The Experts below are selected from a list of 2877 Experts worldwide ranked by ideXlab platform
Nicușor Alin Sîrbu - One of the best experts on this subject based on the ideXlab platform.
-
Heat affected zones in polymer Laser Marking
Journal of Thermal Analysis and Calorimetry, 2013Co-Authors: Ionel Danut Savu, Sorin Vasile Savu, Nicușor Alin SîrbuAbstract:Laser Marking is based on the Laser heating of the subjected material, the heating being below the melting temperature or thermal degradation starting point. Within and nearby the mark, the material is chemically, physically and mechanically affected. This means that the main characteristics are changing in such a way that the material is ageing. Thermal and mechanical analysis can be used to determine the modification of the material, which is important and necessary to know for predicting its use lifetime. This paper investigates the physical and mechanical modification of the polymer HDPE100, when Laser Marking is applied. Burst stress, elongation and relaxation modulus were determined for the base material, within the heat affected zone and within the Laser burned mark. Information on the crystallization rate and on the elongation viscosity is also reported. According to the results, the polyethylene has very fast crystallization and that affects the Marking process if lower than appropriate maintaining during heating process is applied. It becomes stabile after 0.23 min, when it is tested at 103 °C. The elongation viscosity was analysed and values of 105 Pa s were recorded for 10 s, which is a usual time of applying pressure. The performed analysis revealed about 10 % difference between the relaxation modulus of the irradiated and non-irradiated HDPE.
-
Heat affected zones in polymer Laser Marking
Journal of Thermal Analysis and Calorimetry, 2013Co-Authors: Ionel Danut Savu, Sorin Vasile Savu, Nicușor Alin SîrbuAbstract:Laser Marking is based on the Laser heating of the subjected material, the heating being below the melting temperature or thermal degradation starting point. Within and nearby the mark, the material is chemically, physically and mechanically affected. This means that the main characteristics are changing in such a way that the material is ageing. Thermal and mechanical analysis can be used to determine the modification of the material, which is important and necessary to know for predicting its use lifetime. This paper investigates the physical and mechanical modification of the polymer HDPE100, when Laser Marking is applied. Burst stress, elongation and relaxation modulus were determined for the base material, within the heat affected zone and within the Laser burned mark. Information on the crystallization rate and on the elongation viscosity is also reported. According to the results, the polyethylene has very fast crystallization and that affects the Marking process if lower than appropriate maintaining during heating process is applied. It becomes stabile after 0.23 min, when it is tested at 103 °C. The elongation viscosity was analysed and values of 105 Pa s were recorded for 10 s, which is a usual time of applying pressure. The performed analysis revealed about 10 % difference between the relaxation modulus of the irradiated and non-irradiated HDPE.
Duncan P. Hand - One of the best experts on this subject based on the ideXlab platform.
-
Efficient speckle-free Laser Marking using a spatial light modulator
Applied Physics A, 2014Co-Authors: Krystian L. Wlodarczyk, Jarno J. J. Kaakkunen, Pasi Vahimaa, Duncan P. HandAbstract:An approach for Laser Marking surfaces using a liquid–crystal-based spatial light modulator (LC-SLM) for beam patterning and manipulation is presented, designed to avoid the speckle interference problem which is a typical drawback of current SLM-based Laser Marking processes. In our approach, the LC-SLM is used to generate complex two-dimensional micropatterns (e.g., 20 × 20 datamatrices) with overall dimensions of
-
Efficient speckle-free Laser Marking using a spatial light modulator
Applied Physics A, 2013Co-Authors: Krystian L. Wlodarczyk, Jarno J. J. Kaakkunen, Pasi Vahimaa, Duncan P. HandAbstract:An approach for Laser Marking surfaces using a liquid–crystal-based spatial light modulator (LC-SLM) for beam patterning and manipulation is presented, designed to avoid the speckle interference problem which is a typical drawback of current SLM-based Laser Marking processes. In our approach, the LC-SLM is used to generate complex two-dimensional micropatterns (e.g., 20 × 20 datamatrices) with overall dimensions of < 320 by 320 μm. The micropatterns are generated in a series of 16 steps, using a Fresnel zone lens (FZL) combined with a computer-generated hologram (CGH); for each step the whole kinoform (FZL + CGH) is spatially shifted off-axis by a different amount of pixels to build-up the required pattern. In comparison with other SLM-based Laser Marking approaches already reported in the literature, our method not only eliminates (or at least significantly reduces) unwanted speckle interference but also reduces the Laser power required for Marking.
