The Experts below are selected from a list of 68517 Experts worldwide ranked by ideXlab platform
Ken Kuang - One of the best experts on this subject based on the ideXlab platform.
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Advanced Thermal Management Materials
2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.
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Development of Advanced Thermal Management Materials
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:In this chapter, we will present the development of advanced Thermal Management materials. First, we will introduce one popular classification of Thermal Management materials. Next, we will present Thermal Management materials with an Al–Cu matrix and particle-enhanced materials such as W, Mo, SiC, AlN, BeO, Si, and others with a low coefficient of expansion. The materials covered include WCu, MoCu, AlSiC, Cu/SiC, Cu/Si, and negative Thermal expansion materials. In the following section, we will introduce fiber-reinforced Thermal Management materials such as boron fibers, carbon fibers, Al2O3 fibers, and SiC fibers. The development of a Cu–Cf composite and aluminum graphite materials is presented. Finally, copper/molybdenum/copper (CMC), copper/molybdenum–copper/copper (CPC), and Cu/Invar/Cu (CIC) materials are introduced.
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Overview of Traditional Thermal Management Materials
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:In this chapter, we will present an overview of traditional Thermal Management materials. First, we will review the properties of Al2O3 dielectric materials and their applications in thick-film circuit substrate, thin-film circuit substrate, and multilayer substrate. Next, we will present the properties of Al2O3, BeO, AlN, SiC, and mullite and their manufacturing methods. In the following section, we will introduce traditional polymer-based Thermal Management materials, such as epoxy, silicone rubber, and polyimide. Finally, we will introduce pure metal or alloy traditional Thermal Management materials such as Cu, Al, W, Mo, and Kovar and their manufacturing methods.
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Introduction to Thermal Management in Microelectronics Packaging
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Thermal Management goes hand in hand with microelectronics packaging. In this chapter, we will present the motivations and the basic concepts of Thermal Management by heat sink materials, such as heat flux, Thermal resistance, and Thermal circuits. Next we will introduce the levels and classifications of packaging and the functions of microelectronics packaging. Finally, we will introduce the development stages of Thermal Management materials.
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Requirements of Thermal Management Materials
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:In this chapter, we will present the requirements of Thermal Management materials from a physics point of view. First, the mechanism of a metal electron and the mechanism of a metal lattice on Thermal conductivity are discussed in detail. Next, the effects of atomic structure, chemical composition, porosity, and temperature on Thermal conductivity are presented. In the following section, we will introduce methods to measure Thermal conductivity, the coefficient of Thermal expansion, and hermeticity. Finally, the emergence of quality requirements for Thermal Management materials are discussed.
Kevin Skadron - One of the best experts on this subject based on the ideXlab platform.
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recent Thermal Management techniques for microprocessors
ACM Computing Surveys, 2012Co-Authors: Joonho Kong, Sung Woo Chung, Kevin SkadronAbstract:Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent Thermal Management techniques for microprocessors, focusing on those that affect or rely on the microarchitecture. We categorize Thermal Management techniques into six main categories: temperature monitoring, microarchitectural techniques, floorplanning, OS/compiler techniques, liquid cooling techniques, and Thermal reliability/security. Temperature monitoring, a requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Microarchitectural techniques include both static and dynamic Thermal Management techniques that control hardware structures. Floorplanning covers a range of Thermal-aware floorplanning techniques for 2D and 3D microprocessors. OS/compiler techniques include Thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher-capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing Thermal-aware microprocessors and to guide future Thermal Management studies.
Mark Benson - One of the best experts on this subject based on the ideXlab platform.
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Introduction to Software Thermal Management
The Art of Software Thermal Management for Embedded Systems, 2014Co-Authors: Mark BensonAbstract:Software Thermal Management is the study and application of managing the Thermal performance of a system using software. This chapter introduces the concept of software Thermal Management, the growing need for it given the forward-looking growth of the microcontroller market, and a discussion of whether Software Thermal Management is a science, an art form, or both.
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Frontiers: The Future of Software Thermal Management
The Art of Software Thermal Management for Embedded Systems, 2014Co-Authors: Mark BensonAbstract:The field of Software Thermal Management is young. Although derived from firmly-rooted studies in thermodynamics, electronics component design, electrical engineering, and software engineering, there are a number of unanswered questions and opportunities for the de-fragmentation of approaches. This chapter contains a list of suggested areas for future research to advance the field of Software Thermal Management.
