The Experts below are selected from a list of 324 Experts worldwide ranked by ideXlab platform
Pritam K. Rana - One of the best experts on this subject based on the ideXlab platform.
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Friction Stir Spot Welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheets: hook formation and Lap Shear Test performance
Elsevier, 2019Co-Authors: Karn Kumar Ravi, Ganesh R. Narayanan, Pritam K. RanaAbstract:In the present work, the effect of shoulder surface and pin profiles during friction stir spot welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheet has been attempted. Lap Shear Tests are performed to evaluate the mechanical performance. It is observed during Lap Shear Tests that a tool with square pin produced stronger joints. The square pin produced joints with moderate hook distance, hook width and hook height and larger bond area resulting in stronger joints. The joints made from tri-metallic sheet perform better than sandwich sheet joints. The tool with square pin generated a joint withstanding 1.4 kN fracture load in case of sandwich sheet, while it is 2.8 kN in case of tri-metallic sheet. The tri-metallic joints are characterized by larger bond area and larger hook distance. Nugget pull out is the failure mode seen in sandwich and tri-metallic sheets during Lap Shear Tests. Keywords: Friction stir, Spot welding, Sandwich sheet, Lap Shear Test, Hook, Fractur
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friction stir spot welding of al6082 t6 hdpe al6082 t6 hdpe al6082 t6 sandwich sheets hook formation and Lap Shear Test performance
Journal of materials research and technology, 2019Co-Authors: Karn Kumar Ravi, Ganesh R. Narayanan, Pritam K. RanaAbstract:Abstract In the present work, the effect of shoulder surface and pin profiles during friction stir spot welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheet has been attempted. Lap Shear Tests are performed to evaluate the mechanical performance. It is observed during Lap Shear Tests that a tool with square pin produced stronger joints. The square pin produced joints with moderate hook distance, hook width and hook height and larger bond area resulting in stronger joints. The joints made from tri-metallic sheet perform better than sandwich sheet joints. The tool with square pin generated a joint withstanding 1.4 kN fracture load in case of sandwich sheet, while it is 2.8 kN in case of tri-metallic sheet. The tri-metallic joints are characterized by larger bond area and larger hook distance. Nugget pull out is the failure mode seen in sandwich and tri-metallic sheets during Lap Shear Tests.
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Friction Stir Spot Welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheets: hook formation and Lap Shear Test performance
Journal of materials research and technology, 2018Co-Authors: Karn Kumar Ravi, R. Ganesh Narayanan, Pritam K. RanaAbstract:Abstract In the present work, the effect of shoulder surface and pin profiles during friction stir spot welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheet has been attempted. Lap Shear Tests are performed to evaluate the mechanical performance. It is observed during Lap Shear Tests that a tool with square pin produced stronger joints. The square pin produced joints with moderate hook distance, hook width and hook height and larger bond area resulting in stronger joints. The joints made from tri-metallic sheet perform better than sandwich sheet joints. The tool with square pin generated a joint withstanding 1.4 kN fracture load in case of sandwich sheet, while it is 2.8 kN in case of tri-metallic sheet. The tri-metallic joints are characterized by larger bond area and larger hook distance. Nugget pull out is the failure mode seen in sandwich and tri-metallic sheets during Lap Shear Tests.
Hoo-jeong Lee - One of the best experts on this subject based on the ideXlab platform.
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evaluation of drop reliability of sn 37pb solder cu joints using a high speed Lap Shear Test
Microelectronic Engineering, 2012Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Byunghoon Lee, Hoo-jeong LeeAbstract:This study provides a framework for evaluating the drop reliability of solder joints using a high-speed Lap-Shear Test. The Test specimens employed here were Sn-37Pb/Cu under bump metallization (UBM) solder joints and were aged for 120h at different temperatures (120, 150, and 170^[email protected]?) to examine the effects of aging. We Tested them at different loading speeds in the range of 0.01-500mm/s. A careful analysis of the stress-strain graphs attained from the Tests, coupled with characterization of the fracture surfaces, discloses that the fracture mode shifts from ductile to brittle as the loading speed escalates. A map of the fracture mode shows that how readily the mode transition with the loading speed occurs can be directly translated into the drop reliability of the solder joint, disclosing that the drop reliability would deteriorate as the aging temperature increases possibly due to the increased IMC thickness. These results underscore the utility of the experimental methodology adopted in this study to evaluate the drop reliability of solder joints.
