The Experts below are selected from a list of 87324 Experts worldwide ranked by ideXlab platform
Oliver Brand - One of the best experts on this subject based on the ideXlab platform.
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3D-Integrated and Multifunctional All-Soft Physical Microsystems Based on Liquid Metal for Electronic Skin Applications
Advanced Electronic Materials, 2018Co-Authors: Min Gu Kim, Hommood Alrowais, Oliver BrandAbstract:© 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. This paper presents 3D-integrated and multifunctional all-soft physical Microsystems, which are composed of a soft sensor, a soft interconnector, and a soft readout circuit. The Microsystems utilize gallium-based liquid metal (eutectic gallium-indium alloy, EGaIn) and poly(dimethylsiloxane) (PDMS) and are fabricated using an advanced EGaIn thin-line patterning technique based on soft lithography. Combining the scalable fabrication process and a vertical integration approach using EGaIn-filled soft vias, two types of all-soft physical Microsystems are investigated using analytical, numerical, and experimental approaches and demonstrated to highlight high-density integration, multifunctional sensing capability, as well as system-level flexibility and stretchability: (i) a finger-mountable strain sensing microsystem with reduced temperature sensitivity and (ii) a fingertip microsystem for simultaneous proximity, touch, and pressure sensing. The demonstrated fabrication and integration approaches provide a path towards all-soft and highly integrated wearable physical Microsystems for human-machine interfaces, soft robotics, and healthcare applications.
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1.15 - Packaging
Comprehensive Microsystems, 2008Co-Authors: Oliver BrandAbstract:The chapter provides an overview of packaging concepts for Microsystems and in particular microelectromechanical systems (MEMS). The chapter starts with a brief summary of microelectronics packaging, highlighting the concept of different packaging levels, chip interconnection techniques, and standard integrated circuit packages. The first section concludes with a comparison of microelectronics and Microsystems packaging requirements. The second part of the chapter covers zero-level packaging concepts, i.e. wafer-level packaging processes, which encapsulate the fragile MEMS/microsystem components before the dicing step. The last part of the chapter is dedicated to first-level packages for Microsystems, covering dicing, die attach and interconnect, and various concepts for non-electrical feedthroughs. The final section is enriched by a number of microsystem examples, which utilize ceramic packages, metal packages, plastic packages or chip-on-board technologies.
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Microsensor packaging
Microsystem Technologies, 2002Co-Authors: Oliver Brand, Henry BaltesAbstract:Packaging is crucial for the success of microsensors and Microsystems, and typically a major, if not dominating cost component. Benefiting from packaging methods for integrated circuits (IC), microsystem packaging currently strongly relies on customized solutions. The paper summarizes challenges in microsensor and microsystem packaging and briefly discusses current packaging trends. In the second part of the paper, a packaged low-cost CMOS thermal imager is presented. Its packaging is based on the direct attachment of a silicon infrared filter onto the CMOS sensor die. The final microsystem is further packaged in a plastic ball grid array (BGA) enabling subsequent assembly by standard surface mount technology.
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CMOS integrated Microsystems and nanosystems
Smart Structures and Materials 1999: Smart Electronics and MEMS, 1999Co-Authors: Henry Baltes, Oliver BrandAbstract:We review selected micro- and nano-systems developed recently at the Physical Electronics Laboratory of ETH Zurich using industrial CMOS technology in combination with post-processing micromachining and film deposition: (1) an infrared sensor microsystem for presence detection of persons, (2) calorimetric, capacitive, and gravimetric chemical sensor Microsystems for detection of volatile organic compounds in air, and (3) a parallel scanning AFM chip. The Microsystems combine sensor structures and read- out circuitry on a single chip.© (1999) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
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CMOS integrated Microsystems and nanosystems
1999Co-Authors: Henry Baltes, Oliver BrandAbstract:We review selected micro- and nano-systems developed recently at the Physical Electronics Laboratory of ETH Zurich using industrial CMOS technology in combination with post-processing micromachining and film deposition: (i) an infrared sensor microsystem for presence detection of persons, (ii) calorimetric, capacitive, and gravimetric chemical sensor Microsystems for detection of volatile organic compounds in air, and (iii) a parallel scanning AFM chip. The Microsystems combine sensor structures and read-out circuitry on a single chip.
John Alderman - One of the best experts on this subject based on the ideXlab platform.
