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Xingming Cheng - One of the best experts on this subject based on the ideXlab platform.
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Silane oligomer in epoxy Molding Compound
2018 China Semiconductor Technology International Conference (CSTIC), 2018Co-Authors: Zhen Wang, Lanxia Li, Xingming Cheng, Xiaojuan JiangAbstract:With the rapid development of semiconductor packages, the reliability requirement of the epoxy Molding Compound as the packaging material becomes more and more rigorous. Introducing adhesion prompter is one of the key methods to increase the reliability of epoxy Molding Compound, and silane coupling agent with different functional group was one of the most common choice of researchers. Compared to common silane, silane oligomer was partially hydrolyzed and contain more condensed functional groups, it might be a good promising candidate of adhesion promoter. Here, we tried silane oligomer as adhesion promoter to replace the silane in epoxy Molding Compound, and the properties of resulting epoxy Molding Compound with silane oligomers in have been tested. The results showed that compared to normal silane, silane oligomer accelerated the reaction speed of epoxy Molding Compound and the gel time (GT) and spiral flow (SF) all were shorten with the silane oligomer in. Epoxy Molding Compound with mercapto group silane oligomer A and amino group silane oligomer B all disclosed similar water absorption compared to that with normal silane in, while epoxy Molding Compound with epoxy group silane oligomer C in exhibited about 25% higher than that with normal silane in. Adhesion test revealed that epoxy Molding Compound with silane oligomer in all possessed higher adhesion on NiPaAu (PPF) leadframes with the value above 100 N after MSL3 test.
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Study on the high reliability performance and high thermal conductivity epoxy Molding Compound
2018 China Semiconductor Technology International Conference (CSTIC), 2018Co-Authors: Xingming Cheng, Zhen Wang, Yangyang DuanAbstract:High thermal conductivity Epoxy Molding Compound (EMC) was formulated by using fully spherical aluminum oxide. With 88% of filler content, it is able to achieve thermal conductivity of 3.0 W/(m.K) with high reliability. The effect of crystalline silica: spherical aluminum oxide ratio on thermal conductivity was also investigated. Types of resin which affected the adhesion, flexural strength and water absorption has a great impact on the reliability performance of semiconductor devices.
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Study of white epoxy Molding Compound for LED bracket
2017 China Semiconductor Technology International Conference (CSTIC), 2017Co-Authors: Lanxia Li, Xingming Cheng, Xiaojuan Jiang, Yangyang Duan, Dongen ZhangAbstract:Epoxy Molding Compound for LED bracket, with the merits of good resistance to heat and light damage as well as good reliability and warpage compared to traditional thermoplastic reflecting materials for LED bracket, such as Polyphthalamide (PPA) and Poly1,4-cyclohexylene dimethylene terephthalate (PCT), has becoming the focus of researchers. Here we studied the reflectance of the white epoxy Molding Compound from the aspect of epoxy resin, type of titanium dioxide, wax and wetting and dispersing additives. And the results disclosed that epoxy resin A with the structure in Fig.1 exhibited higher reflectance at 450nm after aged at 150 for 1000h with the value of 70% while epoxy resin B with the structure in Fig2. With the value of 50%. At the same time, epoxy resin A displayed higher water absorption than epoxy resin B. Meanwhile, the reflecting material titanium dioxide modified by silica, alumina as well as organics disclosed highest reflectance, and then is the titanium dioxide modified by silica and alumina, and the last one was that only modified by silica or alumina. Wax showed no significant difference on the reflectance due to the tiny addition. When it comes to the wetting and dispersing agent, with the increasing of the content of polyester type wetting and dispersing agent, the reflectance of the white epoxy Molding Compound decayed.
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The study on the moldability and reliability of epoxy Molding Compound
2017 China Semiconductor Technology International Conference (CSTIC), 2017Co-Authors: Yangyang Duan, Lanxia Li, Xingming Cheng, Dongen Zhang, Junyan GongAbstract:In this paper, different type of wax, wax content and hot hardness at 175°C on the release force and adhesion of Molding Compound were studied, The studies reveal that the hot hardness is playing a very important role to balance the conflict of reliability and moldability. With higher hot hardness of epoxy Molding Compound, the release force can be kept at same level with less wax content which can increase the adhesion significantly. To achieve the high reliability and long moldability, the best wax content should be near 0.2 and the hot hardness should be larger than 85.
