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Yu V Zadorozhnyy - One of the best experts on this subject based on the ideXlab platform.
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mechanical alloying of nanocrystalline Intermetallic Compound tife doped with sulfur and magnesium
Journal of Alloys and Compounds, 2014Co-Authors: Yu V Zadorozhnyy, S N Klyamkin, M V Gorshenkov, S D KaloshkinAbstract:Abstract A series of nanostructured alloys based on TiFe Intermetallic Compound were synthesized from the metallic elements in a planetary ball mill by solid state mechanical alloying. Mg and S were added as doping components to a Fe–50% (at.) Ti powder mixture. Phase and structure transformations during mechanical alloying and subsequent annealing as well as hydrogen interaction with the alloys prepared were studied. It was shown that reversible hydrogen sorption capacities of the nanostructured alloys based on TiFe Intermetallic Compound were of 0.6 and 0.7 wt.% at room temperature for the alloys with S and Mg, respectively. The alloys studied demonstrated a simplified activation of hydrogenation, especially for the S-containing one.
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mechanical alloying of nanocrystalline Intermetallic Compound tife doped by aluminum and chromium
Journal of Alloys and Compounds, 2014Co-Authors: Yu V Zadorozhnyy, S N Klyamkin, O V Bermesheva, S D KaloshkinAbstract:Abstract A series of nanostructured alloys based on TiFe Intermetallic Compound were synthesized from the metallic elements in a planetary ball mill by solid state mechanical alloying. Al and Cr were added as doping components to a Fe-50% (at.) Ti powder mixture. Phase and structure transformations during mechanical alloying and subsequent annealing as well as hydrogen interaction with the alloys prepared were studied. It was shown that reversible hydrogen sorption capacity of the nanostructural alloys based on the TiFe Intermetallic Compound was of 0.7 wt.% at room temperature. The alloys studied demonstrated a simplified activation of hydrogenation. A correlation between the alloys behavior in their reactions with hydrogen and structure parameters of the hydrogenated samples has been discussed.
Paul T. Vianco - One of the best experts on this subject based on the ideXlab platform.
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Intermetallic Compound layer development during the solid state thermal aging of 63sn 37pb solder au pt pd thick film couples
IEEE Transactions on Components Packaging and Manufacturing Technology: Part A, 1997Co-Authors: Paul T. Vianco, J.j. Stephens, Jerome A. RejentAbstract:A study was performed which examined the solid state, Intermetallic Compound layer growth kinetics between 63Sn-37Pb solder and a 76Au-21Pt-3Pd (wt.%) thick film conductor on 96% alumina substrates. A linear, multivariable regression analysis was used to assess the experimental data according to the following empirical relationship: x-x0=At/sup n/ exp(-/spl Delta/H/RT). A time exponent of n=0.78/spl plusmn/0.08 was observed, suggesting that a combination of bulk diffusion and interface reaction mechanisms were responsible for layer growth. The apparent activation energy, /spl Delta/H, was 106/spl ges/8 kJ/mol. Parallel aging experiments were performed on diffusion couples fabricated between 63Sn-37Pb solder and bulk alloy stock having the same Au-Pt-Pd composition as the thick film. Similar growth kinetic parameters were computed. Intermetallic Compound layer growth was accelerated under thermal cycling and thermal shock conditions due to residual stresses generated by the thermal expansion mismatch between the solder and the ceramic substrate.
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Intermetallic Compound layer growth by solid state reactions between 58bi 42sn solder and copper
Journal of Electronic Materials, 1995Co-Authors: Paul T. Vianco, Alice C Kilgo, Richard P GrantAbstract:Solid state Intermetallic Compound layer growth was examined following ther-mal aging of the 58Bi-42Sn/Cu couple for a temperature range of 55 to 120°C and time periods of from 1 to 400 days. The Intermetallic Compound layer was comprised of sublayers that included the traditional Cu6Sn5 stoichiometry as well as one or more complex Cu-Sn-Bi chemistries. The number of sublayers increased with aging temperature and time. Time-dependent layer thickness computations based upon the empirical expression, Atn + B, revealed a time exponent, n, that decreased with increasing temperature from a maximum of 0.551 at 70°C to 0.417 at 120°C. The apparent activation energy for growth (at 100 days) was 55± 7 kJ/mol. The Bi-Sn/Cu data, together with that from the other solder/copper systems, suggested that at a given homologous temperature, the quantity of Sn in the solder field determines the Intermetallic Compound layer thickness as a function of time.
