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Y C Chan - One of the best experts on this subject based on the ideXlab platform.
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performance of sn 3 0ag 0 5cu composite Solder with tic reinforcement physical properties Solderability and microstructural evolution under isothermal ageing
Journal of Alloys and Compounds, 2016Co-Authors: Y C Chan, Guang Chen, Hao Peng, Vadim V Silberschmidt, Fengshun WuAbstract:Abstract This paper is focused on the effect of TiC nano-reinforcement that was successfully introduced into a SAC305 lead-free Solder alloy with different weight fractions (0, 0.05, 0.1 and 0.2 wt%) through a powder-metallurgy route. Actual retained ratios of TiC reinforcement in composite Solder billets and Solder joints were quantitatively analysed. The obtained SAC/TiC Solders were also studied extensively with regard to their coefficient of thermal expansion (CTE), wettability and thermal properties. In addition, evolution of interfacial intermetallic compounds (IMCs) and corresponding changes in mechanical properties under thermal ageing were investigated. Only about 10%–30% of initial TiC nanoparticles added were found retained in the final composite Solder joints. With an appropriate addition amount of TiC nanoparticles, the composite Solders exhibited an improvement in their wettability. A negligible change in their melting point and a widened melting range were found in composite Solders containing TiC reinforcement. Also, the CTE of composite Solder alloys was effectively decreased when compared with the plain SAC Solder alloy. In addition, a growth of interfacial IMCs in composite Solder joints was notably suppressed under isothermal ageing condition, while their corresponding mechanical properties of composite Solder joints significantly outperformed those of non-reinforced Solder joints throughout the ageing period.
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interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced sn3 5ag0 5cu Solder joint under current stressing
Journal of Alloys and Compounds, 2014Co-Authors: Y C Chan, Kaili Zhang, Kamchuen YungAbstract:Abstract In this work, multi-walled carbon nanotubes (MWCNTs) with various weight percentages of 0.01 wt%, 0.05 wt%, 0.1 wt% were incorporated into Sn3.5Ag0.5Cu (SAC) Solder matrix by mechanical blending followed by reflow process. The microstructure with interfacial intermetallics (IMCs) growth were investigated after aging at 100 °C and a current density of 1.2 × 10 4 A/cm 2 for 336 h. CNTs were found to be homogeneously dispersed into the Solder matrix by EDX analysis. Experimental results revealed that microporosities existed in some areas of doped Solders, which retarded the formation of Ag 3 Sn IMCs. The growth of IMCs for CNTs reinforced Solders was less significantly than that of the plain Solder, because CNTs affected the reaction mechanisms of both Cu 5 Sn 6 and Cu 3 Sn at the anode side and alleviated IMCs growth and Solder dissolution into Cu substrate at the cathode side. A slight decrease in melting temperature for CNT reinforced Solders was found compared to that of the plain Solder. The CNT doped Solders demonstrated promising improved shear strength and hardness.
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Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite Solders
Microelectronics Reliability, 2014Co-Authors: Asit Kumar Gain, Y C ChanAbstract:Abstract Nano-sized, nonreacting, noncoarsening ZrO 2 ceramic particles reinforced Sn–Ag–Cu composite Solders were prepared by mechanically dispersing nano-particles into Sn–Ag–Cu Solder and investigated their microstructure, kinetic analysis and mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics. From microstructures evaluation, it was clear that composite Solders containing ZrO 2 ceramic nano-particles significantly impact on the formation of intermetallic compounds (IMCs) at their interfaces as well as refined microstructure in the Solder ball regions. The growth behavior of IMCs layer at the interfaces in composite Solders was lower than that of plain Sn–Ag–Cu Solders. Moreover, after long time aging, some microcracks were clearly observed at the interface due to the formation of excessive IMC layer and softening nature of plain Sn–Ag–Cu Solder joints. Mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics were successfully investigated. The experimental results showed that composite Solder joints exhibited higher hardness and shear strength as compared to the plain Sn–Ag–Cu Solder joints. In addition, composite Solder containing ZrO 2 nano-particles exhibited lower damping capacity as compared with plain Sn–Ag–Cu Solder due to fine microstructure and uniformly distributed ZrO 2 nano-particles which increase the dislocation density.