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Study of epoxy Molding Compound with high dielectric constant
2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017Co-Authors: Lanxia Li, Xingming Cheng, Zhen WangAbstract:with the extending of the storage space capacity of semiconductor device, more and more important data in the business have been accumulated in the device. Thus, the security enhancement becomes the crucial thing must be solved. Fingerprint, due to its properties of “unique by individual” and “unchangeable through life” as well as free from entering password turns into the first choice of personal identification method. Epoxy Molding Compound (EMC) with high dielectric constant (Dk), as the supporting material of fingerprint authentication sensors becomes the research hotspot in the field. For the dielectric constant of the epoxy resin and phenolic resin were changeless with their structure change, more attempts have been carried out on changing the fillers of EMC. Nowadays, the most commonly used fillers are alumina and barium titanate. Here, we compared the epoxy Molding Compound filled with alumina and barium titanate, and found that with the increasing of the content of both alumina and barium titanate, the dielectric constant of epoxy Molding Compound increased, and the Dk value of EMC filled with all alumina was about 7, however EMC packed all with barium titanate possessed the Dk value as high as 25. Meanwhile, the thermal conductivity of EMC with increased with the loading level of alumina increase, and with the value as high as 2.6W/m.K. For the spherical structure of alumina, the EMC with alumina in disclosed better flowability than that with barium titanate in. At last, EMC filling with barium titanate was difficult to be colored, which needs more coloring agent than normal.
Seungbae Park - One of the best experts on this subject based on the ideXlab platform.
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Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound
IEEE Transactions on Components Packaging and Manufacturing Technology, 2015Co-Authors: Dipak Sengupta, Seungbae ParkAbstract:The stresses due to moisture saturation on microelectromechanical systems (MEMS) sensor devices after exposure to temperature cycling have been addressed. Moisture-, temperature-, and time-dependent material property of Molding Compounds for the MEMS devices were characterized. To determine the coefficient of hygroscopic swelling of a Molding Compound and diffusivity ( $D)$ of water in the Molding Compound, dimensional change and weight loss of moisture saturated samples at various temperatures were monitored by the digital image correlation method combined with a weight scale. To obtain the viscoelastic property of the Molding Compound, a series of stress relaxation tests was performed using dynamic mechanical analysis (DMA). To explain the moisture-induced viscoelastic behavior, a simple assumption was introduced based on the temperature of glass transition point ( $T_{g})$ shift from the DMA result. The experimental data were utilized in numerical simulations to estimate the temperature- and moisture-induced stress on MEMS sensor devices subjected to temperature cycles.
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Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound
IEEE Transactions on Components Packaging and Manufacturing Technology, 2015Co-Authors: Yeonsung Kim, Hohyung Lee, Ruiyang Liu, Dipak Sengupta, Dapeng Liu, Seungbae ParkAbstract:The stresses due to moisture saturation on microelectromechanical systems (MEMS) sensor devices after exposure to temperature cycling have been addressed. Moisture-, temperature-, and time-dependent material property of Molding Compounds for the MEMS devices were characterized. To determine the coefficient of hygroscopic swelling of a Molding Compound and diffusivity ([Formula Omitted] of water in the Molding Compound, dimensional change and weight loss of moisture saturated samples at various temperatures were monitored by the digital image correlation method combined with a weight scale. To obtain the viscoelastic property of the Molding Compound, a series of stress relaxation tests was performed using dynamic mechanical analysis (DMA). To explain the moisture-induced viscoelastic behavior, a simple assumption was introduced based on the temperature of glass transition point ([Formula Omitted] shift from the DMA result. The experimental data were utilized in numerical simulations to estimate the temperature- and moisture-induced stress on MEMS sensor devices subjected to temperature cycles.; The stresses due to moisture saturation on microelectromechanical systems (MEMS) sensor devices after exposure to temperature cycling have been addressed. Moisture-, temperature-, and time-dependent material property of Molding Compounds for the MEMS