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Selection of materials for reduced stress packaging of a microsystem
Sensors and Actuators A: Physical, 1999Co-Authors: Anthony Morrissey, G. Kelly, John AldermanAbstract:Miniaturisation of many types of sensors and actuators has been realised by the advances in micromachining and microfabrication. This has led to a wide range of applications including microfluidic systems, where developments have resulted in much research in the area of μTAS (micro total analysis systems), used especially in analytical chemistry and chromatography. Among the main benefits of microsystem technology are its contributions to cost reduction, reliability and improved performance. However, the packaging of Microsystems, especially microsensors, is one of the biggest limitations to their commercialisation as it can be the most costly part of sensor fabrication. This is because Microsystems place extra demands on packaging techniques. For example, most Microsystems need access to the outside world, other than electrical connection, in order to interact with the medium being measured or monitored. To reduce costs, a microsystem may be packaged in plastic but because of TCE (thermal coefficient of expansion) mismatches between different materials within the microsystem, the packaging process may generate high levels of stress which can negatively affect the system's operation and reliability. It is clear that conventional packaging approaches and materials are inapplicable to Microsystems. Three-dimensional packaging techniques have great potential for microsystem integration. This paper will discuss the selection of materials applicable to the 3D packaging of any microsystem, including those containing extremely delicate micromachined structures such as membranes for micropumps and pressure sensors.
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Microsystem packaging in 3D
Proceedings of SPIE, 1997Co-Authors: G. Kelly, John Alderman, C. Lyden, James Barrett, Anthony MorrisseyAbstract:Packaging influences the reliability and performance of Microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package is presented. Finite element techniques are used to analyze the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.
Eugene C. Nelson - One of the best experts on this subject based on the ideXlab platform.
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Microsystems in Health Care
2020Co-Authors: Julie J. Mohr, Paul Barach, Joseph P. Cravero, George T. Blike, Marjorie M. Godfrey, Paul B. Batalden, Eugene C. NelsonAbstract:As stated at the outset of the Microsystems in Health Care series, the health system is composed of a few basic parts—front-line clinical Microsystems, overarching macrosystems, and patient subpopulations needing care. (Part 1) Microsystems thinking makes several organizational assumptions: 1. Bigger systems (macrosystems) are made of smaller systems 2. These smaller systems (Microsystems) produce quality, safety, and cost outcomes at the front line of care 3. Ultimately the outcomes of the macrosystem can be no better than the Microsystems of which it is composed In addition, the microsystem is the logical locus for linkage between vision and delivery and therefore can and should act as the “agent for change” within a macrosystem. If strategically driven and if the performance of each individual microsystem is optimized, the Microsystems within a macrosystem can facilitate systematic transformation at all levels of the system. This article describes how the microsystem, as an agent for change, plays a critical and essential role in developing and deploying the macrosystem’s strategic plan.
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quality by design a clinical Microsystems approach
2010Co-Authors: Eugene C. NelsonAbstract:List of Tables, Figures, and Exhibits. Foreword by Donald M. Berwick. Preface. Acknowledgments. Introduction. The Editors. The Contributors. PART ONE: CASES AND PRINCIPLES. 1. Success Characteristics of High-Performing Microsystems: Learning from the Best (Eugene C. Nelson, Paul B. Batalden, Thomas P. Huber, Julie K. Johnson, Marjorie M. Godfrey, Linda A. Headrick,and John H. Wasson). 2. Developing High-Performing Microsystems (Eugene C. Nelson, Paul B. Batalden, William H. Edwards, Marjorie M. Godfrey, and Julie K. Johnson). 3. Leading Microsystems (Paul B. Batalden, Eugene C. Nelson, Julie K. Johnson, Marjorie M. Godfrey, Thomas P. Huber, Linda Kosnik, and Kerri Ashling). 4. Leading Macrosystems and Mesosystems for Microsystem Peak Performance (Paul B. Batalden, Eugene C. Nelson, Paul B. Gardent, and Marjorie M. Godfrey). 5. Developing Professionals and Improving Worklife (Thomas P. Huber, Marjorie M. Godfrey, Eugene C. Nelson, Julie K. Johnson, Christine Campbell, and Paul B. Batalden). 6. Planning Patient-Centered Services (Marjorie M. Godfrey, Eugene C. Nelson, John H. Wasson, Julie K. Johnson, and Paul B. Batalden). 7. Planning Patient-Centered Care (John H. Wasson, Marjorie M. Godfrey, Eugene C. Nelson, Julie K. Johnson, and Paul B. Batalden). 8. Improving Patient Safety (Julie K. Johnson, Paul Barach, Joseph P. Cravero, George T. Blike, Marjorie M. Godfrey, Paul B. Batalden, and Eugene C. Nelson). 9. Creating a Rich Information Environment (Eugene C. Nelson, Paul B. Batalden, Karen Homa, Marjorie M. Godfrey, Christine Campbell, Linda A. Headrick, Thomas P. Huber, Julie K. Johnson, and John H. Wasson). PART TWO: ACTIVATING THE ORGANIZATION AND THE DARTMOUTH MICROSYSTEM IMPROVEMENT CURRICULUM. 10. Overview of Path Forward and Introduction to Part Two. 11. Introduction to Microsystem Thinking. 12. Effective Meeting Skills I. 13. Assessing Your Microsystem with the 5 P's. 14. The Model for Improvement: PDSA!!. 15. Selecting Themes for Improvement. 16. Improvement Global Aim. 17. Process Mapping. 18. Specific Aim. 19. Cause and Effect Diagrams. 20. Effective Meeting Skills II: Brainstorming and Multi-Voting. 21. Change Concepts. 22. Measurement and Monitoring. 23. Action Plans and Gantt Charts. 24. Follow Through on Improvement: Storyboards, Data Walls, and Playbooks. 25. Conclusion: Continuing on the Path to Excellence. Appendix A: Primary Care Workbook. Name Index. Subject Index.
