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C D Richards - One of the best experts on this subject based on the ideXlab platform.

  • evaluation of a thermal Interface Material fabricated using thermocompression bonding of carbon nanotube turf
    Nanotechnology, 2010
    Co-Authors: A Hamdan, Jeong Hyun Cho, R Johnson, Jun Jiao, D F Bahr, R F Richards, C D Richards
    Abstract:

    In this work a thermal Interface Material fabricated by thermocompression bonding of vertically aligned carbon nanotube turf (VACNT) to metallized substrates was characterized. The VACNT structure was fabricated onto silicon substrates using chemical vapor deposition. The structures were then transferred to metallized substrates using thermocompression bonding. The resulting structure consisted of VACNT turf sandwiched between two layers of Au. Two configurations of VACNT, full coverage and patterned, were fabricated and tested. In addition, the thermal Interface resistance of structures at intermediate steps in the thermocompression bonding process were measured. For the full coverage turf a thermal Interface resistance of 1.082  cm2 °C W−1 at an applied load of 1 N was measured, while a thermal Interface resistance of 0.044  cm2 °C W−1 at a load of 1 N was measured for the patterned turf configuration.

  • Evaluation of a thermal Interface Material fabricated using thermocompression bonding of carbon nanotube turf.
    Nanotechnology, 2009
    Co-Authors: A Hamdan, Jeong Hyun Cho, Jun Jiao, D F Bahr, R F Richards, Ryan D. Johnson, C D Richards
    Abstract:

    In this work a thermal Interface Material fabricated by thermocompression bonding of vertically aligned carbon nanotube turf (VACNT) to metallized substrates was characterized. The VACNT structure was fabricated onto silicon substrates using chemical vapor deposition. The structures were then transferred to metallized substrates using thermocompression bonding. The resulting structure consisted of VACNT turf sandwiched between two layers of Au. Two configurations of VACNT, full coverage and patterned, were fabricated and tested. In addition, the thermal Interface resistance of structures at intermediate steps in the thermocompression bonding process were measured. For the full coverage turf a thermal Interface resistance of 1.082 cm(2) degrees C W(-1) at an applied load of 1 N was measured, while a thermal Interface resistance of 0.044 cm(2) degrees C W(-1) at a load of 1 N was measured for the patterned turf configuration.

A Hamdan - One of the best experts on this subject based on the ideXlab platform.

  • Characterization of a dielectric microdroplet thermal Interface Material with dispersed nanoparticles
    Journal of Nanoparticle Research, 2012
    Co-Authors: A Hamdan, F. Sahli, R. Richards, C. Richards
    Abstract:

    This work presents the fabrication and characterization of a dielectric microdroplet thermal Interface Material (TIM). Glycerin droplets, 1 μL, were tested as TIMs in this study. Copper nanoparticles having a diameter of 25 nm were dispersed in glycerin at different volume fractions to enhance its thermal conductivity. An increase of 57.5 % in the thermal conductivity of glycerin was measured at a volume fraction of 15 %. A minimum thermal Interface resistance of 30.37 mm^2 K/W was measured for the glycerin microdroplets at a deformed droplet height of 10.2 μm. Good agreement between experimental measurements and the predictions of a model based on Maxwell’s equation of rules of mixtures was obtained. The effect of nanoparticles' size on the effective thermal conductivity of glycerin was studied. Nanoparticles with diameters of 60–80 and 300 nm were dispersed in glycerin at a volume fraction of 5 %, and their results were compared to those of the 25 nm particles.

  • evaluation of a thermal Interface Material fabricated using thermocompression bonding of carbon nanotube turf
    Nanotechnology, 2010
    Co-Authors: A Hamdan, Jeong Hyun Cho, R Johnson, Jun Jiao, D F Bahr, R F Richards, C D Richards
    Abstract:

    In this work a thermal Interface Material fabricated by thermocompression bonding of vertically aligned carbon nanotube turf (VACNT) to metallized substrates was characterized. The VACNT structure was fabricated onto silicon substrates using chemical vapor deposition. The structures were then transferred to metallized substrates using thermocompression bonding. The resulting structure consisted of VACNT turf sandwiched between two layers of Au. Two configurations of VACNT, full coverage and patterned, were fabricated and tested. In addition, the thermal Interface resistance of structures at intermediate steps in the thermocompression bonding process were measured. For the full coverage turf a thermal Interface resistance of 1.082  cm2 °C W−1 at an applied load of 1 N was measured, while a thermal Interface resistance of 0.044  cm2 °C W−1 at a load of 1 N was measured for the patterned turf configuration.