devices were characterized. To determine the coefficient of hygroscopic swelling of a Molding Compound and diffusivity ([Formula Omitted] of water in the Molding Compound, dimensional change and weight loss of moisture saturated samples at various temperatures were monitored by the digital image correlation method combined with a weight scale. To obtain the viscoelastic property of the Molding Compound, a series of stress relaxation tests was performed using dynamic mechanical analysis (DMA). To explain the moisture-induced viscoelastic behavior, a simple assumption was introduced based on the temperature of glass transition point ([Formula Omitted] shift from the DMA result. The experimental data were utilized in numerical simulations to estimate the temperature- and moisture-induced stress on MEMS sensor devices subjected to temperature cycles.;The stresses due to moisture saturation on microelectromechanical systems (MEMS) sensor devices after exposure to temperature cycling have been addressed. Moisture-, temperature-, and time-dependent material property of Molding Compounds for the MEMS devices were characterized. To determine the coefficient of hygroscopic swelling of a Molding Compound and diffusivity (D) of water in the Molding Compound, dimensional change and weight loss of moisture saturated samples at various temperatures were monitored by the digital image correlation method combined with a weight scale. To obtain the viscoelastic property of the Molding Compound, a series of stress relaxation tests was performed using dynamic mechanical analysis (DMA). To explain the moisture-induced viscoelastic behavior, a simple assumption was introduced based on the temperature of glass transition point (T g ) shift from the DMA result. The experimental data were utilized in numerical simulations to estimate the temperature- and moisture-induced stress on MEMS sensor devices subjected to temperature cycles.;
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Stress relaxation test of Molding Compound for MEMS packaging
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012Co-Authors: Seungbae Park, Xin ZhangAbstract:Polymer based materials are widely used in electronic packaging. The Molding Compound, in particular, comprises a significant portion of the package with the purpose of protecting the chips from the environment. Material characterization of Molding Compounds, therefore, has been a critical issue in predicting the thermo-mechanical behavior and reliability of electronic packaging. One of the distinctive features of polymers is viscoelasticity, which refers to an intermediate behavior between a solid and a liquid. To characterize time and temperature dependent characteristics of polymers, various test methods have been utilized. Among those methods, the stress relaxation test using dynamic mechanical analysis (DMA) is widely used. However, there are no standards or guidelines for performing stress relaxation test on Molding Compounds with DMA. In this study, DMA stress relaxation tests have been performed with the Molding Compound. The initial value of relaxation modulus from DMA was compared with the Young's modulus from tensile test. The temperature effect on the stress relaxation test was studied to determine the appropriate temperature profile. The sample thickness and strain dependency were also investigated. Finally, recommendations for proper future testing are proposed.
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Temperature dependency of coefficient of hygroscopic swelling of Molding Compound
2009 59th Electronic Components and Technology Conference, 2009Co-Authors: Seungbae Park, Xin Zhang, Haojun Zhang, Siu Lung NgAbstract:Many polymer based materials, such as Molding Compound and underfill, are commonly used in plastic encapsulated packages. In spite of many advantages, most of them, however, are hydrophilic and absorb moisture when exposed to a humid environment. Moisture absorption induces swelling and deformation in a package and leads to failure in some cases. For example, when polymer materials swell upon absorbing moisture, while the adjacent non-polymeric materials, such as lead frame and silicon chip, do not, this induces hygroscopic mismatch stresses in a package [1]. It has been reported that swelling induced stresses are comparable to thermally induced stresses [2]. In this study, a new faster and accurate CHS (coefficient of hygroscopic swelling) measurement method using DIC (Digital Image Correlation) was proposed to measure CHS of Molding Compound material at various temperatures (between 25degC to 180degC). With this measurement, temperature dependency of CHS was quantified and reported. In addition to DIC, the results were utilized by the combination of TGA (Thermal Gravitational Analysis)/TMA (Thermal Mechanical Analyzer) method and finite element analysis (FEA).