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solid state Intermetallic Compound layer growth between copper and hot dipped indium coatings
Journal of Materials Science, 1995Co-Authors: Paul T. Vianco, Alice C Kilgo, Richard P GrantAbstract:Solid state growth of Intermetallic Compound layers that form between hot dipped indium coatings and copper was investigated in diffusion couples aged at temperatures of 70, 100 and 135 °C and time periods of up to 300 days. At an annealing temperature of 70 °C, the metastable composition, Cu36In64, was observed at the interface. Ageing at 100 °C caused a dual layer structure with the Cu36In64 layer joined by a copper-rich Intermetallic Compound, Cu11In9, that is noted in the equilibrium phase diagram. An annealing temperature of 135 °C caused the eventual development of a single copper-rich Intermetallic layer, Cu57In43, at the interface. Total Intermetallic layer thickness was documented as a function of ageing time and temperature, exhibiting at1/2 dependence with an apparent activation energy of 20 kJ mol−1.
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solid state Intermetallic Compound growth between copper and high temperature tin rich solders part i experimental analysis
Journal of Electronic Materials, 1994Co-Authors: Paul T. Vianco, K L Erickson, P L HopkinsAbstract:An experimental study was performed which examined the solid state growth kinetics of the interfacial Intermetallic Compound layers formed between copper and the high temperature, tin-rich solders 96.5Sn-3.5Ag (wt.%) and 95Sn-5Sb. These results were compared with baseline data from the 100Sn/copper system. Both the 96.5Sn-3.5Ag and 95Sn-5Sb solders exhibited the individual Cu3Sn and Cu6Sn5 layers at the interface; the thickness of the Cu3Sn layer being a function of the aging time and temperature. The total thickness of the Intermetallic Compound layer formed in the 96.5Sn-3.5Ag solder/copper couple showed a mixture of linear and √t dependencies at the lower temperatures of 70,100, and 135°C, and a t0.42 dependence at 170 and 205°C. The combined apparent activation energy was 59 kJ/mol, the Arrhenius plot showed a knee between the low and high temperature data. The total layer thickness of the 95Sn-5Sb/copper system exhibited √t dependence at the three lower temperatures and t0.42 growth kinetics at 170 and 205°C. The combined apparent activation energy was 61 kJ/mol.
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solid state Intermetallic Compound growth between copper and high temperature tin rich solders part ii modelling
Journal of Electronic Materials, 1994Co-Authors: K L Erickson, P L Hopkins, Paul T. ViancoAbstract:The solder/base metal interfacial chemistry characterizing solder joints impacts the manufacturability and reliability of electronic components. A model was developed to predict the long-term diffusion-controlled growth of interfacial Intermetallic Compound layers using short-term experimental data. The model included terms for both constant and variable diffusion coefficients. Application of the model was demonstrated using parameter values for 100Sn/Cu system and comparing calculated layer thicknesses with the experimentally observed values. The early time data for the 100Sn/Cu system that were used to predict growth at longer times were characterized using a variable diffusion coefficient that was an empirical function of layer thickness.
Seungboo Jung - One of the best experts on this subject based on the ideXlab platform.
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effects of Intermetallic Compound on the electrical and mechanical properties of friction welded cu al bimetallic joints during annealing
Journal of Alloys and Compounds, 2005Co-Authors: Kueksaeng Bang, Seungboo JungAbstract:Abstract Al/Cu metal joints applied for the electrical connector was joined by the friction welding method to limit the formation of Intermetallic Compound under optimum friction welding condition. To guarantee the reliability of the Al/Cu joints in service requirement, the effects of the Intermetallic Compound layer on the electrical and mechanical properties have been investigated under various annealing conditions. Two kinds of Intermetallic Compounds layer were formed in the joints interface and identified by AlCu and Al 2 Cu. The growth kinetic of these Intermetallics during the annealing can be followed by volume diffusion process. The activation energy of Al 2 Cu, AlCu and total Intermetallic Compound (AlCu + Al 2 Cu) represented 107.5, 98.42 and 110.22 kJ/mol, respectively. A thicker Intermetallic Compound layers could seriously degrade the electrical resistivity and tensile strength. The electrical resistivity with 21 μm thickness of Intermetallic Compound was 45 μΩ cm and increased to be 85 μΩ cm with 107 μm of Intermetallic Compound. Tensile strength remarkably decreased from 85 MPa to near zero at the annealing condition of 773 K and 129.6 ks and fracture occurred through the Intermetallic Compound layers.
