The Experts below are selected from a list of 63795 Experts worldwide ranked by ideXlab platform
Nilanjan Mitra - One of the best experts on this subject based on the ideXlab platform.
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non contact near field underwater explosion induced shock wave loading of submerged Rigid Structures nonlinear compressibility effects in fluid structure interaction
Journal of Applied Physics, 2012Co-Authors: Ritwik Ghoshal, Nilanjan MitraAbstract:A novel theory has been developed for underwater explosion induced shock wave loading considering nonlinear compressible medium both front and back of the free standing Rigid plate. Both analytical formulation and numerical simulations have been performed in this manuscript for different type of shock loading profiles, different plate masses as well as different backing conditions of the plate. The results obtained have been asymptotically validated against existing theories in acoustic range. Impulse transmission, maximum momentum transfer, and cavitation inception have been determined for different cases and have been shown to be dependent on the fluid structure interaction parameter as well as the backing condition of the plate. Impulse design transmission curves have also been developed for plates of intermediate mass for different shock intensities and profiles thereby removing the need to perform numerical simulations. The major conclusions of the paper are that nonlinear compressibility and varying...
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non contact near field underwater explosion induced shock wave loading of submerged Rigid Structures nonlinear compressibility effects in fluid structure interaction
Journal of Applied Physics, 2012Co-Authors: Ritwik Ghoshal, Nilanjan MitraAbstract:A novel theory has been developed for underwater explosion induced shock wave loading considering nonlinear compressible medium both front and back of the free standing Rigid plate. Both analytical formulation and numerical simulations have been performed in this manuscript for different type of shock loading profiles, different plate masses as well as different backing conditions of the plate. The results obtained have been asymptotically validated against existing theories in acoustic range. Impulse transmission, maximum momentum transfer, and cavitation inception have been determined for different cases and have been shown to be dependent on the fluid structure interaction parameter as well as the backing condition of the plate. Impulse design transmission curves have also been developed for plates of intermediate mass for different shock intensities and profiles thereby removing the need to perform numerical simulations. The major conclusions of the paper are that nonlinear compressibility and varying pressure back of the plate further enhance the beneficial effects of fluid-structure-interaction in reducing impulse transmitted to the structure. These results can be advantageously exploited for design and optimization of light weight underwater Structures with increased blast resistance.
Ritwik Ghoshal - One of the best experts on this subject based on the ideXlab platform.
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non contact near field underwater explosion induced shock wave loading of submerged Rigid Structures nonlinear compressibility effects in fluid structure interaction
Journal of Applied Physics, 2012Co-Authors: Ritwik Ghoshal, Nilanjan MitraAbstract:A novel theory has been developed for underwater explosion induced shock wave loading considering nonlinear compressible medium both front and back of the free standing Rigid plate. Both analytical formulation and numerical simulations have been performed in this manuscript for different type of shock loading profiles, different plate masses as well as different backing conditions of the plate. The results obtained have been asymptotically validated against existing theories in acoustic range. Impulse transmission, maximum momentum transfer, and cavitation inception have been determined for different cases and have been shown to be dependent on the fluid structure interaction parameter as well as the backing condition of the plate. Impulse design transmission curves have also been developed for plates of intermediate mass for different shock intensities and profiles thereby removing the need to perform numerical simulations. The major conclusions of the paper are that nonlinear compressibility and varying...
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non contact near field underwater explosion induced shock wave loading of submerged Rigid Structures nonlinear compressibility effects in fluid structure interaction
Journal of Applied Physics, 2012Co-Authors: Ritwik Ghoshal, Nilanjan MitraAbstract:A novel theory has been developed for underwater explosion induced shock wave loading considering nonlinear compressible medium both front and back of the free standing Rigid plate. Both analytical formulation and numerical simulations have been performed in this manuscript for different type of shock loading profiles, different plate masses as well as different backing conditions of the plate. The results obtained have been asymptotically validated against existing theories in acoustic range. Impulse transmission, maximum momentum transfer, and cavitation inception have been determined for different cases and have been shown to be dependent on the fluid structure interaction parameter as well as the backing condition of the plate. Impulse design transmission curves have also been developed for plates of intermediate mass for different shock intensities and profiles thereby removing the need to perform numerical simulations. The major conclusions of the paper are that nonlinear compressibility and varying pressure back of the plate further enhance the beneficial effects of fluid-structure-interaction in reducing impulse transmitted to the structure. These results can be advantageously exploited for design and optimization of light weight underwater Structures with increased blast resistance.
Jangung Park - One of the best experts on this subject based on the ideXlab platform.
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Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement
AMER CHEMICAL SOC, 2019Co-Authors: Young-geu Park, Anar Zhexembekova, Hyobeom Kim, Chang Young Lee, Jangung ParkAbstract:© 2019 American Chemical Society. The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wire
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three dimensional high resolution printing of carbon nanotube liquid metal composites with mechanical and electrical reinforcement
Nano Letters, 2019Co-Authors: Young Geun Park, Anar Zhexembekova, Hyobeom Kim, Chang Young Lee, Hyegi Min, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wires.
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three dimensional high resolution printing of carbon nanotube liquid metal composites with mechanical and electrical reinforcement
Nano Letters, 2019Co-Authors: Young Geun Park, Anar Zhexembekova, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composite...
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Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement
2019Co-Authors: Young-geu Park, Anar Zhexembekova, Hyobeom Kim, Chang Young Lee, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wires
Young Geun Park - One of the best experts on this subject based on the ideXlab platform.
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three dimensional high resolution printing of carbon nanotube liquid metal composites with mechanical and electrical reinforcement
Nano Letters, 2019Co-Authors: Young Geun Park, Anar Zhexembekova, Hyobeom Kim, Chang Young Lee, Hyegi Min, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wires.
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three dimensional high resolution printing of carbon nanotube liquid metal composites with mechanical and electrical reinforcement
Nano Letters, 2019Co-Authors: Young Geun Park, Anar Zhexembekova, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composite...
Anar Zhexembekova - One of the best experts on this subject based on the ideXlab platform.
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Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement
AMER CHEMICAL SOC, 2019Co-Authors: Young-geu Park, Anar Zhexembekova, Hyobeom Kim, Chang Young Lee, Jangung ParkAbstract:© 2019 American Chemical Society. The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wire
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three dimensional high resolution printing of carbon nanotube liquid metal composites with mechanical and electrical reinforcement
Nano Letters, 2019Co-Authors: Young Geun Park, Anar Zhexembekova, Hyobeom Kim, Chang Young Lee, Hyegi Min, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wires.
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three dimensional high resolution printing of carbon nanotube liquid metal composites with mechanical and electrical reinforcement
Nano Letters, 2019Co-Authors: Young Geun Park, Anar Zhexembekova, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composite...
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Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement
2019Co-Authors: Young-geu Park, Anar Zhexembekova, Hyobeom Kim, Chang Young Lee, Jangung ParkAbstract:The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for Rigid Structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wires
