The Experts below are selected from a list of 39 Experts worldwide ranked by ideXlab platform
Xuezhong Wu - One of the best experts on this subject based on the ideXlab platform.
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a new stress Released Structure to improve the temperature stability of the butterfly vibratory gyroscope
Micromachines, 2019Co-Authors: Fenlan Ou, Tongqiao Miao, Dingbang Xiao, Xuezhong WuAbstract:This paper is devoted to discussing the influence of thermal stress on the performance of the Butterfly Vibratory Gyroscope (BFVG). In many gyroscopes, due to the material properties and the fabrication processes, the deformation caused by residual stress or thermal mechanical stress is of great concern since it directly affects the performance. Here, a new stress-Released Structure was proposed to reduce the deformation to improve BFVG’s performance considering the symmetry of the electrode and the miniaturization of the Structure. Its dimensional parameters relate to the effect of thermal stress release and the stiffness characteristics of the BFVG’s oblique beam. The single parameter analysis method was used to explore the influence of the parameters on the effect of thermal stress release to guide the optimal size of the final design. The effect of thermal stress release in the BFVG at the full range temperature was also tested after the fabrication. The results showed that the influence of thermal stress on the BFVG’s performance effectively reduced.
Fenlan Ou - One of the best experts on this subject based on the ideXlab platform.
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a new stress Released Structure to improve the temperature stability of the butterfly vibratory gyroscope
Micromachines, 2019Co-Authors: Fenlan Ou, Tongqiao Miao, Dingbang Xiao, Xuezhong WuAbstract:This paper is devoted to discussing the influence of thermal stress on the performance of the Butterfly Vibratory Gyroscope (BFVG). In many gyroscopes, due to the material properties and the fabrication processes, the deformation caused by residual stress or thermal mechanical stress is of great concern since it directly affects the performance. Here, a new stress-Released Structure was proposed to reduce the deformation to improve BFVG’s performance considering the symmetry of the electrode and the miniaturization of the Structure. Its dimensional parameters relate to the effect of thermal stress release and the stiffness characteristics of the BFVG’s oblique beam. The single parameter analysis method was used to explore the influence of the parameters on the effect of thermal stress release to guide the optimal size of the final design. The effect of thermal stress release in the BFVG at the full range temperature was also tested after the fabrication. The results showed that the influence of thermal stress on the BFVG’s performance effectively reduced.
Rob N. Candler - One of the best experts on this subject based on the ideXlab platform.
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Fabrication Process for Integrating Nanoparticles With Released Structures Using Photoresist Replacement of Sublimated p-Dichlorobenzene for Temporary Support
Journal of Microelectromechanical Systems, 2012Co-Authors: Yongha Hwang, Rob N. CandlerAbstract:This letter introduces a fabrication technique that enables deposition of a wide variety of materials on Released microelectromechanical systems devices by providing a temporary support layer of photoresist (PR). The technique is particularly useful for materials that cannot survive aggressive wet etchants or high-temperature processes. The novel step of the process involves continuous replacement of solid p-dichlorobenzene (p-DCB) by liquid PR as the p-DCB sublimates from a Released Structure, without ever allowing the Structure to dry. The PR serves as both a temporary support for the device and a mold for targeted deposition of the material. As a demonstration of the process, fully Released silicon microresonators were coupled with nanoparticles that would not survive common sacrificial oxide etch processes. The process is shown to produce nanoparticle-functionalized resonators that operate as functional resonant gas sensors.
D. K. Bhattacharya - One of the best experts on this subject based on the ideXlab platform.
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Process Design for Fabrication of Multi-stack MEMS Capacitive Push-Pull Accelerometer Based on SOI Technology
The Physics of Semiconductor Devices, 2019Co-Authors: Abha Panchal, Shankar Dutta, Ramjay Pal, Kapil Kumar Jain, D. K. BhattacharyaAbstract:The paper reports on process design for fabrication of a navigational grade ±30 g MEMS capacitive push-pull accelerometer based on SOI (Silicon-On-Insulator) technology using Pyrex Glass-Silicon-Pyrex Glass multi-stack. The accelerometer Structure is fabricated by DWP (Dissolve Wafer Process) technique. The complete fabrication process and Released Structure results after two wafers process (SOI and Pyrex-Glass) step are discussed in this paper. After the release of accelerometer Structure, another patterned glass wafer would be anodically bonded on top. The scheme of three wafer assembly of push-pull accelerometer is also proposed.
Tongqiao Miao - One of the best experts on this subject based on the ideXlab platform.
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a new stress Released Structure to improve the temperature stability of the butterfly vibratory gyroscope
Micromachines, 2019Co-Authors: Fenlan Ou, Tongqiao Miao, Dingbang Xiao, Xuezhong WuAbstract:This paper is devoted to discussing the influence of thermal stress on the performance of the Butterfly Vibratory Gyroscope (BFVG). In many gyroscopes, due to the material properties and the fabrication processes, the deformation caused by residual stress or thermal mechanical stress is of great concern since it directly affects the performance. Here, a new stress-Released Structure was proposed to reduce the deformation to improve BFVG’s performance considering the symmetry of the electrode and the miniaturization of the Structure. Its dimensional parameters relate to the effect of thermal stress release and the stiffness characteristics of the BFVG’s oblique beam. The single parameter analysis method was used to explore the influence of the parameters on the effect of thermal stress release to guide the optimal size of the final design. The effect of thermal stress release in the BFVG at the full range temperature was also tested after the fabrication. The results showed that the influence of thermal stress on the BFVG’s performance effectively reduced.