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interfacial reactions and growth kinetics for Intermetallic Compound layer between in 48sn solder and bare cu substrate
Journal of Alloys and Compounds, 2005Co-Authors: Daegon Kim, Seungboo JungAbstract:Abstract The growth kinetics of Intermetallic Compound layer formed between In–48Sn solder and bare Cu substrate were investigated at temperatures between 70 and 100 °C for 0–60 days. In the solder joint between the In–48Sn solder and bare Cu substrate, the Intermetallic Compound layer was composed of two phases: Cu(In,Sn)2 adjacent to the solder and Cu6(In,Sn)5 which was the dominant phase. A quantitative analysis of the Intermetallic Compound layer thickness as a function of time and temperature was performed. Additionally, the thickness of these Intermetallic Compounds increased with increasing aging temperature and time. The layer growth of the Intermetallic Compound in the couple of the In–48Sn/Cu system satisfied a parabolic law in the given temperature range. As a whole, because the values of time exponent (n) is approximately equal to 0.5, the layer growth of the Intermetallic Compound was mainly controlled by a diffusion mechanism in the temperature range studied. The apparent activation energies calculated for the growth of the total of Intermetallic Compounds [Cu(In,Sn)2 + Cu6(In,Sn)5] and for Cu6(In,Sn)5 were 95.11 and 97.63 kJ/mol, respectively.
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interfacial reactions and Intermetallic Compound growth between indium and copper
Journal of Materials Science: Materials in Electronics, 2004Co-Authors: Daegon Kim, Changyoul Lee, Seungboo JungAbstract:The growth kinetics of Intermetallic Compound layers formed between pure indium solder and bare Cu substrate by solid-state isothermal aging were examined at temperatures between 343 and 393 K for 0–4×106 s. A quantitative analysis of the Intermetallic Compound layer thickness as a function of time and temperature was performed. Experimental results showed that the Cu11In9 Intermetallic Compound was observed for bare copper substrate. Additionally, the thickness of the Cu11In9 Intermetallic Compound was increased with the aging temperature and time. The layer growth of the Intermetallic Compound in the couple of the In/Cu system followed a parabolic law over the given temperature range. As a whole, because the values of time exponent (n) were approximately 0.5, the layer growth of the Intermetallic Compound was mainly controlled by a diffusion mechanism over the temperature range studied. The apparent activation energy of Cu11In9 Intermetallic Compound in the couple of the In/Cu was 34.16 kJ mol−1.
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Intermetallic Compound layer formation between sn 3 5 mass ag bga solder ball and cu immersion au electroless ni p cu substrate
Journal of Materials Science: Materials in Electronics, 2003Co-Authors: Changbae Lee, Seungboo Jung, Jeongwon Yoon, Sujeong Suh, Cheolwoong Yang, Changchae Shur, Youngeui ShinAbstract:The growth kinetics of Intermetallic Compound layers formed between eutectic Sn–3.5Ag BGA (ball grid array) solder and (Cu, immersion Au/electroless Ni–P/Cu) substrate by solid-state isothermal aging were examined at temperatures between 343 and 443 K for 0–100 days. In the solder joints between the Sn–Ag eutectic solder ball and Cu pads, the Intermetallic Compound layer was composed of two phases: Cu6Sn5 (η-phase) adjacent to the solder and Cu3Sn (e-phase) adjacent to the copper. The layer of Intermetallic on the immersion Au/electroless Ni–P/Cu substrate was composed of Ni3Sn4. As a whole, because the values of the time exponent (n) are approximately 0.5, the layer growth of the Intermetallic Compound was mainly controlled by a diffusion-controlled mechanism over the temperature range studied. The growth rate of Ni3Sn4 Intermetallic Compound was slower than that of the total Cu–Sn(Cu6Sn5+Cn3Sn). The apparent activation energy for growth of total Cu–Sn(Cu6Sn5+Cu3Sn) and Ni3Sn4 Intermetallic Compound were 64.82 and 72.54 kJ mol−1, respectively.