-
Application of a liquid crystal spatial light modulator to Laser Marking
Applied Optics, 2011Co-Authors: Jonathan P. Parry, Rainer J. Beck, Jonathan D Shephard, Duncan P. HandAbstract:Laser Marking is demonstrated using a nanosecond (ns) pulse duration Laser in combination with a liquid crystal spatial light modulator to generate two-dimensional patterns directly onto thin films and bulk metal surfaces. Previous demonstrations of Laser Marking with such devices have been limited to low average power Lasers. Application in the ns regime enables more complex, larger scale marks to be generated with more widely available and industrially proven Laser systems. The dynamic nature of the device is utilized to improve mark quality by reducing the impact of the inherently speckled intensity distribution across the generated image and reduce thermal effects in the marked surface.
Ionel Danut Savu - One of the best experts on this subject based on the ideXlab platform.
-
Heat affected zones in polymer Laser Marking
Journal of Thermal Analysis and Calorimetry, 2013Co-Authors: Ionel Danut Savu, Sorin Vasile Savu, Nicușor Alin SîrbuAbstract:Laser Marking is based on the Laser heating of the subjected material, the heating being below the melting temperature or thermal degradation starting point. Within and nearby the mark, the material is chemically, physically and mechanically affected. This means that the main characteristics are changing in such a way that the material is ageing. Thermal and mechanical analysis can be used to determine the modification of the material, which is important and necessary to know for predicting its use lifetime. This paper investigates the physical and mechanical modification of the polymer HDPE100, when Laser Marking is applied. Burst stress, elongation and relaxation modulus were determined for the base material, within the heat affected zone and within the Laser burned mark. Information on the crystallization rate and on the elongation viscosity is also reported. According to the results, the polyethylene has very fast crystallization and that affects the Marking process if lower than appropriate maintaining during heating process is applied. It becomes stabile after 0.23 min, when it is tested at 103 °C. The elongation viscosity was analysed and values of 105 Pa s were recorded for 10 s, which is a usual time of applying pressure. The performed analysis revealed about 10 % difference between the relaxation modulus of the irradiated and non-irradiated HDPE.
-
Heat affected zones in polymer Laser Marking
Journal of Thermal Analysis and Calorimetry, 2013Co-Authors: Ionel Danut Savu, Sorin Vasile Savu, Nicușor Alin SîrbuAbstract:Laser Marking is based on the Laser heating of the subjected material, the heating being below the melting temperature or thermal degradation starting point. Within and nearby the mark, the material is chemically, physically and mechanically affected. This means that the main characteristics are changing in such a way that the material is ageing. Thermal and mechanical analysis can be used to determine the modification of the material, which is important and necessary to know for predicting its use lifetime. This paper investigates the physical and mechanical modification of the polymer HDPE100, when Laser Marking is applied. Burst stress, elongation and relaxation modulus were determined for the base material, within the heat affected zone and within the Laser burned mark. Information on the crystallization rate and on the elongation viscosity is also reported. According to the results, the polyethylene has very fast crystallization and that affects the Marking process if lower than appropriate maintaining during heating process is applied. It becomes stabile after 0.23 min, when it is tested at 103 °C. The elongation viscosity was analysed and values of 105 Pa s were recorded for 10 s, which is a usual time of applying pressure. The performed analysis revealed about 10 % difference between the relaxation modulus of the irradiated and non-irradiated HDPE.
