The Experts below are selected from a list of 11841 Experts worldwide ranked by ideXlab platform

Zheng Cui - One of the best experts on this subject based on the ideXlab platform.

  • hybrid printing Metal Mesh transparent conductive films with lower energy photonically sintered copper tin ink
    2017
    Co-Authors: Zheng Chen, Shuangshuang Shao, Xiaolian Chen, Jinyong Zhuang, Liming Xie, Shuhong Nie, Zheng Cui
    Abstract:

    With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make Metal-Mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn Metal-Mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper Metal-Mesh TCFs.

  • embedded ag ni Metal Mesh with low surface roughness as transparent conductive electrode for optoelectronic applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polish...

  • Embedded Ag/Ni Metal-Mesh with Low Surface Roughness As Transparent Conductive Electrode for Optoelectronic Applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polished Ag/Ni Metal-Mesh TCE, a flexible quantum dot light-emitting diode (QLED) was fabricated with an efficiency of 10.4 cd/A and 3.2 lm/W at 1000 cd/m2

  • 27 5l late news paper hybrid printing of high resolution Metal Mesh as a transparent conductor for touch panels and oled displays
    2015
    Co-Authors: Zheng Cui, Yulong Gao
    Abstract:

    A hybrid printing technique has been developed to manufacture high resolution Metal Mesh as flexible transparent conductors. The Metal Mesh structures are made by embedding silver nanoparticles inks into trenches which are patterned by high resolution nanoimprinting technology. Compared to other nanosilver type or Metal Mesh type of transparent conductors, the new technology can make much finer Metal Mesh ( 88%). The transparent conductor sheets can be roll-to-roll printed, which offers significant cost advantage over ITO electrodes. The new technology has been successfully implemented in high volume manufacturing of touch panel sensors for displays, as well as adapted to making flexible OLED.

Xiaolian Chen - One of the best experts on this subject based on the ideXlab platform.

  • hybrid printing Metal Mesh transparent conductive films with lower energy photonically sintered copper tin ink
    2017
    Co-Authors: Zheng Chen, Shuangshuang Shao, Xiaolian Chen, Jinyong Zhuang, Liming Xie, Shuhong Nie, Zheng Cui
    Abstract:

    With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make Metal-Mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn Metal-Mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper Metal-Mesh TCFs.

  • embedded ag ni Metal Mesh with low surface roughness as transparent conductive electrode for optoelectronic applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polish...

  • Embedded Ag/Ni Metal-Mesh with Low Surface Roughness As Transparent Conductive Electrode for Optoelectronic Applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polished Ag/Ni Metal-Mesh TCE, a flexible quantum dot light-emitting diode (QLED) was fabricated with an efficiency of 10.4 cd/A and 3.2 lm/W at 1000 cd/m2

Liming Xie - One of the best experts on this subject based on the ideXlab platform.

  • hybrid printing Metal Mesh transparent conductive films with lower energy photonically sintered copper tin ink
    2017
    Co-Authors: Zheng Chen, Shuangshuang Shao, Xiaolian Chen, Jinyong Zhuang, Liming Xie, Shuhong Nie, Zheng Cui
    Abstract:

    With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make Metal-Mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn Metal-Mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper Metal-Mesh TCFs.

  • embedded ag ni Metal Mesh with low surface roughness as transparent conductive electrode for optoelectronic applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polish...

  • Embedded Ag/Ni Metal-Mesh with Low Surface Roughness As Transparent Conductive Electrode for Optoelectronic Applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polished Ag/Ni Metal-Mesh TCE, a flexible quantum dot light-emitting diode (QLED) was fabricated with an efficiency of 10.4 cd/A and 3.2 lm/W at 1000 cd/m2

Jinyong Zhuang - One of the best experts on this subject based on the ideXlab platform.

  • hybrid printing Metal Mesh transparent conductive films with lower energy photonically sintered copper tin ink
    2017
    Co-Authors: Zheng Chen, Shuangshuang Shao, Xiaolian Chen, Jinyong Zhuang, Liming Xie, Shuhong Nie, Zheng Cui
    Abstract:

    With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make Metal-Mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn Metal-Mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper Metal-Mesh TCFs.

  • embedded ag ni Metal Mesh with low surface roughness as transparent conductive electrode for optoelectronic applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polish...