Guosheng Jiang - One of the best experts on this subject based on the ideXlab platform.
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Advanced Thermal Management Materials
2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.
-
Development of Advanced Thermal Management Materials
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:In this chapter, we will present the development of advanced Thermal Management materials. First, we will introduce one popular classification of Thermal Management materials. Next, we will present Thermal Management materials with an Al–Cu matrix and particle-enhanced materials such as W, Mo, SiC, AlN, BeO, Si, and others with a low coefficient of expansion. The materials covered include WCu, MoCu, AlSiC, Cu/SiC, Cu/Si, and negative Thermal expansion materials. In the following section, we will introduce fiber-reinforced Thermal Management materials such as boron fibers, carbon fibers, Al2O3 fibers, and SiC fibers. The development of a Cu–Cf composite and aluminum graphite materials is presented. Finally, copper/molybdenum/copper (CMC), copper/molybdenum–copper/copper (CPC), and Cu/Invar/Cu (CIC) materials are introduced.
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Overview of Traditional Thermal Management Materials
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:In this chapter, we will present an overview of traditional Thermal Management materials. First, we will review the properties of Al2O3 dielectric materials and their applications in thick-film circuit substrate, thin-film circuit substrate, and multilayer substrate. Next, we will present the properties of Al2O3, BeO, AlN, SiC, and mullite and their manufacturing methods. In the following section, we will introduce traditional polymer-based Thermal Management materials, such as epoxy, silicone rubber, and polyimide. Finally, we will introduce pure metal or alloy traditional Thermal Management materials such as Cu, Al, W, Mo, and Kovar and their manufacturing methods.
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Introduction to Thermal Management in Microelectronics Packaging
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Thermal Management goes hand in hand with microelectronics packaging. In this chapter, we will present the motivations and the basic concepts of Thermal Management by heat sink materials, such as heat flux, Thermal resistance, and Thermal circuits. Next we will introduce the levels and classifications of packaging and the functions of microelectronics packaging. Finally, we will introduce the development stages of Thermal Management materials.
-
Requirements of Thermal Management Materials
Advanced Thermal Management Materials, 2012Co-Authors: Guosheng Jiang, Liyong Diao, Ken KuangAbstract:In this chapter, we will present the requirements of Thermal Management materials from a physics point of view. First, the mechanism of a metal electron and the mechanism of a metal lattice on Thermal conductivity are discussed in detail. Next, the effects of atomic structure, chemical composition, porosity, and temperature on Thermal conductivity are presented. In the following section, we will introduce methods to measure Thermal conductivity, the coefficient of Thermal expansion, and hermeticity. Finally, the emergence of quality requirements for Thermal Management materials are discussed.
Joonho Kong - One of the best experts on this subject based on the ideXlab platform.
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recent Thermal Management techniques for microprocessors
ACM Computing Surveys, 2012Co-Authors: Joonho Kong, Sung Woo Chung, Kevin SkadronAbstract:Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize recent Thermal Management techniques for microprocessors, focusing on those that affect or rely on the microarchitecture. We categorize Thermal Management techniques into six main categories: temperature monitoring, microarchitectural techniques, floorplanning, OS/compiler techniques, liquid cooling techniques, and Thermal reliability/security. Temperature monitoring, a requirement for Dynamic Thermal Management (DTM), includes temperature estimation and sensor placement techniques for accurate temperature measurement or estimation. Microarchitectural techniques include both static and dynamic Thermal Management techniques that control hardware structures. Floorplanning covers a range of Thermal-aware floorplanning techniques for 2D and 3D microprocessors. OS/compiler techniques include Thermal-aware task scheduling and instruction scheduling techniques. Liquid cooling techniques are higher-capacity alternatives to conventional air cooling techniques. Thermal reliability/security issues cover temperature-dependent reliability modeling, Dynamic Reliability Management (DRM), and malicious codes that specifically cause overheating. Temperature-related issues will only become more challenging as process technology continues to evolve and transistor densities scale up faster than power per transistor scales down. The overall objective of this survey is to give microprocessor designers a broad perspective on various aspects of designing Thermal-aware microprocessors and to guide future Thermal Management studies.
