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Zeng Xiang-de - One of the best experts on this subject based on the ideXlab platform.

Y. Matsumura - One of the best experts on this subject based on the ideXlab platform.

  • Effect of Hot-filament Emitter on Magnetostrictive Thin Film Formation by Ion-Plating Process
    ACTUATOR 2018; 16th International Conference on New Actuators, 2018
    Co-Authors: N. Arai, M. Shinooka, K. Yatagai, Ryota Gemma, H. T. Uchida, Y. Matsumura
    Abstract:

    In this study, magnetostrictive thin films were prepared by ion Plating Process with a hot-filament electron emitter. In this type of ion Plating Process, highly excess energy can be introduced into deposited films. The excess energy of metal vapour particles is dependent not only on the kinetic energy of metal vapour ions but also on the ionization rate as the impinging rate of the ions on the substrate. The hot-filament electron emitter was used to increase the ionization rate. The ionization rate of Ni particles (ZNi+/ZNi) increased with electrons emission. The hot-filament electron emitter is effective in increasing the excess energy. It can be noted that effects of hot-filament electron emitter could be helpful to control solid solubility limit of thin film formation by ion Plating Process.

  • Effects of excess energy on supersaturated Fe–IIIB thin films with ion-Plating Process
    Materials Research Innovations, 2015
    Co-Authors: M. Amano, C. Niyomwaitaya, Y. Ooba, Akitaka Sakai, Y. Matsumura
    Abstract:

    AbstractIn this study, Fe–IIIB thin films were prepared by dual vapour source ion-Plating Process and the effects of excess energy on their nanostructure and magnetostrictive characteristics were investigated. The samples of Fe–40 at.-%Al, Fe–17 at.-%Ga and Fe–1.5 at.-%In showed the maximum value of magnetostriction were about 150, 200 and 80 ppm at 1200 kA m−1, respectively. The excess energy incidences of ions onto depositing films surfaces are key parameters for magnetostrictive properties. The excess energy was increased by escalating the impinging energy of evaporation particles with rising anode probe voltage and substrate bias voltage. In the ion-Plating Process, the excess energy was more than a mixture enthalpy of Fe and IIIB. The accumulated lattice distortion energy was enlarged by increasing the lattice expansion of the α-Fe bcc lattice. The excess energy in the ion-Plating Process can control the solid solubility limit and crystallographic characterisation of films.

  • Magnetostrictive characteristics of Fe-Al films formed by ion Plating Process
    2005 IEEE International Magnetics Conference (INTERMAG), 2005
    Co-Authors: K. Muramatsu, T. Tanakamaru, N Matsuoka, M Morita, M. Takeuchi, Y. Matsumura
    Abstract:

    The crystal structure and magnetostrictive properties of Fe-Al thin films prepared by ion Plating Process were investigated. Film composition, structure, magnetization and in-plane magnetostriction were obtained by energy dispersive X-ray spectroscopy, X-ray diffraction, vibrating sample magnetometer and cantilever method respectively. The film showed higher magnetostrictive susceptibility and larger magnetostriction at low magnetic fields.

Wei Zhi-gang - One of the best experts on this subject based on the ideXlab platform.

  • Plating Process of Chromium from Trivalent Chromium Bath
    Plating and Finishing, 2010
    Co-Authors: Wei Zhi-gang
    Abstract:

    An environmentally friendly chromium Plating Process from trivalent chromium solution was investigated.The effects of electroPlating time,pH value,temperature,stirring methodic and cathodeic current density on the chromium coating were determined.The results showed that the thickness of chromium coating was increased with the electroPlating time by a first-quick-then-slow down trend.A bright coating with a proper thickness could be obtained when the pH value was 3.5.The brightness of coating increased with increasing temperature,and reached to the maximum at temperature of 45℃ without stirring.This technique can be operated under a wider range of current density with the optimal condition of 4～6 A/dm2.

Dong Jian-li - One of the best experts on this subject based on the ideXlab platform.

Zhenlong Fang - One of the best experts on this subject based on the ideXlab platform.

  • hard chromium Plating Process of hard film mould of rubber component
    2010
    Co-Authors: Hailin Huang, Leyuan Wang, Zengbao Chen, Jing Zhu, Zhenlong Fang
    Abstract:

    The invention discloses a hard chromium Plating Process of a hard film mould of a rubber component, comprising the steps of pre-cleaning, activation, hard chromium Plating, post-cleaning, deoxidization and detection of the hard film mould. The hard chromium Plating Process is characterized in that Plating solution chemical components subject to the hard chromium Plating comprises the following contents: 200-250g/L of chromium trioxide, 1-1.2g/L of SO4 ion and 3-4g/L of Cr ion; the temperature of the Plating solution in electro-Plating is between 55 DEG C and 60 DEG C, the concentrationof anode current is between 25A/dm and 45A/dm and the electro-Plating time is between 25 minutes and 40 minutes; and the anode material for the hard chromium Plating selects lead-tin alloy materials which contain 7-10 percent of tin. The invention ensures that a groove of the hard film mould has even hard chromium Plating, improves the production efficiency and prolongs the service life ofthe hard film mould.