L. J. Ernst - One of the best experts on this subject based on the ideXlab platform.
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characterization and modeling the thermo mechanical cure dependent properties of epoxy Molding Compound
International Journal of Adhesion and Adhesives, 2012Co-Authors: M Sadeghinia, K. M. B. Jansen, L. J. ErnstAbstract:Abstract Semi-conductor devices are mostly encapsulated by epoxy Molding Compound (EMC) materials. During encapsulation stresses are generated due to the curing of the Molding Compound. Moreover, additional stresses will build up during cooling down from Molding to ambient temperature caused by the differences in the coefficient of thermal expansion. These residual stresses add up to the stresses generated during mechanical loading and may lead to product failure. The viscoelastic properties of the encapsulation material depend highly on temperature and degree of cure. In this paper the thermo-mechanical properties of an epoxy Molding Compound with and without filler are investigated both experimentally and theoretically. The cure dependent properties of the EMCs, likewise, the cure kinetics, coefficient of thermal expansion and cure shrinkage were measured using a Differential Scanning Calorimetry (DSC) and a GNOMIX high pressure dilatometer. In addition using a Dynamic Mechanical Analyzer (DMA) the time and temperature dependent storage modulus was measured and mastercurves were constructed.
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Establishing the critical fracture properties of the die backside-to-Molding Compound interface
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011Co-Authors: G. Schlottig, H. Pape, B. Wunderle, L. J. ErnstAbstract:This paper presents essential improvements to determining interfacial fracture properties of the silicon die-to-Molding Compound interface. The improvements affect specimen fabrication in two different Molding technologies and experimental methods using the mixed mode chisel (MMC) setup. We show how to overcome pre-test fracture of the delamination specimens, how to extend the previously aimed fracture mode mix range, how to reduce the number of experiments necessary and extrapolation methods in order to apply the interface data in failure models.
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High temperature storage influence on Molding Compound properties
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on, 2010Co-Authors: Jan De Vreugd, K. M. B. Jansen, Christian Böhm, L. J. Ernst, Reinhard PufallAbstract:An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymer-based composites like Molding Compounds are highly affected by the influence of temperature, relative humidity and degree of conversion. The effect of above mentioned internal and external circumstances are investigated extensively in the past. Surprisingly the effect of high temperature storage on the mechanical properties is scarcely studied. From literatures research it is concluded that high temperature storage and postcure treatments increases the glass transition temperature. Also a weight loss during high temperature storage is reported. Since thermal treatments are very common in micro electronic industry, it is relevant to understand in more detail the influence of thermal aging on the mechanical properties of Molding Compounds. In this research the effect of postcure and thermal aging on the mechanical properties of Molding Compounds is systematically studied. It turns out that postcure and thermal aging cause a broadening of the viscoelastic region, an increase in Tg, and increase in rubbery modulus and ongoing shrinkage of the Molding Compound. It is concluded that the change in properties can be attributed to a reaction of the Molding Compound with oxygen. This paper presents the observed change in properties caused by oxidation.
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Effect of postcure and thermal aging on Molding Compound properties
2009 11th Electronics Packaging Technology Conference, 2009Co-Authors: Jan De Vreugd, A. Sanchez Monforte, Angela Kessler, K. M. B. Jansen, Christian Böhm, L. J. Ernst, H PreuAbstract:Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like Molding Compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on the thermomechanical properties of Molding Compound is scarcely studied. Some studies are devoted to this topic but are not systematically carried out. The main conclusion of previous research is that the glass-transition temperature increases at increasing postcure time [1]. Also weight loss during aging is reported [2]. Since thermomechanical properties determine mainly the reliability of electronic devices it is essential to have knowledge on the effect of post mold cure treatment and thermal aging. In this research the influence of postcure and thermal aging is studied in a systematic way. It turns out that postcure and thermal aging treatment causes an increase in T g , a change in viscoelastic behavior, an increase of the rubbery modulus, and ongoing shrinkage of the Molding Compound. The change of these properties is attributed to the oxidation of the Molding Compound at high temperatures.
