The Experts below are selected from a list of 57 Experts worldwide ranked by ideXlab platform
Z. Z. Zhou - One of the best experts on this subject based on the ideXlab platform.
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Research and Simulation on the Wear Uniformity of Lapping Plate
2016Co-Authors: Z. Z. ZhouAbstract:Abstract. Lapping Plate wear is of great influence on shape precision of workpiece. Investigation on the wear uniformity of uncertain eccentricity plane Lapping was carried out in this research. The relative velocity function of the Plate to the workpiece is obtained through kinematic analyses in the mode of uncertain eccentricity plane Lapping, and material removal rate (MRR) function and wear uniformity function were deduced based on Preston equation. Effects of the ratio and eccentricities on the wear uniformity are discussed in detail through MATLAB simulation. Theoretical analysis and simulation results show that the ratio k1 of workpiece revolution speed to Lapping Plate is the key to decide whether the Lapping Plate is lapped uniformly. Theoretically, when k1<0, the greater |k1 | is, the better the lapped uniformly of Lapping Plate can be. The ratio k2 of workpiece rotation speed to Lapping Plate has great influence on the lapped uniformly when k1 approximate 1, and k2 has little influence on the lapped uniformly when k1<0 or k1>1, Besides, a bit bigger eccentricity e1 is propitious to the Lapping uniformly of the Lapping Plate, and bigger eccentricity e2 are also helpful to Lapping uniformly of the Lapping Plate. And the conclusion could be extended to single-side plane Lapping and double-side plane Lapping process
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the Lapping experimental research based on multi unit Lapping Plate
Applied Mechanics and Materials, 2010Co-Authors: Wei Hang, Z. Z. Zhou, Fan Jiang, Yong DaiAbstract:A new process method called multi-unit-Lapping Plate process is proposed in this paper. This technique could reduce change of cutting depth owing to difference of grain size and protrusion height of surface abrasive of grinding Plate, and near equal-cutting-depth processing is realized. For characteristics and machining performance of multi-unit-Lapping, this paper reports the following studies: A new experiment was carried out with the optimal parameters and compared with the traditional Plate, under the same processing conditions. The results showed that the abrasive grains cutting depth changed obviously with multi-unit-Lapping Plate.
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research and simulation on the wear uniformity of Lapping Plate
Key Engineering Materials, 2007Co-Authors: Ju Long Yuan, Donghui Wen, Zhiwei Wang, W T Liu, Z. Z. ZhouAbstract:Lapping Plate wear is of great influence on shape precision of workpiece. Investigation on the wear uniformity of uncertain eccentricity plane Lapping was carried out in this research. The relative velocity function of the Plate to the workpiece is obtained through kinematic analyses in the mode of uncertain eccentricity plane Lapping, and material removal rate (MRR) function and wear uniformity function were deduced based on Preston equation. Effects of the ratio and eccentricities on the wear uniformity are discussed in detail through MATLAB simulation. Theoretical analysis and simulation results show that the ratio k1 of workpiece revolution speed to Lapping Plate is the key to decide whether the Lapping Plate is lapped uniformly. Theoretically, when k11, Besides, a bit bigger eccentricity e1 is propitious to the Lapping uniformly of the Lapping Plate, and bigger eccentricity e2 are also helpful to Lapping uniformly of the Lapping Plate. And the conclusion could be extended to single-side plane Lapping and double-side plane Lapping process.
Ju Long Yuan - One of the best experts on this subject based on the ideXlab platform.
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investigation to semi fixed abrasives Plate Lapping sus440 stainless steel
Advanced Materials Research, 2009Co-Authors: Qian Fa Deng, Donghui Wen, Feng Chen, Li Tao, Ju Long YuanAbstract:To obtain high surface quality and high finishing efficiency in machining SUS440 stainless steel, a novel machining technology employing a semi-fixed abrasive Plate (SFAP) is adopted. The SFAP is developed for preventing lapped surface from damage caused by larger particles (from grain size dispersion or from outside of processing area, larger particles could bring uneven load distribution on processing region). The effects of different parameters on the surface quality and the material removal rate (MRR) of SUS440 stainless steel which is lapped by SFAP are investigated in this paper. The control parameters of the Lapping process include the Lapping time, the load, the rotating speed of the Lapping Plate, and etc. SFAP of 800# SiC abrasive used, Experimental results indicate that SFAP can avoid the large scratch effectively and the surface roughness (Ra) of the workpiece could be improved from 250 nm to 50 nm in 12 Min. A nearly mirror-like surface can be obtained.