  • Evaluation of a thermal Interface Material fabricated using thermocompression bonding of carbon nanotube turf.
    Nanotechnology, 2009
    Co-Authors: A Hamdan, Jeong Hyun Cho, Jun Jiao, D F Bahr, R F Richards, Ryan D. Johnson, C D Richards
    Abstract:

    In this work a thermal Interface Material fabricated by thermocompression bonding of vertically aligned carbon nanotube turf (VACNT) to metallized substrates was characterized. The VACNT structure was fabricated onto silicon substrates using chemical vapor deposition. The structures were then transferred to metallized substrates using thermocompression bonding. The resulting structure consisted of VACNT turf sandwiched between two layers of Au. Two configurations of VACNT, full coverage and patterned, were fabricated and tested. In addition, the thermal Interface resistance of structures at intermediate steps in the thermocompression bonding process were measured. For the full coverage turf a thermal Interface resistance of 1.082 cm(2) degrees C W(-1) at an applied load of 1 N was measured, while a thermal Interface resistance of 0.044 cm(2) degrees C W(-1) at a load of 1 N was measured for the patterned turf configuration.

R Mahajan - One of the best experts on this subject based on the ideXlab platform.

  • Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal Interface Material applications
    Journal of Materials Science, 2014
    Co-Authors: Uttara Sahaym, R. Raj, R. S. Sidhu, M Renavikar, I Dutta, R Mahajan
    Abstract:

    Cu particle-containing In-matrix composites for thermal Interface Material (TIM) applications were prepared via liquid phase sintering, following chemical modification of the Cu–In Interfaces. The optimized composite TIM possessed 1.5 times the thermal conductivity, and twice the yield strength, of pure In. Joints of the composite TIM between pairs of cylindrical Cu rods were used to measure shear behavior and thermal resistance as functions of three parameters: (i) joint thickness, (ii) thermal excursion history, and (iii) type of interfacial layers between Cu and In. The composite joints showed good shear compliance, with a shear yield strength of 2.7 MPa, as well as substantially lower joint thermal resistance (0.021 cm2 K W−1) than pure In joints, which are commercially used in high-end TIM applications. The thermal resistance of the joints was found to be a sensitive function of the interfacial contact resistance between the Cu particles and In within the TIM, as well as between the TIM and the Cu substrates. The TIM–substrate Interfaces, in particular, play an increasingly important role as the joint becomes thinner, limiting the joint thermal resistance. To reduce the interfacial contact resistance, a diffusion barrier of 1–2-nm-thick Al2O3 was applied by atomic layer deposition on both the Cu particles and the Cu substrates, followed by a 20-nm-thick Au layer, which served as a wetting enhancer. The engineered Interfaces also improved the stability of the composite TIM joints under aging conditions.

  • Liquid phase sintered Cu–In composite solders for thermal Interface Material and interconnect applications
    Journal of Materials Science, 2011
    Co-Authors: P. Kumar, R. Raj, R. S. Sidhu, M Renavikar, I Dutta, R Mahajan
    Abstract:

    This study reports on the processing and characterization of composite solders produced by liquid phase sintering, which comprise a high-melting phase such as Cu embedded in a matrix of a low-melting phase such as In. These solders combine higher electrical/thermal conductivities with high mechanical compliance, and are suitable for a range of next-generation thermal Interface Material and interconnect applications. After considering a range of compositions, a solder with 60 volume percent In was found to possess the requisite combination of compliance and conductivity. A thin interfacial Au layer was utilized for the dual purposes of (a) enhancing the wetting between Cu and In, and (b) reducing interfacial reaction between Cu and In to form coarse intermetallic compounds (IMC) scallops, which adversely affect both mechanical and electrical/thermal properties. The Au layer increased the thermal conductivity of the solder by a factor of ~2 while reducing the yield strength to make the solder more compliant. The effects of particle size, shape, and volume fraction are discussed, and a simple model is utilized to explain the trends in the mechanical and the thermal properties.

Ching-ping Wong - One of the best experts on this subject based on the ideXlab platform.

  • a paper like inorganic thermal Interface Material composed of hierarchically structured graphene silicon carbide nanorods
    ACS Nano, 2019
    Co-Authors: We Dai, Xiaoliang Zeng, Hao Hou, Fakhr E Alam, Qiuping Wei, Na Jiang, Ching-ping Wong
    Abstract:

    With the increasing integration of devices in electronics fabrication, there are growing demands for thermal Interface Materials (TIMs) with high through-plane thermal conductivity for efficiently solving thermal management issues. Graphene-based papers consisting of a layer-by-layer stacked architecture have been commercially used as lateral heat spreaders; however, they lack in-depth studies on their TIM applications due to the low through-plane thermal conductivity (<6 W m–1 K–1). In this study, a graphene hybrid paper (GHP) was fabricated by the intercalation of silicon source and the in situ growth of SiC nanorods between graphene sheets based on the carbothermal reduction reaction. Due to the formation of covalent C–Si bonding at the graphene–SiC Interface, the GHP possesses a superior through-plane thermal conductivity of 10.9 W m–1 K–1 and can be up to 17.6 W m–1 K–1 under packaging conditions at 75 psi. Compared with the current graphene-based papers, our GHP has the highest through-plane thermal...

