The Experts below are selected from a list of 93960 Experts worldwide ranked by ideXlab platform
K Lu - One of the best experts on this subject based on the ideXlab platform.
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a High strength and High Electrical Conductivity bulk cu ag alloy strengthened with nanotwins
Scripta Materialia, 2017Co-Authors: Bin Zhang, K LuAbstract:Abstract A bulk solid solution Cu-5Ag alloy consisting of nanotwins and nanograins was prepared by means of dynamic plastic deformation at liquid nitrogen temperature. Continuous precipitation of Ag occurs in the nanotwins which exhibit Higher thermal stability than the nano-grains upon annealing. A tensile strength of 870 MPa and an Electrical Conductivity of 78% International Annealed Copper Standard are achieved in the annealed nanostructure Cu-5Ag alloy which is strengthened with nanotwins and nanoscale precipitates.
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a High strength and High Electrical Conductivity bulk cucrzr alloy with nanotwins
Scripta Materialia, 2015Co-Authors: K LuAbstract:A bulk nanostructured CuCrZr alloy consisting of nanotwins and nanograins was prepared by dynamic plastic deformation at liquid nitrogen temperature. A tensile strength of 700 MPa and an Electrical Conductivity of 78.5% International Annealed Copper Standard are obtained in the nanostructured CuCrZr alloys processed by means of this one-step deformation without aging treatment. The reason for the increased strength without the sacrifice of its High Electrical Conductivity was discussed.
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UltraHigh strength and High Electrical Conductivity in copper.
Science (New York N.Y.), 2004Co-Authors: Lei Lu, Lihua Qian, Xianhua Chen, Yongfeng Shen, K LuAbstract:Methods used to strengthen metals generally also cause a pronounced decrease in Electrical Conductivity, so that a tradeoff must be made between Conductivity and mechanical strength. We synthesized pure copper samples with a High density of nanoscale growth twins. They showed a tensile strength about 10 times Higher than that of conventional coarse-grained copper, while retaining an Electrical Conductivity comparable to that of pure copper. The ultraHigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low Electrical resistivity, which is not the case for other types of grain boundaries.
Kaoru Toko - One of the best experts on this subject based on the ideXlab platform.
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High Electrical Conductivity multilayer graphene formed by layer exchange with controlled thickness and interlayer
Scientific Reports, 2019Co-Authors: Hiromasa Murata, Takashi Suemasu, Kaoru Toko, Yoshiki Nakajima, N Saitoh, Noriko YoshizawaAbstract:The layer exchange technique enables High-quality multilayer graphene (MLG) on arbitrary substrates, which is a key to combining advanced electronic devices with carbon materials. We synthesize uniform MLG layers of various thicknesses, t, ranging from 5 nm to 200 nm using Ni-induced layer exchange at 800 °C. Raman and transmission electron microscopy studies show the crystal quality of MLG is relatively low for t ≤ 20 nm and dramatically improves for t ≥ 50 nm when we prepare a diffusion controlling Al2O3 interlayer between the C and Ni layers. Hall effect measurements reveal the carrier mobility for t = 50 nm is 550 cm2/Vs, which is the Highest Hall mobility in MLG directly formed on an insulator. The Electrical Conductivity (2700 S/cm) also exceeds a Highly oriented pyrolytic graphite synthesized at 3000 °C or Higher. Synthesis technology of MLG with a wide range of thicknesses will enable exploration of extensive device applications of carbon materials.
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High-Electrical-Conductivity Multilayer Graphene Formed by Layer Exchange with Controlled Thickness and Interlayer
'Springer Science and Business Media LLC', 2019Co-Authors: 末益 崇, 都甲 薫, Takashi Suemasu, Kaoru TokoAbstract:Global fallout plutonium isotopic ratios from the 1960s are important for the use of Pu as environmental tracers. We measured the 240Pu/239Pu and 242Pu/239Pu atomic ratios of monthly atmospheric deposition samples collected in Tokyo and Akita, Japan during March 1963 to May 1966. To our knowledge,our results represent the first data measured for actual atmospheric deposition samples collected continuously during the 1960s. Both atomic ratios increased rapidly from March 1963 to June 1963, followed by a gradual increase until September 1963. Then, both ratios declined with a half-life of approximately 5.6 months. The observed temporal changes of the ratios were likely caused by the upper-stratospheric input of nuclear debris from High-yield atmospheric nuclear weapon testing during1961–62, followed by its downward transport to the troposphere
Dengshan Zhou - One of the best experts on this subject based on the ideXlab platform.
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bulk cu nbc nanocomposites with High strength and High Electrical Conductivity
Journal of Alloys and Compounds, 2018Co-Authors: Dengshan Zhou, Wei Zeng, Deliang Zhang, Jingwen Xie, Enrique J LaverniaAbstract:Abstract We report on a study aimed at simultaneously achieving High strength, High Electrical Conductivity and High thermal stability in bulk nanocrystalline (NC) Cu-NbC nanocomposites. We describe an approach that involves adding NbC nanoparticles (∼7 nm) into a nanocrystalline Cu matrix (∼96 nm) via in-situ formation during sintering of High energy mechanically milled powder into a compact. Our results show that the presence of thermally stable NbC nanoparticles in the bulk NC Cu-NbC nanocomposite contributes to a High tensile strength (868 MPa) in combination with a thermally stable nanocrystalline Cu matrix, and a High Electrical Conductivity of ∼56% IACS (International Annealed Copper Standard).