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clinical Microsystems part 1 the building blocks of health systems
The Joint Commission Journal on Quality and Patient Safety, 2008Co-Authors: Marjorie M. Godfrey, Paul B. Batalden, Eugene C. Nelson, Scott A Berry, Albert E Bothe, Karen E Mckinley, Craig N Melin, Stephen E MuethingAbstract:Article-at-a-Glance Background Wherever, however, and whenever health care is delivered—no matter the setting or population of patients—the body of knowledge on clinical Microsystems can guide and support innovation and peak performance. Many health care leaders and staff at all levels of their organizations in many countries have adapted microsystem knowledge to their local settings. Clinical Microsystems: A Panoramic View: How Do Clinical Microsystems Fit Together? As the patient's journey of care seeking and care delivery takes place over time, he or she will move into and out of an assortment of clinical Microsystems, such as a family practitioner's office, an emergency department, and an intensive care unit. This assortment of clinical Microsystems—combined with the patient's own actions to improve or maintain health—can be viewed as the patient's unique health system. This patient-centric view of a health system is the foundation of second-generation development for clinical Microsystems. Lessons from the Field These lessons, which are not comprehensive, can be organized under the familiar commands that are used to start a race: On Your Mark, Get Set, Go! … with a fourth category added—Reflect: Reviewing the Race. These insights are intended as guidance to organizations ready to strategically transform themselves. Conclusion Beginning to master and make use of microsystem principles and methods to attain macrosystem peak performance can help us knit together care in a fragmented health system, eschew archipelago building in favor of nation-building strategies, achieve safe and efficient care with reliable handoffs, and provide the best possible care and attain the best possible health outcomes.
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Microsystems in Health Care: Part 6. Designing Patient Safety into the Microsystem
The Joint Commission Journal on Quality and Patient Safety, 2003Co-Authors: Julie J. Mohr, Paul Barach, Joseph P. Cravero, George T. Blike, Marjorie M. Godfrey, Paul B. Batalden, Eugene C. NelsonAbstract:Article-at-a-Glance Background This article explores patient safety from a Microsystems perspective and from an injury epidemiological perspective and shows how to embed safety into a microsystem's operations. Microsystems patient safety scenario Allison, a 5-year-old preschooler with a history of "wheezy colds," and her mother interacted with several Microsystems as they navigated the health care system. At various points, the system failed to address Allison's needs. The Haddon matrix provides a useful framework for analyzing medical failures in patient safety, setting the stage for developing countermeasures. Case study The case study shows the types of failures that can occur in complex medical care settings such as those associated with pediatric procedural sedation. Six patient safety principles, such as "design systems to identify, prevent, absorb, and mitigate errors," can be applied in a clinical setting. In response to this particular case, its subsequent analysis, and the application of Microsystems thinking, the anesthesiology department of the Children's Hospital at Dartmouth developed the PainFree Program to provide optimal safety for sedated patients. Conclusion Safety is a property of a microsystem and it can be achieved only through thoughtful and systematic application of a broad array of process, equipment, organization, supervision, training, simulation, and teamwork changes.
