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Jaroslav Vlček - One of the best experts on this subject based on the ideXlab platform.

  • A study on the energy distribution for grid-assisting Magnetron Sputtering
    Surface & Coatings Technology, 2005
    Co-Authors: Min J. Jung, Jaroslav Vlček, P. Baroch, Jindřich Musil, Yun M. Chung, Kyung H. Nam, J. Houska, Jeon G. Han
    Abstract:

    The Ti film deposited by grid-attached Magnetron Sputtering possesses mirror-like surface RMS roughness of 0.6∼1.3 nm. On the other hand, Ti film deposited by conventional Magnetron Sputtering possesses a steeply increased RMS surface roughness of 6 nm. The cross-sectional TEM micrographs indicated that Ti coating by conventional process was composed of large columnar structures. But Ti coating using two grid-attached Magnetron type had a fine structures. By introducing a grid, the energy spectra of ions were characterized by a more extended high energy tail as compared to conventional Magnetron Sputtering. Therefore, more energetic ion bombardment generally enhances the depositing atom mobility in the case of the grid system as compared to the conventional system.

  • Reactive Magnetron Sputtering of thin films: present status and trends
    Thin Solid Films, 2005
    Co-Authors: Jindřich Musil, Jaroslav Vlček, P. Baroch, Kyung H. Nam, Jeung-whan Han
    Abstract:

    Abstract This paper gives a critical review of the present state of the knowledge in the field of dc reactive Magnetron Sputtering of compound films. It analyses (i) the hysteresis effect and the methods of its elimination, (ii) problem of stability of reactive Sputtering and (iii) deposition of transparent oxides in the transition mode of Sputtering. It shows the conditions under which oxides are reactively sputtered with high deposition rates aD oxide achieving up to approximately 77% of that of a pure metal aD Me, i.e. aD oxide/aD Me≈0.77. A special attention is devoted to the elimination of arcing in Sputtering of insulating films using pulsed dual Magnetron or Sputtering of oxides from a substoichiometric target. Also, the ion bombardment of films growing on insulating or unbiased substrates in dc pulsed Magnetron Sputtering is discussed in detail. As an example, a new possibility to form superhard single-phase films based on solid solutions using dc reactive Magnetron Sputtering is shown. At the end, future trends in dc reactive Magnetron Sputtering are outlined.

  • Magnetron Sputtering of hard nanocomposite coatings and their properties
    Surface & Coatings Technology, 2001
    Co-Authors: Jaroslav Vlček
    Abstract:

    The article reports on the present status of knowledge in the field of hard and superhard nanocomposite coatings prepared by Magnetron Sputtering. Special attention is devoted to the two-phase nanocomposites composed of one hard and one soft phase. Trends of the next development are outlined.

  • A perspective of Magnetron Sputtering in surface engineering
    Surface & Coatings Technology, 1999
    Co-Authors: Jindrich Musil, Jaroslav Vlček
    Abstract:

    Abstract Magnetron Sputtering is a very powerful process which is now currently and successfully used in many applications, particularly in microelectronics and surface engineering, for the production of films and coatings. Magnetron technology is, however, continuously developing because new advanced films with prescribed physical and functional properties are needed. This paper reports on duplex coatings, nanocomposite coatings, high-rate Magnetron Sputtering and self-Sputtering, i.e. new advances in Magnetron Sputtering technology which are of great importance for the future development of surface engineering. A great deal of attention is devoted to (i) the coating/substrate interface, (ii) the Magnetron Sputtering of nanostructured coatings with new properties due to small grains of about 10 nm and smaller and (iii) the replacement of ecologically damaging galvanic coating processes by high-rate Magnetron Sputtering and self-Sputtering.

K V Rao - One of the best experts on this subject based on the ideXlab platform.

J. Valter - One of the best experts on this subject based on the ideXlab platform.

  • Modelling of Magnetron Sputtering process
    Czechoslovak Journal of Physics, 2004
    Co-Authors: Tomas Kubart, Roman Novak, J. Valter
    Abstract:

    Magnetron Sputtering is a technique commonly used in modern industry for thin films deposition with an accurate control of the coating parameters. In the Magnetron Sputtering system the target material is sputtered off by plasma ions. The plasma is sustained by an electrical discharge and magnetically confined in the target vicinity. This results in much higher Sputtering rate, lower operating pressure and lower discharge voltage compared to a glow discharge diode Sputtering systems. The modelling of Magnetron Sputtering is essential for the design of new coating systems. It enables efficient, low-cost and time-saving optimisation of the system. In this paper information on modelling of Magnetrons at the Department of physics, Faculty of Mechanical Engineering CTU is given. Our work consists of two parts. The magnetic field of a given magnet array is first modelled by the finite element method and the computed field is then used for simulation of the erosion process by a Monte-Carlo model. The results are compared with measured erosion tracks and the accuracy of the model is discussed.

Parmanand Sharma - One of the best experts on this subject based on the ideXlab platform.

Andre Anders - One of the best experts on this subject based on the ideXlab platform.

  • Direct observation of spoke evolution in Magnetron Sputtering
    Applied Physics Letters, 2017
    Co-Authors: Andre Anders, Yuchen Yang
    Abstract:

    Ionization zones, also known as spokes, are plasma instabilities manifested as locations of intensified excitation and ionization over a Sputtering Magnetron's racetrack. Using a linear Magnetron and a streak camera, we were able to observe and quantify spoke dynamics. The technique allows us to image the onset and changes for both direct current Magnetron Sputtering (dcMS) and high power impulse Magnetron Sputtering (HiPIMS). Spokes in dcMS exhibit substructures. Spokes in HiPIMS are not stable as they shift along the racetrack; rather, they tend to grow or diminish, and they may split and merge. Their evolution can be interpreted in the context of localized electric fields and associated electron heating.

  • tutorial reactive high power impulse Magnetron Sputtering r hipims
    Journal of Applied Physics, 2017
    Co-Authors: Andre Anders
    Abstract:

    High Power Impulse Magnetron Sputtering (HiPIMS) is a coating technology that combines Magnetron Sputtering with pulsed power concepts. By applying power in pulses of high amplitude and a relatively low duty cycle, large fractions of sputtered atoms and near-target gases are ionized. In contrast to conventional Magnetron Sputtering, HiPIMS is characterized by self-Sputtering or repeated gas recycling for high and low sputter yield materials, respectively, and both for most intermediate materials. The dense plasma in front of the target has the dual function of sustaining the discharge and providing plasma-assistance to film growth, affecting the microstructure of growing films. Many technologically interesting thin films are compound films, which are composed of one or more metals and a reactive gas, most often oxygen or nitrogen. When reactive gas is added, non-trivial consequences arise for the system because the target may become “poisoned,” i.e., a compound layer forms on the target surface affecting ...