Guo Fei - One of the best experts on this subject based on the ideXlab platform.
-
Application of USB interface technology in Laser Marking
Laser Journal, 2006Co-Authors: Guo FeiAbstract:After pointing out the disadvantages of traditional interface used in the Galvanometer Laser Marking for data transfer,this paper introd uces the advantages of USB interface in Laser Marking controller application, and analyzes its feasibility, Finally, the paper discusses USB data transfer mode fitting for Laser Marking and proposes some available suggestions.
-
Human-computer interface of Laser Marking controller based on USB interface
Laser Journal, 2006Co-Authors: Guo FeiAbstract:The friendly human-computer interface plays a very important role in the offline application of Laser Marking controller based on the USB interface, One LCD module YM12864F is used to display Chinese menu and control offline Laser Marking.
-
Design of Laser Marking controller based on USB
Laser Journal, 2005Co-Authors: Guo FeiAbstract:This paper first analyzes the shortcoming of traditional galvanometer-scan Laser Marking controller and the advantage of USB transmission,then puts forward a new design of Laser Marking controller based onUSB,and illuminates detailedly the running principle,the design of hardware and firmware,and the USB data flow types of Marking data.This controller has been applied to Laser Marking system and obtained good Marking effect.
Qi Wei Yu - One of the best experts on this subject based on the ideXlab platform.
-
Research on Laser Marking Speed Optimization by Using Genetic Algorithm
PLOS ONE, 2015Co-Authors: Dong Yun Wang, Qi Wei Yu, Yu ZhangAbstract:Laser Marking Machine is the most common coding equipment on product packaging lines. However, the speed of Laser Marking has become a bottleneck of production. In order to remove this bottleneck, a new method based on a genetic algorithm is designed. On the basis of this algorithm, a controller was designed and simulations and experiments were performed. The results show that using this algorithm could effectively improve Laser Marking efficiency by 25%.
-
Development of Embedded Laser Marking Controller Based on ARM9
Advanced Materials Research, 2013Co-Authors: Yu Fang, Dong Yun Wang, Qi Wei YuAbstract:The existing Laser Marking control systems are mainly based on PC and PCI Laser drivers. PC is used for editing Marking information and extracting Marking data. The rapid processing capacity of PC makes the Laser making machine achieve faster processing speed. However, it cannot be used in the outdoors and bad situations. In older to make the Laser Marking system widely adapt to various environments, an embedded Laser Marking controller is developed. It is based on ARM9 and LINUX. It can be easily operated and can achieve wonderful Marking.
-
Research on the Speed Optimization of Laser Marking
Advanced Materials Research, 2012Co-Authors: Qi Wei Yu, Dong Yun Wang, Jie YuAbstract:In the production line with Marking process, the Laser Marking speed can't meet the requirements of the high-speed. In order to solve this problem，the affecting factors for the speed of Laser Marking are analyzed. Combined with experiments，a new algorithm based on the vector trajectory optimization of the Marking information is proposed. The new algorithm changes the traditional vector trajectory method which is from left to right and from top to the bottom to a new restructuring trajectory. Experiments show that the method can improve Marking speed effectively.
-
Research on the Speed Optimization of Laser Marking
Advanced Materials Research, 2012Co-Authors: Qi Wei Yu, Dong Yun Wang, Jie YuAbstract:In the production line with Marking process, the Laser Marking speed can't meet the requirements of the high-speed. In order to solve this problem，the affecting factors for the speed of Laser Marking are analyzed. Combined with experiments，a new algorithm based on the vector trajectory optimization of the Marking information is proposed. The new algorithm changes the traditional vector trajectory method which is from left to right and from top to the bottom to a new restructuring trajectory. Experiments show that the method can improve Marking speed effectively.
