The Experts below are selected from a list of 62787 Experts worldwide ranked by ideXlab platform
Gavi K Reynolds - One of the best experts on this subject based on the ideXlab platform.
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twin screw granulation a literature review
Powder Technology, 2015Co-Authors: Timothy Cha Seem, N A Rowso, A Ingram, Zhenyu Huang, Marcel De Matas, Ia Gabbo, Gavi K ReynoldsAbstract:Abstract This review article addresses the currently available literature on twin screw granulation (TSG). TSG is an emerging technology rapidly gaining interest in the pharmaceutical industry as a method of continuous wet granulation. The control of the geometry of the granulator over the formation of granules and the mechanisms of granulation are discussed. Process parameters including liquid to solid ratio, binder viscosity, method of binder addition, screw speed and Material Feed rate and their control of granule quality are analysed. The need for further understanding of granulation mechanisms and the interaction between screw elements is highlighted, as well as the difficulties in equating process parameters between different granulators to ensure product consistency across sites. TSG is a process with great potential for implementation into continuous processing lines but process understanding must be developed to ensure predictable consistent granule quality.
Timothy Cha Seem - One of the best experts on this subject based on the ideXlab platform.
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twin screw granulation a literature review
Powder Technology, 2015Co-Authors: Timothy Cha Seem, N A Rowso, A Ingram, Zhenyu Huang, Marcel De Matas, Ia Gabbo, Gavi K ReynoldsAbstract:Abstract This review article addresses the currently available literature on twin screw granulation (TSG). TSG is an emerging technology rapidly gaining interest in the pharmaceutical industry as a method of continuous wet granulation. The control of the geometry of the granulator over the formation of granules and the mechanisms of granulation are discussed. Process parameters including liquid to solid ratio, binder viscosity, method of binder addition, screw speed and Material Feed rate and their control of granule quality are analysed. The need for further understanding of granulation mechanisms and the interaction between screw elements is highlighted, as well as the difficulties in equating process parameters between different granulators to ensure product consistency across sites. TSG is a process with great potential for implementation into continuous processing lines but process understanding must be developed to ensure predictable consistent granule quality.
Chang-jiu Li - One of the best experts on this subject based on the ideXlab platform.
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Gaseous Material capacity of open plasma jet in plasma spray-physical vapor deposition process
Applied Surface Science, 2018Co-Authors: Meng Zhang, Guan-jun Yang, Cheng-xin Li, Qiang Zhang, Chang-jiu LiAbstract:Abstract Plasma spray-physical vapor deposition (PS-PVD) process, emerging as a highly efficient hybrid approach, is based on two powerful technologies of both plasma spray and physical vapor deposition. The maximum production rate is affected by the Material Feed rate apparently, but it is determined by the Material vapor capacity of transporting plasma actually and essentially. In order to realize high production rate, the gaseous Material capacity of plasma jet must be fundamentally understood. In this study, the thermal characteristics of plasma were measured by optical emission spectrometry. The results show that the open plasma jet is in the local thermal equilibrium due to a typical electron number density from 2.1 × 1015 to 3.1 × 1015 cm−3. In this condition, the temperature of gaseous zirconia can be equal to the plasma temperature. A model was developed to obtain the vapor pressure of gaseous ZrO2 molecules as a two dimensional map of jet axis and radial position corresponding to different average plasma temperatures. The overall gaseous Material capacity of open plasma jet, take zirconia for example, was further established. This approach on evaluating Material capacity in plasma jet would shed light on the process optimization towards both depositing columnar coating and a high production rate of PS-PVD.
Ke Xiao - One of the best experts on this subject based on the ideXlab platform.
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polychlorinated dibenzo p dioxin and dibenzofuran and polychlorinated biphenyl emissions from different smelting stages in secondary copper metallurgy
Chemosphere, 2013Co-Authors: Jicheng Hu, Bing Zhang, Minghui Zheng, Ke XiaoAbstract:Abstract Secondary copper production has received much attention for its high emissions of polychlorinated dibenzo -p- dioxin and dibenzofuran (PCDD/F) reported in previous studies. These studies focused on the estimation of total PCDD/F and polychlorinated biphenyl (PCB) emissions from secondary copper smelters. However, large variations in PCDD/F and PCB emissions reported in these studies were not analyzed and discussed further. In this study, stack gas samples at different smelting stages (Feeding-fusion, oxidation and deoxidization) were collected from four plants to investigate variations in PCDD/F and PCB emissions and characteristics during the secondary copper smelting process. The results indicate that PCDD/F emissions occur mainly at the Feeding-fusion stage and these emissions contribute to 54–88% of the total emissions from the secondary copper smelting process. The variation in Feed Material and operating conditions at different smelting stages leads to the variation in PCDD/F emissions during the secondary copper smelting process. The total PCDD/F and PCB discharge (stack gas emission + fly ash discharge) is consistent with the copper scrap content in the raw Material in the secondary copper smelters investigated. On a production basis of 1 ton copper, the total PCDD/F and dl-PCB discharge was 102, 24.8 and 5.88 μg TEQ t −1 for the three plants that contained 100%, 30% and 0% copper scrap in their raw Material Feed, respectively.
N A Rowso - One of the best experts on this subject based on the ideXlab platform.
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twin screw granulation a literature review
Powder Technology, 2015Co-Authors: Timothy Cha Seem, N A Rowso, A Ingram, Zhenyu Huang, Marcel De Matas, Ia Gabbo, Gavi K ReynoldsAbstract:Abstract This review article addresses the currently available literature on twin screw granulation (TSG). TSG is an emerging technology rapidly gaining interest in the pharmaceutical industry as a method of continuous wet granulation. The control of the geometry of the granulator over the formation of granules and the mechanisms of granulation are discussed. Process parameters including liquid to solid ratio, binder viscosity, method of binder addition, screw speed and Material Feed rate and their control of granule quality are analysed. The need for further understanding of granulation mechanisms and the interaction between screw elements is highlighted, as well as the difficulties in equating process parameters between different granulators to ensure product consistency across sites. TSG is a process with great potential for implementation into continuous processing lines but process understanding must be developed to ensure predictable consistent granule quality.