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Microsystems in health care part 2 creating a rich information environment
The Joint Commission Journal on Quality and Patient Safety, 2003Co-Authors: Eugene C. Nelson, Julie J. Mohr, Marjorie M. Godfrey, Paul B. Batalden, Karen Homa, Christine M Campbell, Linda A Headrick, Thomas P Huber, John H WassonAbstract:Article-at-a-Glance Background A rich information environment supports the functioning of the small, functional, frontline units—the Microsystems—that provide most health care to most people. Three settings represent case examples of how clinical Microsystems use data in everyday practice to provide high-quality and cost-effective care. Cases At The Spine Center at Dartmouth, Lebanon, New Hampshire, a patient value compass, a one-page health status report, is used to determine if the provided care and services are meeting the patient's needs. In Summit, New Jersey, Overlook Hospital's emergency department (ED) uses uses real-time process monitoring on patient care cycle times, quality and productivity indicator tracking, and patient and customer satisfaction tracking. These data streams create an information pool that is actively used in this ED icrosystem—minute by minute, hourly, daily, weekly, and annually—to analyze performance patterns and spot flaws that require action. The Shock Trauma Intensive Care Unit (STRICU), Intermountain Health Care, Salt Lake City, uses a data sytstem to monitor the "wired" patient remotely and share information at any time in real time. Staff can complete shift reports in 10minutes. Discussion Information exchange is the interface that connects staff to patients and staff to staff within the microsystem; microsystem to microsystem; and microsystem to macro-organization.
Po-tsang Huang - One of the best experts on this subject based on the ideXlab platform.
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Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes
IEEE Transactions on Biomedical Circuits and Systems, 2017Co-Authors: Yu-chieh Huang, Shang Lin Wu, Hsiao Chun Chang, Yan Huei You, Jr Ming Chen, Yan Yu Huang, Yen Han Lin, Po-tsang Huang, Yu-chen Hu, Jeng-ren DuannAbstract:Highly integrated neural sensing Microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm 2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm × 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 μW per channel. The overall power of this microsystem is only 3.79 mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm × 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.
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2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications
Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 2014Co-Authors: Po-tsang Huang, Teng Chieh Huang, Tang Shuan Wang, Yu Rou Lin, Chuan An Cheng, Wen Wei Shen, Shang Lin Wu, Lei-chun Chou, Kuan-neng Chen, Jin-chern ChiouAbstract:Heterogeneously integrated and miniaturized neural sensing Microsystems for accurately capturing and classifying signals are crucial for brain function investigation and neural prostheses realization [1]. Many neural sensing Microsystems have been proposed to provide small form-factor and biocompatible properties, including stacked multichip [2, 3], microsystem with separated neural sensors [4], monolithic packaged microsystem [5] and through-silicon-via (TSV) based double-side integrated microsystem [6]. These heterogeneous biomedical devices are composed of sensors and CMOS circuits for biopotential acquisition, signal processing and transmission. However, the weak signals detected from sensors in [2-5] have to pass through a string of interconnections to the CMOS circuits by wire bonding. In view of this, TSV-based double-side integration [6] uses TSV arrays to transfer the weak signals from μ-probe arrays to CMOS circuits for reducing noises. Nevertheless, the double-side integration requires preserving large area for separate μ-probe arrays and TSV arrays, and the TSV fabrication process may induce damage on CMOS circuits.
Anthony Morrissey - One of the best experts on this subject based on the ideXlab platform.
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Selection of materials for reduced stress packaging of a microsystem
Sensors and Actuators A: Physical, 1999Co-Authors: Anthony Morrissey, G. Kelly, John AldermanAbstract:Miniaturisation of many types of sensors and actuators has been realised by the advances in micromachining and microfabrication. This has led to a wide range of applications including microfluidic systems, where developments have resulted in much research in the area of μTAS (micro total analysis systems), used especially in analytical chemistry and chromatography. Among the main benefits of microsystem technology are its contributions to cost reduction, reliability and improved performance. However, the packaging of Microsystems, especially microsensors, is one of the biggest limitations to their commercialisation as it can be the most costly part of sensor fabrication. This is because Microsystems place extra demands on packaging techniques. For example, most Microsystems need access to the outside world, other than electrical connection, in order to interact with the medium being measured or monitored. To reduce costs, a microsystem may be packaged in plastic but because of TCE (thermal coefficient of expansion) mismatches between different materials within the microsystem, the packaging process may generate high levels of stress which can negatively affect the system's operation and reliability. It is clear that conventional packaging approaches and materials are inapplicable to Microsystems. Three-dimensional packaging techniques have great potential for microsystem integration. This paper will discuss the selection of materials applicable to the 3D packaging of any microsystem, including those containing extremely delicate micromachined structures such as membranes for micropumps and pressure sensors.
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Microsystem packaging in 3D
Proceedings of SPIE, 1997Co-Authors: G. Kelly, John Alderman, C. Lyden, James Barrett, Anthony MorrisseyAbstract:Packaging influences the reliability and performance of Microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package is presented. Finite element techniques are used to analyze the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.