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modeling and characterization of Molding Compound properties during cure
Microelectronics Reliability, 2009Co-Authors: K. M. B. Jansen, Angela Kessler, H Preu, L. J. Ernst, C Bohm, C. Qian, Matthias StecherAbstract:Abstract During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between Molding Compound and die. These residual stresses add up to the stresses generated during thermal cycling and mechanical loading and may eventually lead to product failure. In this paper we focus on three commercial Molding Compounds and analyze in detail the increase in elastic modulus and the change in viscoelastic behaviour during cure. This was done with a special shear tool which allows to measure mechanical properties with sufficient accuracy in the liquid as well as in the solid state. The cure dependent viscoelastic material behaviour was modeled using a cure dependent shift factor and rubber modulus. The viscoelastic behaviour of the Molding Compounds is also shown not to be stable. During postcure the materials slowly continue to crosslink thereby systematically changing their viscoelastic behaviour. The material models presented here therefore only account for the initial curing stage and do not include postcure.
Lanxia Li - One of the best experts on this subject based on the ideXlab platform.
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Silane oligomer in epoxy Molding Compound
2018 China Semiconductor Technology International Conference (CSTIC), 2018Co-Authors: Zhen Wang, Lanxia Li, Xingming Cheng, Xiaojuan JiangAbstract:With the rapid development of semiconductor packages, the reliability requirement of the epoxy Molding Compound as the packaging material becomes more and more rigorous. Introducing adhesion prompter is one of the key methods to increase the reliability of epoxy Molding Compound, and silane coupling agent with different functional group was one of the most common choice of researchers. Compared to common silane, silane oligomer was partially hydrolyzed and contain more condensed functional groups, it might be a good promising candidate of adhesion promoter. Here, we tried silane oligomer as adhesion promoter to replace the silane in epoxy Molding Compound, and the properties of resulting epoxy Molding Compound with silane oligomers in have been tested. The results showed that compared to normal silane, silane oligomer accelerated the reaction speed of epoxy Molding Compound and the gel time (GT) and spiral flow (SF) all were shorten with the silane oligomer in. Epoxy Molding Compound with mercapto group silane oligomer A and amino group silane oligomer B all disclosed similar water absorption compared to that with normal silane in, while epoxy Molding Compound with epoxy group silane oligomer C in exhibited about 25% higher than that with normal silane in. Adhesion test revealed that epoxy Molding Compound with silane oligomer in all possessed higher adhesion on NiPaAu (PPF) leadframes with the value above 100 N after MSL3 test.
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Study of white epoxy Molding Compound for LED bracket
2017 China Semiconductor Technology International Conference (CSTIC), 2017Co-Authors: Lanxia Li, Xingming Cheng, Xiaojuan Jiang, Yangyang Duan, Dongen ZhangAbstract:Epoxy Molding Compound for LED bracket, with the merits of good resistance to heat and light damage as well as good reliability and warpage compared to traditional thermoplastic reflecting materials for LED bracket, such as Polyphthalamide (PPA) and Poly1,4-cyclohexylene dimethylene terephthalate (PCT), has becoming the focus of researchers. Here we studied the reflectance of the white epoxy Molding Compound from the aspect of epoxy resin, type of titanium dioxide, wax and wetting and dispersing additives. And the results disclosed that epoxy resin A with the structure in Fig.1 exhibited higher reflectance at 450nm after aged at 150 for 1000h with the value of 70% while epoxy resin B with the structure in Fig2. With the value of 50%. At the same time, epoxy resin A displayed higher water absorption than epoxy resin B. Meanwhile, the reflecting material titanium dioxide modified by silica, alumina as well as organics disclosed highest reflectance, and then is the titanium dioxide modified by silica and alumina, and the last one was that only modified by silica or alumina. Wax showed no significant difference on the reflectance due to the tiny addition. When it comes to the wetting and dispersing agent, with the increasing of the content of polyester type wetting and dispersing agent, the reflectance of the white epoxy Molding Compound decayed.
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The study on the moldability and reliability of epoxy Molding Compound
2017 China Semiconductor Technology International Conference (CSTIC), 2017Co-Authors: Yangyang Duan, Lanxia Li, Xingming Cheng, Dongen Zhang, Junyan GongAbstract:In this paper, different type of wax, wax content and hot hardness at 175°C on the release force and adhesion of Molding Compound were studied, The studies reveal that the hot hardness is playing a very important role to balance the conflict of reliability and moldability. With higher hot hardness of epoxy Molding Compound, the release force can be kept at same level with less wax content which can increase the adhesion significantly. To achieve the high reliability and long moldability, the best wax content should be near 0.2 and the hot hardness should be larger than 85.