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research and simulation on the wear uniformity of Lapping Plate
Key Engineering Materials, 2007Co-Authors: Ju Long Yuan, Donghui Wen, Zhiwei Wang, W T Liu, Z. Z. ZhouAbstract:Lapping Plate wear is of great influence on shape precision of workpiece. Investigation on the wear uniformity of uncertain eccentricity plane Lapping was carried out in this research. The relative velocity function of the Plate to the workpiece is obtained through kinematic analyses in the mode of uncertain eccentricity plane Lapping, and material removal rate (MRR) function and wear uniformity function were deduced based on Preston equation. Effects of the ratio and eccentricities on the wear uniformity are discussed in detail through MATLAB simulation. Theoretical analysis and simulation results show that the ratio k1 of workpiece revolution speed to Lapping Plate is the key to decide whether the Lapping Plate is lapped uniformly. Theoretically, when k11, Besides, a bit bigger eccentricity e1 is propitious to the Lapping uniformly of the Lapping Plate, and bigger eccentricity e2 are also helpful to Lapping uniformly of the Lapping Plate. And the conclusion could be extended to single-side plane Lapping and double-side plane Lapping process.
H Rocha-gallardo - One of the best experts on this subject based on the ideXlab platform.
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Statistical characterization of the Lapping Plate surface morphology evolution in a diamond charging process
Measurement Science and Technology, 2008Co-Authors: Rodrigo Mayen-mondragon, O Montero-camacho, F.j. Espinoza-beltrán, José Martín Yánez-limón, Rafael Ramírez, Juan Muñoz-saldaña, H Rocha-gallardoAbstract:The topographical evolution of a Lapping Plate surface during a diamond charging process was followed by analysis of atomic force microscopy (AFM) images. AFM measurements were performed in the tapping mode on several Sn–Sb alloy Lapping Plates containing different amounts of encrusted diamond particles on their surface. Such Plates were processed under different charging times at the Lapping Plate Area of Hitachi Global Storage Technologies in Guadalajara, Mexico. Statistical functions were applied to the AFM data to determine the height and spatial characteristics of the Plate's surface roughness. The resulting probability density function of heights, height–height correlation function (HCF) and power spectral density (PSD) showed characteristic patterns of evolution related to the amount and distribution of diamond particles incorporated on the Plates. The HCF evolution proved how the locally non-flat initial Plate surface evolves into a self-affine fractal after the Plate is uniformly charged. Surface roughness parameters were found to increase during diamond charging up to a saturation value. The statistical analysis of surface slopes allowed determining the average angle of diamond edge protrusion. According to our results, the RMS roughness along with the HCF morphology analysis could be used to establish quality control measures for diamond charged Lapping Plates.
Lei Guo - One of the best experts on this subject based on the ideXlab platform.
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an experimental study on the abrasive machining process of electronic substrate material with a novel ultraviolet curable resin bond diamond Lapping Plate
IEEE Access, 2019Co-Authors: Lei Guo, Ioan D Marinescu, Xinrong Zhang, Chulhee Lee, Yihe Zhang, Jizhuang HuiAbstract:Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy consuming because of their superior material properties in physical and chemical behaviors. In this study, the ultraviolet-curable resin is introduced into the fabrication of the diamond abrasive Lapping Plate as a bonding agent. A practical manufacturing process is established in the laboratory to develop an ultraviolet-curable resin bond fixed abrasive Lapping Plate for the precision machining of sapphire substrates, the machining performance of which is examined through a series of comparative experiments among the conventional fixed-abrasive Lapping, the slurry-based Lapping and this originally developed Plate involved Lapping. The surface topography and surface roughness of the machined sapphire workpieces are measured to evaluate the surface quality, and the weight loss of the workpieces in each machining process is recorded to estimate the respective machining efficiency. The promising results achieved from the ultraviolet-curable resin Plate Lapping process, in terms of a relatively higher material removal rate and better surface quality, indicate that the occurrence of a corporate action integrating both the advantages of the fixed abrasive grains and loose abrasive grains. A summarized hypothesis is drawn to describe the dynamically balanced state of the hybrid precision abrasive machining process, in which the 2-body abrasion and 3-body abrasion material removal mechanism participate simultaneously and interconvert to each other continuously.
