The Experts below are selected from a list of 294 Experts worldwide ranked by ideXlab platform
Mariana Cap - One of the best experts on this subject based on the ideXlab platform.
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Special High Voltage function generator
PIERS Proceedings, 2011Co-Authors: Petr Marcon, Miloslav Steinbauer, Péter Fiala, Mariana CapAbstract:Goal of this project was to design, realize and test a special High Voltage function generator. This generator was designed for special testing of soft tissues. The aim of this project was to generate electric field of defined shape. In course of design of the generator the properties of the output electrode Voltage was the key element. In this article the construction and parameters measuring of the High Voltage function generator is discussed.
Damian Urciuoli - One of the best experts on this subject based on the ideXlab platform.
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High-Voltage stacked diode package
Advancing Microelectronics, 2016Co-Authors: Lauren Boteler, Marta Hinojosa, A. Rodríguez, Damian UrciuoliAbstract:The Army is moving to a more electric force with a number of High-Voltage applications. To support this transition, there have been efforts to develop High Voltage (15-30 kV) single-die 4H-silicon carbide (SiC) bipolar switches and diodes. However, packaging these High-Voltage devices has proven to be challenging since standard packaging methods cannot withstand the High Voltages in a compact form. Therefore, this work aims to develop a compact prototype package with improved size, weight, and power density by stacking diodes. The stacked diode approach allows elimination of almost half of the wirebonds, reduces the board size by 45%, and reduces the package inductance. A module has been designed, fabricated, and tested which is the first 30 kV module reported in the literature to stack two High-Voltage diodes in a series configuration. The package has a number of features specific to High-Voltage packaging including (1) two fins that extend the perimeter of the package to mitigate shorting, and (2) all the leads were designed with rounded corners to minimize Voltage crowding. Hi-pot tests were performed on the unpopulated package and showed the package can withstand 30 kV without breaking down. The completed package with the stacked diodes showed avalanche breakdown occurring at 29 kV. The complete package was then compared to an equivalent discrete diode module and showed a 10X reduction in size. During a clampedinductive load test the stacked diodes showed lower parasitic capacitance, faster reverse recovery time, and lower turn on energy as compared to the discrete diode packages.
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High-Voltage Stacked Diode Package
2015Co-Authors: Lauren Boteler, Marta Hinojosa, A. Rodríguez, Damian UrciuoliAbstract:The Army is moving to a more electric force with a number of High-Voltage applications. To support this transition, there have been efforts to develop High Voltage (15–30 kV) single-die 4H-silicon carbide (SiC) bipolar switches and diodes. However, packaging these High-Voltage devices has proven to be challenging since standard packaging methods cannot withstand the High Voltages in a compact form. Therefore, this work aims to develop a compact prototype package with improved size, weight, and power density by stacking diodes. The stacked diode approach allows elimination of almost half of the wirebonds, reduces the board size by 45%, and reduces the package inductance. A module has been designed, fabricated, and tested which is the first 30 kV module reported in the literature to stack two High-Voltage diodes in a series configuration. The package has a number of features specific to High-Voltage packaging including (1) two fins that extend the perimeter of the package to mitigate shorting, and (2) all t...
Petr Marcon - One of the best experts on this subject based on the ideXlab platform.
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Special High Voltage function generator
PIERS Proceedings, 2011Co-Authors: Petr Marcon, Miloslav Steinbauer, Péter Fiala, Mariana CapAbstract:Goal of this project was to design, realize and test a special High Voltage function generator. This generator was designed for special testing of soft tissues. The aim of this project was to generate electric field of defined shape. In course of design of the generator the properties of the output electrode Voltage was the key element. In this article the construction and parameters measuring of the High Voltage function generator is discussed.
John Kuffel - One of the best experts on this subject based on the ideXlab platform.
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High Voltage Engineering, Fundamentals
High Voltage Engineering, 2001Co-Authors: E. Kuffel, Walter S. Zaengl, John KuffelAbstract:Power transfer for large systems depends on High system Voltages. The basics of High Voltage laboratory techniques and phenomena, together with the principles governing the design of High Voltage insulation, are covered in this book for students, utility engineers, designers and operators of High Voltage equipment. In this new edition the text has been entirely revised to reflect current practice. Major changes include coverage of the latest instrumentation, the use of electronegative gases such as sulfur hexafluoride, modern diagnostic techniques, and High Voltage testing procedures with statistical approaches.A classic text on High Voltage engineeringEntirely revised to bring you up-to-date with current practiceBenefit from expanded sections on testing and diagnostic techniques
Lauren Boteler - One of the best experts on this subject based on the ideXlab platform.
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High-Voltage stacked diode package
Advancing Microelectronics, 2016Co-Authors: Lauren Boteler, Marta Hinojosa, A. Rodríguez, Damian UrciuoliAbstract:The Army is moving to a more electric force with a number of High-Voltage applications. To support this transition, there have been efforts to develop High Voltage (15-30 kV) single-die 4H-silicon carbide (SiC) bipolar switches and diodes. However, packaging these High-Voltage devices has proven to be challenging since standard packaging methods cannot withstand the High Voltages in a compact form. Therefore, this work aims to develop a compact prototype package with improved size, weight, and power density by stacking diodes. The stacked diode approach allows elimination of almost half of the wirebonds, reduces the board size by 45%, and reduces the package inductance. A module has been designed, fabricated, and tested which is the first 30 kV module reported in the literature to stack two High-Voltage diodes in a series configuration. The package has a number of features specific to High-Voltage packaging including (1) two fins that extend the perimeter of the package to mitigate shorting, and (2) all the leads were designed with rounded corners to minimize Voltage crowding. Hi-pot tests were performed on the unpopulated package and showed the package can withstand 30 kV without breaking down. The completed package with the stacked diodes showed avalanche breakdown occurring at 29 kV. The complete package was then compared to an equivalent discrete diode module and showed a 10X reduction in size. During a clampedinductive load test the stacked diodes showed lower parasitic capacitance, faster reverse recovery time, and lower turn on energy as compared to the discrete diode packages.
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High-Voltage Stacked Diode Package
2015Co-Authors: Lauren Boteler, Marta Hinojosa, A. Rodríguez, Damian UrciuoliAbstract:The Army is moving to a more electric force with a number of High-Voltage applications. To support this transition, there have been efforts to develop High Voltage (15–30 kV) single-die 4H-silicon carbide (SiC) bipolar switches and diodes. However, packaging these High-Voltage devices has proven to be challenging since standard packaging methods cannot withstand the High Voltages in a compact form. Therefore, this work aims to develop a compact prototype package with improved size, weight, and power density by stacking diodes. The stacked diode approach allows elimination of almost half of the wirebonds, reduces the board size by 45%, and reduces the package inductance. A module has been designed, fabricated, and tested which is the first 30 kV module reported in the literature to stack two High-Voltage diodes in a series configuration. The package has a number of features specific to High-Voltage packaging including (1) two fins that extend the perimeter of the package to mitigate shorting, and (2) all t...