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Evaluation of drop reliability of Sn-37Pb solder/Cu joints using a high speed Lap-Shear Test
Microelectronic Engineering, 2012Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Byunghoon Lee, Hoo-jeong LeeAbstract:This study provides a framework for evaluating the drop reliability of solder joints using a high-speed Lap-Shear Test. The Test specimens employed here were Sn-37Pb/Cu under bump metallization (UBM) solder joints and were aged for 120h at different temperatures (120, 150, and 170^[email protected]?) to examine the effects of aging. We Tested them at different loading speeds in the range of 0.01-500mm/s. A careful analysis of the stress-strain graphs attained from the Tests, coupled with characterization of the fracture surfaces, discloses that the fracture mode shifts from ductile to brittle as the loading speed escalates. A map of the fracture mode shows that how readily the mode transition with the loading speed occurs can be directly translated into the drop reliability of the solder joint, disclosing that the drop reliability would deteriorate as the aging temperature increases possibly due to the increased IMC thickness. These results underscore the utility of the experimental methodology adopted in this study to evaluate the drop reliability of solder joints.
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mechanical reliability evaluation of sn 37pb cu and sn 37pb enig solder joints by using high speed Lap Shear Test
Electronics Packaging Technology Conference, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Hoo-jeong LeeAbstract:This study utilized out high speed Lap-Shear Tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150°C and 170°C) were also Tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the Lap-Shear Tests and the fractured surfaces. This analysis generated insightful information that reveals three fracture surface types active in our samples. This study also elucidates different fracture mode for the Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints. This study successfully demonstrates that the analysis based on a high speed Lap-Shear Test could be critically used to evaluate the drop reliability of solder joints.
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Mechanical reliability evaluation of Sn-37Pb solder joint using high speed Lap-Shear Test
Microelectronic Engineering, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Jeong-won Yoon, Seung-boo Jung, Hoo-jeong LeeAbstract:This study utilized a high speed Lap-Shear Test to evaluate the mechanical behavior of Sn-37Pb/Cu under bump metallization (UBM) solder joints under high speed loading and hence the drop reliability. The samples were aged for 120h at different temperatures (150^o@?, 180^o@?) and then Tested at different displacement rates in the range of 0.01mm/s to 500mm/s to examine the effects of aging on the drop reliability. The combination of the stress-strain graphs captured from the Shear Tests and the fracture morphology analysis discloses that the aging at high temperatures has influenced critically the deformation behavior of the solder joints and the effects appears more significant at high strain rates. This study demonstrates a unique capability of a drop reliability evaluation method that utilizes a high speed Lap-Shear Test.
Seong-jae Jeon - One of the best experts on this subject based on the ideXlab platform.
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evaluation of drop reliability of sn 37pb solder cu joints using a high speed Lap Shear Test
Microelectronic Engineering, 2012Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Byunghoon Lee, Hoo-jeong LeeAbstract:This study provides a framework for evaluating the drop reliability of solder joints using a high-speed Lap-Shear Test. The Test specimens employed here were Sn-37Pb/Cu under bump metallization (UBM) solder joints and were aged for 120h at different temperatures (120, 150, and 170^[email protected]?) to examine the effects of aging. We Tested them at different loading speeds in the range of 0.01-500mm/s. A careful analysis of the stress-strain graphs attained from the Tests, coupled with characterization of the fracture surfaces, discloses that the fracture mode shifts from ductile to brittle as the loading speed escalates. A map of the fracture mode shows that how readily the mode transition with the loading speed occurs can be directly translated into the drop reliability of the solder joint, disclosing that the drop reliability would deteriorate as the aging temperature increases possibly due to the increased IMC thickness. These results underscore the utility of the experimental methodology adopted in this study to evaluate the drop reliability of solder joints.
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Evaluation of drop reliability of Sn-37Pb solder/Cu joints using a high speed Lap-Shear Test
Microelectronic Engineering, 2012Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Byunghoon Lee, Hoo-jeong LeeAbstract:This study provides a framework for evaluating the drop reliability of solder joints using a high-speed Lap-Shear Test. The Test specimens employed here were Sn-37Pb/Cu under bump metallization (UBM) solder joints and were aged for 120h at different temperatures (120, 150, and 170^[email protected]?) to examine the effects of aging. We Tested them at different loading speeds in the range of 0.01-500mm/s. A careful analysis of the stress-strain graphs attained from the Tests, coupled with characterization of the fracture surfaces, discloses that the fracture mode shifts from ductile to brittle as the loading speed escalates. A map of the fracture mode shows that how readily the mode transition with the loading speed occurs can be directly translated into the drop reliability of the solder joint, disclosing that the drop reliability would deteriorate as the aging temperature increases possibly due to the increased IMC thickness. These results underscore the utility of the experimental methodology adopted in this study to evaluate the drop reliability of solder joints.
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mechanical reliability evaluation of sn 37pb cu and sn 37pb enig solder joints by using high speed Lap Shear Test
Electronics Packaging Technology Conference, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Hoo-jeong LeeAbstract:This study utilized out high speed Lap-Shear Tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150°C and 170°C) were also Tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the Lap-Shear Tests and the fractured surfaces. This analysis generated insightful information that reveals three fracture surface types active in our samples. This study also elucidates different fracture mode for the Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints. This study successfully demonstrates that the analysis based on a high speed Lap-Shear Test could be critically used to evaluate the drop reliability of solder joints.