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reaction diffusions of cu 6 sn 5 and cu 3 sn Intermetallic Compound in the couple of sn 3 5ag eutectic solder and copper substrate
Metals and Materials International, 2003Co-Authors: Jeongwon Yoon, Changbae Lee, Dae Up Kim, Seungboo JungAbstract:The growth kinetics of Intermetallic Compound layers formed between Sn-3.5Ag solder and Cu substrate were investigated as a consequence of solid-state isothermal aging. Isothermal aging was carried out in a temperature range between 70°C and 200°C for 0 to 60 days. A quantitative analysis of the Intermetallic Compound layer thickness as a function of time and temperature was performed. The diffusion couples showed a composite Intermetallic layer comprised of Cu6Sn5 and Cu3Sn. The growth of Intermetallic Compounds followed diffusion-controlled kinetics and the layer thickness reached only 9 μm after 60 day of aging at 150°C. The apparent activation energies were calculated for the growth of the total Intermetallic Compound (Cu6Sn5+Cu3Sn); Cu6Sn5 and Cu3Sn Intermetallic are 65.4, 55.4 and 75.7 kJ/mol, respectively.
S D Kaloshkin - One of the best experts on this subject based on the ideXlab platform.
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mechanical alloying of nanocrystalline Intermetallic Compound tife doped with sulfur and magnesium
Journal of Alloys and Compounds, 2014Co-Authors: Yu V Zadorozhnyy, S N Klyamkin, M V Gorshenkov, S D KaloshkinAbstract:Abstract A series of nanostructured alloys based on TiFe Intermetallic Compound were synthesized from the metallic elements in a planetary ball mill by solid state mechanical alloying. Mg and S were added as doping components to a Fe–50% (at.) Ti powder mixture. Phase and structure transformations during mechanical alloying and subsequent annealing as well as hydrogen interaction with the alloys prepared were studied. It was shown that reversible hydrogen sorption capacities of the nanostructured alloys based on TiFe Intermetallic Compound were of 0.6 and 0.7 wt.% at room temperature for the alloys with S and Mg, respectively. The alloys studied demonstrated a simplified activation of hydrogenation, especially for the S-containing one.
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mechanical alloying of nanocrystalline Intermetallic Compound tife doped by aluminum and chromium
Journal of Alloys and Compounds, 2014Co-Authors: Yu V Zadorozhnyy, S N Klyamkin, O V Bermesheva, S D KaloshkinAbstract:Abstract A series of nanostructured alloys based on TiFe Intermetallic Compound were synthesized from the metallic elements in a planetary ball mill by solid state mechanical alloying. Al and Cr were added as doping components to a Fe-50% (at.) Ti powder mixture. Phase and structure transformations during mechanical alloying and subsequent annealing as well as hydrogen interaction with the alloys prepared were studied. It was shown that reversible hydrogen sorption capacity of the nanostructural alloys based on the TiFe Intermetallic Compound was of 0.7 wt.% at room temperature. The alloys studied demonstrated a simplified activation of hydrogenation. A correlation between the alloys behavior in their reactions with hydrogen and structure parameters of the hydrogenated samples has been discussed.
Fusahito Yoshida - One of the best experts on this subject based on the ideXlab platform.
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development of cu sn Intermetallic Compound at pb free solder cu joint interface
Materials Letters, 2003Co-Authors: Fengjiang Wang, Yiyu Qian, Fusahito YoshidaAbstract:Abstract The development of Cu–Sn Intermetallic Compound (IMC) at the solder/Cu joint interface had been studied using two Pb-free solders, Sn–3.8Ag–0.7Cu and Sn–2Ag–0.8Cu–0.6Sb alloys. Meanwhile, 100Sn/Cu joint was applied for comparison. Both Pb-free solder joints were found with thinner Cu–Sn IMC layers at as-soldered state due to the slower dissolution rate of Intermetallic Compound into the liquid Pb-free solders during reflow and, consequently, slower growth rates of Cu–Sn IMC during the solid-state thermal aging at 125 °C, where Sn–2Ag–0.8Cu–0.6Sb solder joint gave the minimum value. Thermodynamic analysis showed that such phenomena could be attributed to the reduction of the driving force for Cu–Sn IMC formation due to the existence of Ag and Sb atoms.
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effect of la on the cu sn Intermetallic Compound imc growth and solder joint reliability
Journal of Alloys and Compounds, 2002Co-Authors: Yiyu Qian, Fusahito YoshidaAbstract:Abstract By adding a small amount of the rare earth element La (only 0.05 wt.%) into the traditional Sn60–Pb40 solder alloy, the growth of the Cu–Sn Intermetallic Compound (IMC) at the interface of solder joints has been depressed. Furthermore, the thermal fatigue life of simulated surface mount solder joints was increased by a factor of 3. Thermodynamic analysis showed that, since La has a higher affinity to Sn in the Sn–Pb system, small amounts of La addition will reduce the driving force for Cu–Sn IMC formation in a limited mole fraction range.