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growth mechanism of intermetallic compounds and damping properties of sn ag cu 1 wt nano zro2 composite Solders
Microelectronics Reliability, 2014Co-Authors: Asit Kumar Gain, Y C ChanAbstract:Abstract Nano-sized, nonreacting, noncoarsening ZrO 2 ceramic particles reinforced Sn–Ag–Cu composite Solders were prepared by mechanically dispersing nano-particles into Sn–Ag–Cu Solder and investigated their microstructure, kinetic analysis and mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics. From microstructures evaluation, it was clear that composite Solders containing ZrO 2 ceramic nano-particles significantly impact on the formation of intermetallic compounds (IMCs) at their interfaces as well as refined microstructure in the Solder ball regions. The growth behavior of IMCs layer at the interfaces in composite Solders was lower than that of plain Sn–Ag–Cu Solders. Moreover, after long time aging, some microcracks were clearly observed at the interface due to the formation of excessive IMC layer and softening nature of plain Sn–Ag–Cu Solder joints. Mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics were successfully investigated. The experimental results showed that composite Solder joints exhibited higher hardness and shear strength as compared to the plain Sn–Ag–Cu Solder joints. In addition, composite Solder containing ZrO 2 nano-particles exhibited lower damping capacity as compared with plain Sn–Ag–Cu Solder due to fine microstructure and uniformly distributed ZrO 2 nano-particles which increase the dislocation density.
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research advances in nano composite Solders
Microelectronics Reliability, 2009Co-Authors: J Shen, Y C ChanAbstract:Recently, nano-composite Solders have been developed in the electronic packaging materials industry to improve the creep and thermo-mechanical fatigue resistance of Solder joints to be used in service at high temperatures and under thermo-mechanical fatigue conditions. This paper reviews the driving force for the development of nano-composite Solders in the electronic packaging industry and the research advances of the composite Solders developed. The rationale for the preparation of nano-composite Solders are presented at first. Examples of two nano-composite Solder fabrication methods, a mechanical mixing method and an in-situ method, are explained in detail. The achievements and enhancements in the nano-composite prepared Solders are summarized. The difficulties and problems existing in the fabrication of nano-composite Solders are discussed. Finally, a novel nano-structure composite Solder, which attempts to solve the problems encountered in the fabrication of nano-composite Solders, is introduced in detail. Guidelines for the development of nano-composite Solders are then provided.
S. Y. Chang - One of the best experts on this subject based on the ideXlab platform.
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effect of addition of tio2 nanoparticles on the microstructure microhardness and interfacial reactions of sn3 5agxcu Solder
Materials & Design, 2011Co-Authors: S. Y. Chang, C C Jain, T H Chuang, L P Feng, L.c. TsaoAbstract:Abstract In this work, TiO 2 nanoparticles were successfully incorporated into Sn3.5Ag and Sn3.5Ag0.7Cu Solder, to synthesize novel lead-free composite Solders. Effects of the TiO 2 nanoparticle addition on the microstructure, melting property, microhardness, and the interfacial reactions between Sn3.5AgXCu and Cu have been investigated. Experimental results revealed that the addition of 0.5 wt.% TiO 2 nanoparticles in Sn3.5AgXCu composite Solders resulted in a finely dispersed submicro Ag 3 Sn phase. This apparently provides classical dispersion strengthening and thereby enhances the shear strength of composite Solder joints. After Soldering, the interfacial overall intermetallic compounds (IMC) layer of the Sn3.5AgXCu lead-free Solder joint was observed to have grown more significantly than that of the Sn3.5AgXCu composite Solder joints, indicating that the Sn3.5AgXCu composite Solder joints had a lower diffusion coefficient. This signified that the presence of TiO 2 nanoparticles was effective in retarding the growth of the overall IMC layer.
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effects of nano tio2 additions on thermal analysis microstructure and tensile properties of sn3 5ag0 25cu Solder
Materials & Design, 2010Co-Authors: L.c. Tsao, S. Y. ChangAbstract:Abstract For development of a lead-free composite Solder for advance electrical components, a series of Sn3.5Ag0.25Cu (SAC) Solders containing TiO 2 nanopowders have been studied. The results showed that the addition of 0.25–1 wt.% TiO 2 nanopowders into the lead-free SAC Solder caused its liquidus temperature to increase by about 3.5–5.9 °C. Metallographic observations of the lead-free SAC composite Solders revealed a reduction in the grain size of β-Sn, Ag 3 Sn phase and Ag 3 Sn phase located between the spacing lamellae. In terms of mechanical behavior, the addition of larger weight fractions of TiO 2 nanopowders in lead-free SAC Solder matrix led to an improvement in microhardness, 0.2%YS and UTS. However, ductility of the lead-free SAC composite Solders was observed to decrease.
L.c. Tsao - One of the best experts on this subject based on the ideXlab platform.