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basic research for the uv fixed abrasive Lapping Plate
Applied Mechanics and Materials, 2013Co-Authors: Ioan D Marinescu, Lei Guo, Peng WeiAbstract:The traditional Lapping procedure is based on a slurry process. This paper describes the development of a novel fixed abrasive Lapping Plate (UV-Plate) and investigates the basic property of ultraviolet-cured resins. The primary Lapping experiments are carried out. Experimental results show that the Lapping process performed with UV-Plate significantly increases machining efficiency. It is proved that the surface roughness of machined work-piece by UV-Plate is better compared with the conventional slurry Lapping Plate.
Donghui Wen - One of the best experts on this subject based on the ideXlab platform.
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experimental investigation on the effect of abrasive grain size on the Lapping uniformity of a sapphire wafer
4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 2009Co-Authors: Donghui Wen, Zhiwei Wang, Kehua ZhangAbstract:Experiments are taken to investigate the effect of abrasive grain size on the Lapping uniformity of sapphire wafer, macro and micro surface profiles are measured and compared by contact and contactless measurement methods. For W14 carbide boron abrasive Lapping process, rolling and extruding effects are the main material removal mechanism and leaves high density micro-crack on the lapped sapphire surface. On the other hand, W3.5 carbide boron abrasive grain performs a ductile cutting process for material remove process under the same operated parameters, only scratch on sapphire surface can be viewed by AFM. Experimental results show that abrasive grain size has a great effect on the surface integrity of the lapped sapphire, charging status of abrasive grain into the Lapping Plate and its effect on the surface integrity should be considered when choosing the abrasive grain size for precision Lapping process. Lapping uniformity both for macro and micro level, roughness and flatness of sapphire wafer can be achieved by using W3.5 carbide boron abrasive grain and acceptable by pre-polishing process.
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investigation to semi fixed abrasives Plate Lapping sus440 stainless steel
Advanced Materials Research, 2009Co-Authors: Qian Fa Deng, Donghui Wen, Feng Chen, Li Tao, Ju Long YuanAbstract:To obtain high surface quality and high finishing efficiency in machining SUS440 stainless steel, a novel machining technology employing a semi-fixed abrasive Plate (SFAP) is adopted. The SFAP is developed for preventing lapped surface from damage caused by larger particles (from grain size dispersion or from outside of processing area, larger particles could bring uneven load distribution on processing region). The effects of different parameters on the surface quality and the material removal rate (MRR) of SUS440 stainless steel which is lapped by SFAP are investigated in this paper. The control parameters of the Lapping process include the Lapping time, the load, the rotating speed of the Lapping Plate, and etc. SFAP of 800# SiC abrasive used, Experimental results indicate that SFAP can avoid the large scratch effectively and the surface roughness (Ra) of the workpiece could be improved from 250 nm to 50 nm in 12 Min. A nearly mirror-like surface can be obtained.
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research and simulation on the wear uniformity of Lapping Plate
Key Engineering Materials, 2007Co-Authors: Ju Long Yuan, Donghui Wen, Zhiwei Wang, W T Liu, Z. Z. ZhouAbstract:Lapping Plate wear is of great influence on shape precision of workpiece. Investigation on the wear uniformity of uncertain eccentricity plane Lapping was carried out in this research. The relative velocity function of the Plate to the workpiece is obtained through kinematic analyses in the mode of uncertain eccentricity plane Lapping, and material removal rate (MRR) function and wear uniformity function were deduced based on Preston equation. Effects of the ratio and eccentricities on the wear uniformity are discussed in detail through MATLAB simulation. Theoretical analysis and simulation results show that the ratio k1 of workpiece revolution speed to Lapping Plate is the key to decide whether the Lapping Plate is lapped uniformly. Theoretically, when k11, Besides, a bit bigger eccentricity e1 is propitious to the Lapping uniformly of the Lapping Plate, and bigger eccentricity e2 are also helpful to Lapping uniformly of the Lapping Plate. And the conclusion could be extended to single-side plane Lapping and double-side plane Lapping process.