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a feasible ultrafine grained cu matrix composite microstructure for achieving High strength and High Electrical Conductivity
Journal of Alloys and Compounds, 2016Co-Authors: Dengshan Zhou, Wei Zeng, Deliang ZhangAbstract:Abstract An ultrafine grained Cu-5vol.%Al 2 O 3 composite with a microstructure consisting of bimodal Al 2 O 3 particles distributing at the boundaries of ultrafine Cu grains was fabricated by a combination of High energy mechanical milling and powder compact extrusion. The material showed a High tensile yield strength of 486 MPa and High Electrical Conductivity of 80% of the international annealed copper standard (IACS). Analysis of the findings shows that such microstructure can be further tailored to achieve High strength and High Electrical Conductivity with ultrafine grained or nanocrystalline Cu matrix composites.
Deliang Zhang - One of the best experts on this subject based on the ideXlab platform.
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bulk cu nbc nanocomposites with High strength and High Electrical Conductivity
Journal of Alloys and Compounds, 2018Co-Authors: Dengshan Zhou, Wei Zeng, Deliang Zhang, Jingwen Xie, Enrique J LaverniaAbstract:Abstract We report on a study aimed at simultaneously achieving High strength, High Electrical Conductivity and High thermal stability in bulk nanocrystalline (NC) Cu-NbC nanocomposites. We describe an approach that involves adding NbC nanoparticles (∼7 nm) into a nanocrystalline Cu matrix (∼96 nm) via in-situ formation during sintering of High energy mechanically milled powder into a compact. Our results show that the presence of thermally stable NbC nanoparticles in the bulk NC Cu-NbC nanocomposite contributes to a High tensile strength (868 MPa) in combination with a thermally stable nanocrystalline Cu matrix, and a High Electrical Conductivity of ∼56% IACS (International Annealed Copper Standard).
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a feasible ultrafine grained cu matrix composite microstructure for achieving High strength and High Electrical Conductivity
Journal of Alloys and Compounds, 2016Co-Authors: Dengshan Zhou, Wei Zeng, Deliang ZhangAbstract:Abstract An ultrafine grained Cu-5vol.%Al 2 O 3 composite with a microstructure consisting of bimodal Al 2 O 3 particles distributing at the boundaries of ultrafine Cu grains was fabricated by a combination of High energy mechanical milling and powder compact extrusion. The material showed a High tensile yield strength of 486 MPa and High Electrical Conductivity of 80% of the international annealed copper standard (IACS). Analysis of the findings shows that such microstructure can be further tailored to achieve High strength and High Electrical Conductivity with ultrafine grained or nanocrystalline Cu matrix composites.
Gordon G Wallace - One of the best experts on this subject based on the ideXlab platform.
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self healing electrode with High Electrical Conductivity and mechanical strength for artificial electronic skin
ACS Applied Materials & Interfaces, 2019Co-Authors: Hyeon Jun Sim, Gordon G Wallace, Hyunsoo Kim, Yongwoo Jang, Geoffrey M Spinks, Sanjeev Gambhir, David L Officer, Seon Jeong KimAbstract:A self-healing electrode is an Electrical conductor that can repair internal damage by itself, similar to human skin. Since self-healing electrodes are based on polymers and hydrogels, these components are still limited by low Electrical Conductivity and mechanical strength. In this study, we designed an Electrically conductive, mechanically strong, and printable self-healing electrode using liquid crystal graphene oxide (LCGO) and silver nanowires (AgNWs). The conductive ink was easily prepared by simply mixing LCGO and AgNWs solutions. The ultrathin (3 μm thick) electrode can be printed in various shapes, such as a butterfly, in a freestanding state. The maximum Conductivity and strength of the LCGO/AgNW composite were 17 800 S/cm and 4.2 MPa, respectively; these values are 24 and 4 times Higher, respectively, than those of a previously developed self-healing electrode. The LCGO/AgNW composite self-healed internal damage in ambient conditions with moisture and consequently recovered 96.8% Electrical Conductivity and 95% mechanical toughness compared with the undamaged state. The Electrical properties of the composite exhibited metallic tendencies. Therefore, these results suggest that the composite can be used as an artificial electronic skin that detects environmental conditions, such as compression and temperature. This self-healing artificial electronic skin could be applied to human condition monitoring and robotic sensing systems.
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strain responsive polyurethane pedot pss elastomeric composite fibers with High Electrical Conductivity
Advanced Functional Materials, 2014Co-Authors: Mohammad Ziabari Seyedin, Joselito M Razal, Peter C Innis, Gordon G WallaceAbstract:It is a challenge to retain the High stretchability of an elastomer when used in polymer composites. Likewise, the High Conductivity of organic conductors is typically compromised when used as filler in composite systems. Here, it is possible to achieve elastomeric fiber composites with High Electrical Conductivity at relatively low loading of the conductor and, more importantly, to attain mechanical properties that are useful in strain-sensing applications. The preparation of homogenous composite formulations from polyurethane (PU) and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) that are also processable by fiber wet-spinning techniques are systematically evaluated. With increasing PEDOT:PSS loading in the fiber composites, the Young's modulus increases exponentially and the yield stress increases linearly. A model describing the effects of the reversible and irreversible deformations as a result of the re-arrangement of PEDOT:PSS filler networks within PU and how this relates to the electromechanical properties of the fibers during the tensile and cyclic stretching is presented. Conducting elastomeric fibers based on a composite of polyurethane (PU) and PEDOT:PSS, produced by a wet-spinning method, have High Electrical Conductivity and stretchability. These fibers can sense large strains by changes in resistance. The PU/PEDOT:PSS fiber is optimized to achieve the best strain sensing. PU/PEDOT:PSS fibers can be produced on a large scale and integrated into conventional textiles by weaving or knitting. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