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effect of addition of tio2 nanoparticles on the microstructure microhardness and interfacial reactions of sn3 5agxcu Solder
Materials & Design, 2011Co-Authors: S. Y. Chang, C C Jain, T H Chuang, L P Feng, L.c. TsaoAbstract:Abstract In this work, TiO 2 nanoparticles were successfully incorporated into Sn3.5Ag and Sn3.5Ag0.7Cu Solder, to synthesize novel lead-free composite Solders. Effects of the TiO 2 nanoparticle addition on the microstructure, melting property, microhardness, and the interfacial reactions between Sn3.5AgXCu and Cu have been investigated. Experimental results revealed that the addition of 0.5 wt.% TiO 2 nanoparticles in Sn3.5AgXCu composite Solders resulted in a finely dispersed submicro Ag 3 Sn phase. This apparently provides classical dispersion strengthening and thereby enhances the shear strength of composite Solder joints. After Soldering, the interfacial overall intermetallic compounds (IMC) layer of the Sn3.5AgXCu lead-free Solder joint was observed to have grown more significantly than that of the Sn3.5AgXCu composite Solder joints, indicating that the Sn3.5AgXCu composite Solder joints had a lower diffusion coefficient. This signified that the presence of TiO 2 nanoparticles was effective in retarding the growth of the overall IMC layer.
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effects of nano tio2 additions on thermal analysis microstructure and tensile properties of sn3 5ag0 25cu Solder
Materials & Design, 2010Co-Authors: L.c. Tsao, S. Y. ChangAbstract:Abstract For development of a lead-free composite Solder for advance electrical components, a series of Sn3.5Ag0.25Cu (SAC) Solders containing TiO 2 nanopowders have been studied. The results showed that the addition of 0.25–1 wt.% TiO 2 nanopowders into the lead-free SAC Solder caused its liquidus temperature to increase by about 3.5–5.9 °C. Metallographic observations of the lead-free SAC composite Solders revealed a reduction in the grain size of β-Sn, Ag 3 Sn phase and Ag 3 Sn phase located between the spacing lamellae. In terms of mechanical behavior, the addition of larger weight fractions of TiO 2 nanopowders in lead-free SAC Solder matrix led to an improvement in microhardness, 0.2%YS and UTS. However, ductility of the lead-free SAC composite Solders was observed to decrease.
Liang Zhang - One of the best experts on this subject based on the ideXlab platform.
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interface reaction and intermetallic compound growth behavior of sn ag cu lead free Solder joints on different substrates in electronic packaging
Journal of Materials Science, 2019Co-Authors: Mingyue Xiong, Liang ZhangAbstract:During Soldering and service, intermetallic compounds (IMCs) have an important impact on the performance and reliability of electronic products. A thin and continuous intermetallic layer facilitates the formation of reliable Solder joints and improves the creep and fatigue resistance of Solder joints. However, if the IMCs overgrow, the coarse IMC becomes brittle and tends to crack under stress, leading to a decrease in Solder joint reliability. Based on the latest developments in the field of lead-free Solders at home and abroad, this paper comprehensively reviews the interfacial reaction between SnAgCu Pb-free Solders and different substrates and the growth behavior of IMCs and clarifies the growth mechanism of interfacial IMCs. The effects of the modification measures of lead-free Solder on the IMCs and reliability of SnAgCu/substrate interface are analyzed, which provide a theoretical basis for the development and application of new lead-free Solder.
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Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag Solder and Solder joints
Journal of Materials Science: Materials in Electronics, 2015Co-Authors: Liang Zhang, Lei Sun, Yong Huan GuoAbstract:Microstructures, interface reaction, melting characteristics, tensile property, thermal fatigue behavior and wettability of Sn58Bi, Sn35Bi0.3Ag and Sn35Bi1.0Ag Solders were investigated. Only Sn phase and Bi phase like net-type distribute uniformly in the Sn58Bi matrix, Sn35Bi0.3Ag and Sn35Bi1.0Ag Solder show the Ag3Sn particles in the Sn matrix around net-like Bi phase, at the Solder/Cu Solder joints, only Cu6Sn5 intermetallic compound was observed. The liquid phase line temperature of Sn35Bi0.3Ag and Sn35Bi1.0Ag is higher than that of SnBi Solder. Sn35Bi1.0Ag Solder joints show superiority in mechanical property and fatigue life, which can attribute to the strengthening effect of Ag3Sn particles. Moreover, the wettability of Sn35Bi1.0Ag Solder was best of all, and the N2 atmosphere and RMA flux can enhance the wettability obviously, which can provide the reference support of the research of SnBi base Solders.