  • Embedded Ag/Ni Metal-Mesh with Low Surface Roughness As Transparent Conductive Electrode for Optoelectronic Applications
    2017
    Co-Authors: Xiaolian Chen, Jinyong Zhuang, Liming Xie, Wenrui Guo, Changting Wei, Zheng Cui
    Abstract:

    Metal-Mesh is one of the contenders to replace indium tin oxide (ITO) as transparent conductive electrodes (TCEs) for optoelectronic applications. However, considerable surface roughness accompanying Metal-Mesh type of transparent electrodes has been the root cause of electrical short-circuiting for optoelectronic devices, such as organic light-emitting diode (OLED) and organic photovoltaic (OPV). In this work, a novel approach to making Metal-Mesh TCE has been proposed that is based on hybrid printing of silver (Ag) nanoparticle ink and electroplating of nickel (Ni). By polishing back the electroplated Ni, an extremely smooth surface was achieved. The fabricated Ag/Ni Metal-Mesh TCE has a surface roughness of 0.17 nm, a low sheet resistance of 2.1 Ω/□, and a high transmittance of 88.6%. The figure of merit is 1450, which is 30 times better than ITO. In addition, the Ag/Ni Metal-Mesh TCE shows outstanding mechanical flexibility and environmental stability at high temperature and humidity. Using the polished Ag/Ni Metal-Mesh TCE, a flexible quantum dot light-emitting diode (QLED) was fabricated with an efficiency of 10.4 cd/A and 3.2 lm/W at 1000 cd/m2

Jay L Guo - One of the best experts on this subject based on the ideXlab platform.

  • scalable solution processed fabrication strategy for high performance flexible transparent electrodes with embedded Metal Mesh
    2017
    Co-Authors: Arshad Khan, Sang Eon Lee, Taehee Jang, Ze Xiong, Cuiping Zhang, Jinyao Tang, Jay L Guo
    Abstract:

    Here, the authors report the embedded Metal-Mesh transparent electrode (EMTE), a new transparent electrode (TE) with a Metal Mesh completely embedded in a polymer film. This paper also presents a low-cost, vacuum-free fabrication method for this novel TE; the approach combines lithography, electroplating, and imprint transfer (LEIT) processing. The embedded nature of the EMTEs offers many advantages, such as high surface smoothness, which is essential for organic electronic device production; superior mechanical stability during bending; favorable resistance to chemicals and moisture; and strong adhesion with plastic film. LEIT fabrication features an electroplating process for vacuum-free Metal deposition and is favorable for industrial mass production. Furthermore, LEIT allows for the fabrication of Metal Mesh with a high aspect ratio (i.e., thickness to linewidth), significantly enhancing its electrical conductance without adversely losing optical transmittance. We demonstrate several prototypes of flexible EMTEs, with sheet resistances lower than 1 Ω/sq and transmittances greater than 90%, resulting in very high figures of merit (FoM) – up to 1.5 x 104 – which are amongst the best values in the published literature.

  • high performance flexible transparent electrode with an embedded Metal Mesh fabricated by cost effective solution process
    2016
    Co-Authors: Arshad Khan, Sang Eon Lee, Taehee Jang, Ze Xiong, Cuiping Zhang, Jinyao Tang, Jay L Guo
    Abstract:

    A new structure of flexible transparent electrodes is reported, featuring a Metal Mesh fully embedded and mechanically anchored in a flexible substrate, and a cost-effective solution-based fabrication strategy for this new transparent electrode. The embedded nature of the Metal-Mesh electrodes provides a series of advantages, including surface smoothness that is crucial for device fabrication, mechanical stability under high bending stress, strong adhesion to the substrate with excellent flexibility, and favorable resistance against moisture, oxygen, and chemicals. The novel fabrication process replaces vacuum-based Metal deposition with an electrodeposition process and is potentially suitable for high-throughput, large-volume, and low-cost production. In particular, this strategy enables fabrication of a high-aspect-ratio (thickness to linewidth) Metal Mesh, substantially improving conductivity without considerably sacrificing transparency. Various prototype flexible transparent electrodes are demonstrated with transmittance higher than 90% and sheet resistance below 1 ohm sq(-1) , as well as extremely high figures of merit up to 1.5 × 10(4) , which are among the highest reported values in recent studies. Finally using our embedded Metal-Mesh electrode, a flexible transparent thin-film heater is demonstrated with a low power density requirement, rapid response time, and a low operating voltage.