  • a paper like inorganic thermal Interface Material composed of hierarchically structured graphene silicon carbide nanorods
    ACS Nano, 2019
    Co-Authors: Wen Dai, Xiaoliang Zeng, Ching-ping Wong, Hao Hou, Qingwei Yan, Fakhr E Alam, Qiuping Wei, Nan Jiang, Rong Sun, Chengte Lin
    Abstract:

    With the increasing integration of devices in electronics fabrication, there are growing demands for thermal Interface Materials (TIMs) with high through-plane thermal conductivity for efficiently ...

  • A thermal Interface Material based on foam-templated three-dimensional hierarchical porous boron nitride
    Journal of Materials Chemistry A, 2018
    Co-Authors: Zhilin Tian, Jiajia Sun, Shaogang Wang, Xiaoliang Zeng, Shuang Zhou, Shu-lin Bai, Ni Zhao, Ching-ping Wong
    Abstract:

    Developing thermal Interface Materials with high thermal conductivity and appropriate mechanical properties is of great significance for reliable operation and enhancing the lifetime of electronic devices. In this work, we developed a direct foaming method to fabricate a three dimensionally interconnected hierarchical porous boron nitride (BN)/epoxy composite for thermal Interface Material applications. The foam-templated approach allows for construction of an isotropic porous structure with low loading of fillers and is a versatile method that can be applied to various high-thermal conductivity fillers. Based on this method, we performed a comparative study on micron-size and submicron-size BN based thermal Interface Materials through combining structural, morphological and thermal property characterizations as well as defect analysis. The results demonstrate that, as compared to the submicron BN fillers, the micron BN fillers can form a better aligned distribution along the three dimensional network while introducing less defects and grain boundaries, resulting in high thermal conductivity both in-plane (5.19 W m−1 K−1) and out-of-plane (3.48 W m−1 K−1) at a low filler concentration of 24.4 wt%. This study provides guidelines on the design, fabrication and optimization of composite-based thermal Interface Materials.

Jeong Hyun Cho - One of the best experts on this subject based on the ideXlab platform.

  • evaluation of a thermal Interface Material fabricated using thermocompression bonding of carbon nanotube turf
    Nanotechnology, 2010
    Co-Authors: A Hamdan, Jeong Hyun Cho, R Johnson, Jun Jiao, D F Bahr, R F Richards, C D Richards
    Abstract:

    In this work a thermal Interface Material fabricated by thermocompression bonding of vertically aligned carbon nanotube turf (VACNT) to metallized substrates was characterized. The VACNT structure was fabricated onto silicon substrates using chemical vapor deposition. The structures were then transferred to metallized substrates using thermocompression bonding. The resulting structure consisted of VACNT turf sandwiched between two layers of Au. Two configurations of VACNT, full coverage and patterned, were fabricated and tested. In addition, the thermal Interface resistance of structures at intermediate steps in the thermocompression bonding process were measured. For the full coverage turf a thermal Interface resistance of 1.082  cm2 °C W−1 at an applied load of 1 N was measured, while a thermal Interface resistance of 0.044  cm2 °C W−1 at a load of 1 N was measured for the patterned turf configuration.

  • Evaluation of a thermal Interface Material fabricated using thermocompression bonding of carbon nanotube turf.
    Nanotechnology, 2009
    Co-Authors: A Hamdan, Jeong Hyun Cho, Jun Jiao, D F Bahr, R F Richards, Ryan D. Johnson, C D Richards
    Abstract:

    In this work a thermal Interface Material fabricated by thermocompression bonding of vertically aligned carbon nanotube turf (VACNT) to metallized substrates was characterized. The VACNT structure was fabricated onto silicon substrates using chemical vapor deposition. The structures were then transferred to metallized substrates using thermocompression bonding. The resulting structure consisted of VACNT turf sandwiched between two layers of Au. Two configurations of VACNT, full coverage and patterned, were fabricated and tested. In addition, the thermal Interface resistance of structures at intermediate steps in the thermocompression bonding process were measured. For the full coverage turf a thermal Interface resistance of 1.082 cm(2) degrees C W(-1) at an applied load of 1 N was measured, while a thermal Interface resistance of 0.044 cm(2) degrees C W(-1) at a load of 1 N was measured for the patterned turf configuration.