonic vibration assisted Grinding (UVAG), a theoretical model of the normal Grinding Force is acquired using the material removal in unit time as a bridge. The single factor experiment illustrates that the Grinding Force increases with the increase of the Grinding depth, feed rate, and amplitude, while it decreases with the increase of the spindle speed. The contrast experiment results show that UVAG is beneficial for improving the surface quality and reducing the subsurface damage depth compared with common Grinding (CG). A four-level and four-factor orthogonal experiment is designed, on the basis of which theoretical model of the normal Grinding Force for SiC ceramics is obtained using genetic algorithm. The tangential Grinding Force is obtained from the normal Grinding Force using the least square method. The experimental results show that the theoretical model is reliable.
Zhichao Yang - One of the best experts on this subject based on the ideXlab platform.
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the Grinding Force modeling and experimental study of zro2 ceramic materials in ultrasonic vibration assisted Grinding
Ceramics International, 2019Co-Authors: Zhichao Yang, Guixiang Zhang, Chenbing NiAbstract:Abstract As an advanced structural ceramic, zirconia ceramics are gradually used in the fields of manufacturing, aerospace and other fields with their excellent properties. However, the mechanism of material removal is complex for zirconia ceramics but it is generally accepted that the brittle-and-hard material is removed by plastic removal and brittle removal. In this paper, ultrasonic vibration assisted Grinding is used as non-traditional processing to machine the ceramic materials. Firstly, a single abrasive grain scratch test was first carried out on the ZrO2 ceramic materials. It can be obtained through experimental analysis that the removal mode of the zirconia ceramic material is changed with the increase of load. When the applied load is greater than 500 mN, the zirconia ceramic materials are removed by brittle removal. Then, based on analysis of scratch test and kinematics of ultrasonic vibration assisted Grinding (UVAG), a Grinding Force prediction model is developed and the validity of the model is verified by the experiment designed. It can be found that the Grinding Force is decreased with the increase of spindle speed (n) and amplitude (Aa). And the Grinding Force is increased with the increase of feed rate (vf) and Grinding depth (ap). In addition, compared with the Grinding Force of the common Grinding (CG), the Grinding Force is significantly reduced in the UVAG. And the surface quality of the workpiece is improved and the wear of the Grinding head is reduced in the UVAG by the analysis of experiment.
Feihu Zhang - One of the best experts on this subject based on the ideXlab platform.
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A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input
Micromachines, 2018Co-Authors: Feihu Zhang, Xichun Luo, Xiaoguang Guo, Yukui Cai, Wenlong Chang, Jining SunAbstract:The ability to predict the Grinding Force for hard and brittle materials is important to optimize and control the Grinding process. However, it is a difficult task to establish a comprehensive Grinding Force model that takes into account the brittle fracture, Grinding conditions, and random distribution of the Grinding wheel topography. Therefore, this study developed a new Grinding Force model for micro-Grinding of reaction-bonded silicon carbide (RB-SiC) ceramics. First, the Grinding Force components and Grinding trajectory were analysed based on the critical depth of rubbing, ploughing, and brittle fracture. Afterwards, the corresponding individual grain Force were established and the total Grinding Force was derived through incorporating the single grain Force with dynamic cutting grains. Finally, a series of calibration and validation experiments were conducted to obtain the empirical coefficient and verify the accuracy of the model. It was found that ploughing and fracture were the dominate removal modes, which illustrate that the Force components decomposed are correct. Furthermore, the values predicted according to the proposed model are consistent with the experimental data, with the average deviation of 6.793% and 8.926% for the normal and tangential Force, respectively. This suggests that the proposed model is acceptable and can be used to simulate the Grinding Force for RB-SiC ceramics in practice.
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Material removal mechanism and Grinding Force modelling of ultrasonic vibration assisted Grinding for SiC ceramics
Ceramics International, 2017Co-Authors: Chen Li, Binbin Meng, Lifei Liu, Feihu Zhang, Xiaoshuang RaoAbstract:In this paper, a varied-depth nano-scratch test of single grain is carried out on a nano indentation system. The critical depth of the elastic-plastic transition for SiC ceramics is 7.27 nm, as calculated by Hertz contact theory, and the critical depth of the brittle-to-ductile transition is 76.304 nm, as measured by AFM and SEM. Based on the varied-depth nano scratch test and the grain trajectory of ultrasonic vibration assisted Grinding (UVAG), a theoretical model of the normal Grinding Force is acquired using the material removal in unit time as a bridge. The single factor experiment illustrates that the Grinding Force increases with the increase of the Grinding depth, feed rate, and amplitude, while it decreases with the increase of the spindle speed. The contrast experiment results show that UVAG is beneficial for improving the surface quality and reducing the subsurface damage depth compared with common Grinding (CG). A four-level and four-factor orthogonal experiment is designed, on the basis of which theoretical model of the normal Grinding Force for SiC ceramics is obtained using genetic algorithm. The tangential Grinding Force is obtained from the normal Grinding Force using the least square method. The experimental results show that the theoretical model is reliable.
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Grinding Force model of single abrasive grain based on variable friction coefficient
Fourth International Seminar on Modern Cutting and Measurement Engineering, 2010Co-Authors: Ji-cai Kuai, Hua-li Zhang, Feihu ZhangAbstract:Combined with the Grinding principle, it is put forward that friction coefficient changes with the change of Grinding parameter; and the Grinding Force model of single abrasive grain is developed based on friction coefficients of different Grinding conditions. Following the theory of variable friction coefficient, the Grinding Force model of single abrasive grain is theoretically and experimentally researched. The research indicates that this model fully reflects the effects of Grinding parameter, abrasive grains' distribution, material properties, variable friction coefficient, and etc. on Grinding Force of single abrasive grain, which ensure an accurately simulation of actual Grinding situation. By using this model, it is predicted that Grinding Force of single abrasive grain in normal direction has an accuracy of about 18~36.84%; however when taking the variable friction coefficient into consideration, prediction of tangential Grinding Force of single abrasive grain has an accuracy of about 10~20% by using this model. Experiment proves that this study offered a new Grinding Force model of single abrasive grain with variable friction coefficient, which has a practical value.