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Recent advances on Sn–Cu Solders with alloying elements: review
Journal of Materials Science: Materials in Electronics, 2011Co-Authors: Guang Zeng, Song-bai Xue, Liang Zhang, Li Li GaoAbstract:Nowadays, a major concern of Sn–Cu based Solder alloy today is focused on continuously improving the comprehensive properties of the Solder joints formed between the Solders and substrates. The key issues and improvements about Sn–Cu–X (X = Ni, rare earths, Zn, Co, Ga, In, Bi, secondary particles etc.) Solder are outlined and evaluated in this paper which compared to Sn–Cu Solder. It can be summarized that by adding appropriate amounts of certain alloying elements X to Sn–Cu Solder, and it is possible to tailor the properties of the Solder, such as the melting and solidification behaviors, wettability, microstructure, interfacial reactions and mechanical properties of the Solder. The reliability issues related to the implementation of Sn–Cu–X Solder in advanced electronics system are also introduced, which indicates that further development on the Sn–Cu–X Solders are to be underway.
K.n. Tu - One of the best experts on this subject based on the ideXlab platform.
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electromigration and thermomigration in pb free flip chip Solder joints
Annual Review of Materials Research, 2010Co-Authors: Chih Chen, H M Tong, K.n. TuAbstract:Pb-free Solders have replaced Pb-containing SnPb Solders in the electronic packaging industry due to environmental concerns. Both electromigration (EM) and thermomigration (TM) have serious reliability issues for fine-pitch Pb-free Solder bumps in the flip-chip technology used in consumer electronic products. We review the unique features of EM and TM in flip-chip Solder bumps, emphasizing the effects of current crowding and Joule heating. In addition, the challenges to a better understanding of EM and TM in Pb-free Solders are discussed. For example, the anisotropic nature of Sn microstructure in Pb-free Solders can enhance the dissolution rates of Ni and Cu in Solders driven by EM and TM.
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physics and materials challenges for lead free Solders
Journal of Applied Physics, 2003Co-Authors: K.n. Tu, A M Gusak, M LiAbstract:At present, the electronic industry is actively searching for Pb-free Solders due to environmental concerns over Pb-containing Solders. Solder joints are widely used to bond chips to their substrates for electrical connection and packaging. Lacking reliability data, many electronic companies will be reluctant to adopt Pb-free Solders in the advanced products. Hence, it is timely to review our understanding of structure-property relationship and potential reliability issues of Pb-free Solders. A brief history of Solder joint processes in electronic manufacturing is presented to serve as a background for the review. It emphasizes the unique phenomenon of spalling of interfacial intermetallic compound in Solder reactions. Challenges for Pb-free Solders from the point of view of physics and materials are given since the reliability issues of Solder joints will remain with us when advanced Cu/low k dielectric interconnect technology is introduced into microelectronic devices.
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reliability issues of pb free Solder joints in electronic packaging technology
Electronic Components and Technology Conference, 2002Co-Authors: K.n. Tu, K. ZengAbstract:At present, the electronic packaging industry is actively searching for Pb-free Solders due to environmental concerns surrounding the Pb-containing Solders. Due to the lack of reliability data, some electronics companies are reluctant to adopt Pb-free Solders into their products. Hence, a review of the reliability issues of Pb-free Solders is timely. We have selected three topics to be reviewed here. They are interfacial reaction between Pb-free Solder and thin film under-bump metallization, electromigration in Pb-free flip chip Solder joints, and Sn whisker growth on the Pb-free finish on a Cu leadframe.
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six cases of reliability study of pb free Solder joints in electronic packaging technology
Materials Science & Engineering R-reports, 2002Co-Authors: K. Zeng, K.n. TuAbstract:Abstract Solder is widely used to connect chips to their packaging substrates in flip chip technology as well as in surface mount technology. At present, the electronic packaging industry is actively searching for Pb-free Solders due to environmental concern of Pb-based Solders. Concerning the reliability of Pb-free Solders, some electronic companies are reluctant to adopt them into their high-end products. Hence, a review of the reliability behavior of Pb-free Solders is timely. We use the format of “case study” to review six reliability problems of Pb-free Solders in electronic packaging technology. We conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes. We made a direct comparison to the similar problem in SnPb Solder whenever it is available. Specifically, we reviewed: (1) interfacial reactions between Pb-free Solder and thick metalliztion of bond-pad on the substrate-side, (2) interfacial reactions between Pb-free Solder and thin-film under-bump metallization on the chip-side, (3) the growth of a layered intermetallic compound (IMC) by ripening in solid state aging of Solder joints, (4) a long range interaction between chip-side and substrate-side metallizations across a Solder joint, (5) electromigration in flip chip Solder joints, and finally (6) Sn whisker growth on Pb-free finish on Cu leadframe. Perhaps, these cases may serve as helpful references to the understanding of other reliability behaviors of Pb-free Solders.