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Mechanical reliability evaluation of Sn-37Pb solder joint using high speed Lap-Shear Test
Microelectronic Engineering, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Jeong-won Yoon, Seung-boo Jung, Hoo-jeong LeeAbstract:This study utilized a high speed Lap-Shear Test to evaluate the mechanical behavior of Sn-37Pb/Cu under bump metallization (UBM) solder joints under high speed loading and hence the drop reliability. The samples were aged for 120h at different temperatures (150^o@?, 180^o@?) and then Tested at different displacement rates in the range of 0.01mm/s to 500mm/s to examine the effects of aging on the drop reliability. The combination of the stress-strain graphs captured from the Shear Tests and the fracture morphology analysis discloses that the aging at high temperatures has influenced critically the deformation behavior of the solder joints and the effects appears more significant at high strain rates. This study demonstrates a unique capability of a drop reliability evaluation method that utilizes a high speed Lap-Shear Test.
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Mechanical Reliability Evaluation of Sn-37Pb/Cu and Sn-37Pb/ENIG Solder Joints by using High Speed Lap-Shear Test
2008 10th Electronics Packaging Technology Conference, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Seung-boo JungAbstract:This study utilized out high speed Lap-Shear Tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150°C and 170°C) were also Tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the Lap-Shear Tests and the fractured surfaces. This analysis generated insightful information that reveals three fracture surface types active in our samples. This study also elucidates different fracture mode for the Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints. This study successfully demonstrates that the analysis based on a high speed Lap-Shear Test could be critically used to evaluate the drop reliability of solder joints.
Seung-boo Jung - One of the best experts on this subject based on the ideXlab platform.
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evaluation of drop reliability of sn 37pb solder cu joints using a high speed Lap Shear Test
Microelectronic Engineering, 2012Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Byunghoon Lee, Hoo-jeong LeeAbstract:This study provides a framework for evaluating the drop reliability of solder joints using a high-speed Lap-Shear Test. The Test specimens employed here were Sn-37Pb/Cu under bump metallization (UBM) solder joints and were aged for 120h at different temperatures (120, 150, and 170^[email protected]?) to examine the effects of aging. We Tested them at different loading speeds in the range of 0.01-500mm/s. A careful analysis of the stress-strain graphs attained from the Tests, coupled with characterization of the fracture surfaces, discloses that the fracture mode shifts from ductile to brittle as the loading speed escalates. A map of the fracture mode shows that how readily the mode transition with the loading speed occurs can be directly translated into the drop reliability of the solder joint, disclosing that the drop reliability would deteriorate as the aging temperature increases possibly due to the increased IMC thickness. These results underscore the utility of the experimental methodology adopted in this study to evaluate the drop reliability of solder joints.
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Evaluation of drop reliability of Sn-37Pb solder/Cu joints using a high speed Lap-Shear Test
Microelectronic Engineering, 2012Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Byunghoon Lee, Hoo-jeong LeeAbstract:This study provides a framework for evaluating the drop reliability of solder joints using a high-speed Lap-Shear Test. The Test specimens employed here were Sn-37Pb/Cu under bump metallization (UBM) solder joints and were aged for 120h at different temperatures (120, 150, and 170^[email protected]?) to examine the effects of aging. We Tested them at different loading speeds in the range of 0.01-500mm/s. A careful analysis of the stress-strain graphs attained from the Tests, coupled with characterization of the fracture surfaces, discloses that the fracture mode shifts from ductile to brittle as the loading speed escalates. A map of the fracture mode shows that how readily the mode transition with the loading speed occurs can be directly translated into the drop reliability of the solder joint, disclosing that the drop reliability would deteriorate as the aging temperature increases possibly due to the increased IMC thickness. These results underscore the utility of the experimental methodology adopted in this study to evaluate the drop reliability of solder joints.
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mechanical reliability evaluation of sn 37pb cu and sn 37pb enig solder joints by using high speed Lap Shear Test
Electronics Packaging Technology Conference, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Seung-boo Jung, Hoo-jeong LeeAbstract:This study utilized out high speed Lap-Shear Tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150°C and 170°C) were also Tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the Lap-Shear Tests and the fractured surfaces. This analysis generated insightful information that reveals three fracture surface types active in our samples. This study also elucidates different fracture mode for the Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints. This study successfully demonstrates that the analysis based on a high speed Lap-Shear Test could be critically used to evaluate the drop reliability of solder joints.