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Study of epoxy Molding Compound with high dielectric constant
2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017Co-Authors: Lanxia Li, Xingming Cheng, Zhen WangAbstract:with the extending of the storage space capacity of semiconductor device, more and more important data in the business have been accumulated in the device. Thus, the security enhancement becomes the crucial thing must be solved. Fingerprint, due to its properties of “unique by individual” and “unchangeable through life” as well as free from entering password turns into the first choice of personal identification method. Epoxy Molding Compound (EMC) with high dielectric constant (Dk), as the supporting material of fingerprint authentication sensors becomes the research hotspot in the field. For the dielectric constant of the epoxy resin and phenolic resin were changeless with their structure change, more attempts have been carried out on changing the fillers of EMC. Nowadays, the most commonly used fillers are alumina and barium titanate. Here, we compared the epoxy Molding Compound filled with alumina and barium titanate, and found that with the increasing of the content of both alumina and barium titanate, the dielectric constant of epoxy Molding Compound increased, and the Dk value of EMC filled with all alumina was about 7, however EMC packed all with barium titanate possessed the Dk value as high as 25. Meanwhile, the thermal conductivity of EMC with increased with the loading level of alumina increase, and with the value as high as 2.6W/m.K. For the spherical structure of alumina, the EMC with alumina in disclosed better flowability than that with barium titanate in. At last, EMC filling with barium titanate was difficult to be colored, which needs more coloring agent than normal.
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Investigation of epoxy Molding Compound with high adhesion on PD plated lead frames
2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016Co-Authors: Lanxia Li, Xingming ChengAbstract:With the rapid development of the advance integrated circuit (IC) packaging, adhesion between epoxy Molding Compound (EMC) and leadframes has been defined as one of the most key factors influencing the reliability of integrated circuit, especially with the packages with the Pd(PPF's) pated leadframes. The objective of this work was to study an epoxy Molding Compound with high adhesion on PPFs as well as good moldability. In this study three different types of epoxy resins (showed in Figure1), hardeners (showed in Figure2) and catalysts were investigated. It was found that epoxy resin B showed higher adhesion on Ag while epoxy resin A as the lowest. The composition of A/B/C as the epoxy resin exhibited higher adhesion on PPF. Hardener E and F exhibited high adhesion on PPF especially hardener E, and further on, hardener E possess lower DMA modulus and Tg than the other two hardener. While hardener F shows the highest adhesion on Ag. When using the composition E/F as hardener, the adhesion on PPF was as high as that hardener E. EMC with phosphorous catalyst in disclosed lower water absorption than that with imidazole one in. The latent phosphorous catalyst showed higher HH and higher adhesion on Ag and PPF that the other two catalysts.
Peter Elsner - One of the best experts on this subject based on the ideXlab platform.
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virtual process chain of sheet Molding Compound development validation and perspectives
Composites Part B-engineering, 2019Co-Authors: Johannes Gorthofer, Nils Meyer, Tarkes Dora Pallicity, Ludwig Schottl, Anna Trauth, Malte Schemmann, Martin Hohberg, Pascal Pinter, Peter ElsnerAbstract:Abstract A virtual process chain for sheet Molding Compound (SMC) composites is established and validated by means of experimental investigations on a demonstrator structure. The flow in the compression Molding step is simulated via a Coupled-Eulerian-Lagrangian approach using an anisotropic non-Newtonian fluid flow model. Evolution of the fiber orientation distribution (FOD) is described by Jeffery's equation. The predicted FOD is mapped to structural simulations employing a neutral data format. A mean-field anisotropic damage model is used to predict the damage evolution in the demonstrator. Simulated FOD at the end of the compression Molding is validated by computer tomography. Structural simulations are validated by means of a cyclic four-point bending test on the demonstrator. The predicted results show increased accuracy with the experiments by transferring FOD data within the virtual process chain. Critical points of high damage concentrations leading to failure agree with the experimental observations.