The Experts below are selected from a list of 327 Experts worldwide ranked by ideXlab platform
Robert P. H. Chang - One of the best experts on this subject based on the ideXlab platform.
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Modeling and simulation for dye-sensitized solar cells
Applied Physics Letters, 2008Co-Authors: Virginia Yong, Robert P. H. ChangAbstract:We developed an equivalent circuit for dye-sensitized solar cells, which provides a more accurate presentation and a better fit to the experimental I-V curves and Nyquist Plots than earlier literature results, as verified by simulation. A simple expression for the estimation of the Warburg coefficient from the experimental Nyquist Plot is also proposed in this letter. The simulated I-V curves and Nyquist Plots are in good agreement with the experimental data. The interfacial charge transfer and recombination losses at the oxide/dye/electrolyte interface are found to be the most influential factor on the overall conversion efficiency.
Virginia Yong - One of the best experts on this subject based on the ideXlab platform.
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Modeling and simulation for dye-sensitized solar cells
Applied Physics Letters, 2008Co-Authors: Virginia Yong, Robert P. H. ChangAbstract:We developed an equivalent circuit for dye-sensitized solar cells, which provides a more accurate presentation and a better fit to the experimental I-V curves and Nyquist Plots than earlier literature results, as verified by simulation. A simple expression for the estimation of the Warburg coefficient from the experimental Nyquist Plot is also proposed in this letter. The simulated I-V curves and Nyquist Plots are in good agreement with the experimental data. The interfacial charge transfer and recombination losses at the oxide/dye/electrolyte interface are found to be the most influential factor on the overall conversion efficiency.
G. De Mey - One of the best experts on this subject based on the ideXlab platform.
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Dynamic thermal heat pipes analysis: thermal impedance in start-up condition
Microelectronics Journal, 2019Co-Authors: M. Felczak, G. De Mey, Boguslaw Wiecek, P. Chatzipanagiotou, V. ChatziathanasiouAbstract:Abstract Heat dissipation is one of the most important issues for electronics development. Heat pipes are one of the most efficient heat transporting devices on the market. This paper presents a dynamic analysis of a heat pipe in start-up condition. Through a theoretical analysis, an appropriate RC thermal model is proposed. From the proposed RC model network, the temperature is calculated and the thermal impedance Nyquist Plot is obtained. In order to validate the theoretical results several experimental measurements are conducted. In an arrangement including a heat pipe, a power step input is applied and the temperature is measured at the heat source. From the measured temperature, the thermal impedance Nyquist Plot is calculated and is juxtaposed with the one calculated from the proposed RC model network. From the comparison, the proposed RC model network is validated and the observed phenomena from the experimental measurements are explained. Thermal impedance Nyquist Plot obtained from the experiments was calculated.
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Influence of interface materials on the thermal impedance of electronic packages
International Communications in Heat and Mass Transfer, 2009Co-Authors: G. De Mey, Bjorn Vermeersch, J. Pilarski, M. Wójcik, M. Lasota, J. Banaszczyk, Andrzej NapieralskiAbstract:The thermal properties of different interface materials (grease, ceramic, silicone and mica) have been investigated using the thermal impedance Zth(jω) represented in a Nyquist Plot. It will be shown that an interface material not only influences the thermal resistance Rth = Zth(0) but the entire shape of the thermal impedance Nyquist Plot. From the wind tunnel experiments the specific contribution of the interface materials to the overall thermal resistance could be determined.
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Dynamic Thermal Analysis of a Power Amplifier
2006Co-Authors: J. Banaszczyk, G. De Mey, M. Janicki, A. Napieralski, B. Vermeersch, P. KawkaAbstract:This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the Nyquist Plot of the thermal impedance. The experiments carried out demonstrated the influence of the contact resistance and the position of the entire cooling assembly on the obtained results.
Kouta Kashiwamoto - One of the best experts on this subject based on the ideXlab platform.
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Technical Communique: Nyquist stability criterion of intrinsic zeros for continuous-time pure imaginary zeros
Automatica, 2002Co-Authors: Mitsuaki Ishitobi, Kouta KashiwamotoAbstract:This note treats a stability condition of the zeros of sampled systems corresponding to continuous-time pure imaginary zeros with multiplicity one for systems with the relative degree one. It is shown that the Nyquist Plot can be used to check the stability condition.
Andrzej Napieralski - One of the best experts on this subject based on the ideXlab platform.
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Influence of interface materials on the thermal impedance of electronic packages
International Communications in Heat and Mass Transfer, 2009Co-Authors: G. De Mey, Bjorn Vermeersch, J. Pilarski, M. Wójcik, M. Lasota, J. Banaszczyk, Andrzej NapieralskiAbstract:The thermal properties of different interface materials (grease, ceramic, silicone and mica) have been investigated using the thermal impedance Zth(jω) represented in a Nyquist Plot. It will be shown that an interface material not only influences the thermal resistance Rth = Zth(0) but the entire shape of the thermal impedance Nyquist Plot. From the wind tunnel experiments the specific contribution of the interface materials to the overall thermal resistance could be determined.