Scalability Perspective

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The Experts below are selected from a list of 15 Experts worldwide ranked by ideXlab platform

Sang-don Lee - One of the best experts on this subject based on the ideXlab platform.

  • fan out package performance and Scalability Perspective
    Electronic Components and Technology Conference, 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (<200um thick) and competitive electrical performance and sensitivity performance are demonstrated. Extending this to new applications, a compact optical module has been designed in FOWLP and it proves to minimizing the signal loss of high resolution display information at a high transmission rate for HDMI 1.4 application. With through-via feature, FOWLP also offers PoP with heterogeneous integration of numerous active and passive components (~100 ea) offering flexible module product design. PLP is also discussed as the mass production technology with key technical aspects.

  • Fan Out Package: Performance and Scalability Perspective
    2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (

Jong Heon Kim - One of the best experts on this subject based on the ideXlab platform.

  • fan out package performance and Scalability Perspective
    Electronic Components and Technology Conference, 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (<200um thick) and competitive electrical performance and sensitivity performance are demonstrated. Extending this to new applications, a compact optical module has been designed in FOWLP and it proves to minimizing the signal loss of high resolution display information at a high transmission rate for HDMI 1.4 application. With through-via feature, FOWLP also offers PoP with heterogeneous integration of numerous active and passive components (~100 ea) offering flexible module product design. PLP is also discussed as the mass production technology with key technical aspects.

  • Fan Out Package: Performance and Scalability Perspective
    2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (

Eung Ju Lee - One of the best experts on this subject based on the ideXlab platform.

  • fan out package performance and Scalability Perspective
    Electronic Components and Technology Conference, 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (<200um thick) and competitive electrical performance and sensitivity performance are demonstrated. Extending this to new applications, a compact optical module has been designed in FOWLP and it proves to minimizing the signal loss of high resolution display information at a high transmission rate for HDMI 1.4 application. With through-via feature, FOWLP also offers PoP with heterogeneous integration of numerous active and passive components (~100 ea) offering flexible module product design. PLP is also discussed as the mass production technology with key technical aspects.

  • Fan Out Package: Performance and Scalability Perspective
    2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (

Young-tae Kwon - One of the best experts on this subject based on the ideXlab platform.

  • fan out package performance and Scalability Perspective
    Electronic Components and Technology Conference, 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (<200um thick) and competitive electrical performance and sensitivity performance are demonstrated. Extending this to new applications, a compact optical module has been designed in FOWLP and it proves to minimizing the signal loss of high resolution display information at a high transmission rate for HDMI 1.4 application. With through-via feature, FOWLP also offers PoP with heterogeneous integration of numerous active and passive components (~100 ea) offering flexible module product design. PLP is also discussed as the mass production technology with key technical aspects.

  • Fan Out Package: Performance and Scalability Perspective
    2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (

Jun Kyu Lee - One of the best experts on this subject based on the ideXlab platform.

  • fan out package performance and Scalability Perspective
    Electronic Components and Technology Conference, 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (<200um thick) and competitive electrical performance and sensitivity performance are demonstrated. Extending this to new applications, a compact optical module has been designed in FOWLP and it proves to minimizing the signal loss of high resolution display information at a high transmission rate for HDMI 1.4 application. With through-via feature, FOWLP also offers PoP with heterogeneous integration of numerous active and passive components (~100 ea) offering flexible module product design. PLP is also discussed as the mass production technology with key technical aspects.

  • Fan Out Package: Performance and Scalability Perspective
    2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
    Co-Authors: Jong Heon Kim, Young-tae Kwon, Yong Ho Kwon, Yong Woon Yeo, Young Mo Lee, Yoon Mook Park, Eung Ju Lee, Jun Kyu Lee, Nam Chul Kim, Sang-don Lee
    Abstract:

    Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor (

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