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Mechanical reliability evaluation of Sn-37Pb solder joint using high speed Lap-Shear Test
Microelectronic Engineering, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Hak-joo Lee, Jong-woong Kim, Jeong-won Yoon, Seung-boo Jung, Hoo-jeong LeeAbstract:This study utilized a high speed Lap-Shear Test to evaluate the mechanical behavior of Sn-37Pb/Cu under bump metallization (UBM) solder joints under high speed loading and hence the drop reliability. The samples were aged for 120h at different temperatures (150^o@?, 180^o@?) and then Tested at different displacement rates in the range of 0.01mm/s to 500mm/s to examine the effects of aging on the drop reliability. The combination of the stress-strain graphs captured from the Shear Tests and the fracture morphology analysis discloses that the aging at high temperatures has influenced critically the deformation behavior of the solder joints and the effects appears more significant at high strain rates. This study demonstrates a unique capability of a drop reliability evaluation method that utilizes a high speed Lap-Shear Test.
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Mechanical Reliability Evaluation of Sn-37Pb/Cu and Sn-37Pb/ENIG Solder Joints by using High Speed Lap-Shear Test
2008 10th Electronics Packaging Technology Conference, 2008Co-Authors: Seong-jae Jeon, Seungmin Hyun, Seung-boo JungAbstract:This study utilized out high speed Lap-Shear Tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150°C and 170°C) were also Tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the Lap-Shear Tests and the fractured surfaces. This analysis generated insightful information that reveals three fracture surface types active in our samples. This study also elucidates different fracture mode for the Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints. This study successfully demonstrates that the analysis based on a high speed Lap-Shear Test could be critically used to evaluate the drop reliability of solder joints.
Karn Kumar Ravi - One of the best experts on this subject based on the ideXlab platform.
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Friction Stir Spot Welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheets: hook formation and Lap Shear Test performance
Elsevier, 2019Co-Authors: Karn Kumar Ravi, Ganesh R. Narayanan, Pritam K. RanaAbstract:In the present work, the effect of shoulder surface and pin profiles during friction stir spot welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheet has been attempted. Lap Shear Tests are performed to evaluate the mechanical performance. It is observed during Lap Shear Tests that a tool with square pin produced stronger joints. The square pin produced joints with moderate hook distance, hook width and hook height and larger bond area resulting in stronger joints. The joints made from tri-metallic sheet perform better than sandwich sheet joints. The tool with square pin generated a joint withstanding 1.4 kN fracture load in case of sandwich sheet, while it is 2.8 kN in case of tri-metallic sheet. The tri-metallic joints are characterized by larger bond area and larger hook distance. Nugget pull out is the failure mode seen in sandwich and tri-metallic sheets during Lap Shear Tests. Keywords: Friction stir, Spot welding, Sandwich sheet, Lap Shear Test, Hook, Fractur
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friction stir spot welding of al6082 t6 hdpe al6082 t6 hdpe al6082 t6 sandwich sheets hook formation and Lap Shear Test performance
Journal of materials research and technology, 2019Co-Authors: Karn Kumar Ravi, Ganesh R. Narayanan, Pritam K. RanaAbstract:Abstract In the present work, the effect of shoulder surface and pin profiles during friction stir spot welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheet has been attempted. Lap Shear Tests are performed to evaluate the mechanical performance. It is observed during Lap Shear Tests that a tool with square pin produced stronger joints. The square pin produced joints with moderate hook distance, hook width and hook height and larger bond area resulting in stronger joints. The joints made from tri-metallic sheet perform better than sandwich sheet joints. The tool with square pin generated a joint withstanding 1.4 kN fracture load in case of sandwich sheet, while it is 2.8 kN in case of tri-metallic sheet. The tri-metallic joints are characterized by larger bond area and larger hook distance. Nugget pull out is the failure mode seen in sandwich and tri-metallic sheets during Lap Shear Tests.
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Friction Stir Spot Welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheets: hook formation and Lap Shear Test performance
Journal of materials research and technology, 2018Co-Authors: Karn Kumar Ravi, R. Ganesh Narayanan, Pritam K. RanaAbstract:Abstract In the present work, the effect of shoulder surface and pin profiles during friction stir spot welding of Al6082-T6/HDPE/Al6082-T6/HDPE/Al6082-T6 sandwich sheet has been attempted. Lap Shear Tests are performed to evaluate the mechanical performance. It is observed during Lap Shear Tests that a tool with square pin produced stronger joints. The square pin produced joints with moderate hook distance, hook width and hook height and larger bond area resulting in stronger joints. The joints made from tri-metallic sheet perform better than sandwich sheet joints. The tool with square pin generated a joint withstanding 1.4 kN fracture load in case of sandwich sheet, while it is 2.8 kN in case of tri-metallic sheet. The tri-metallic joints are characterized by larger bond area and larger hook distance. Nugget pull out is the failure mode seen in sandwich and tri-metallic sheets during Lap Shear Tests.
