The Experts below are selected from a list of 210 Experts worldwide ranked by ideXlab platform
Tetsuya Homma - One of the best experts on this subject based on the ideXlab platform.
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Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-Scale Integrated Circuit multilevel interconnections
Materials Science and Engineering: R: Reports, 1998Co-Authors: Tetsuya HommaAbstract:This paper reviews low dielectric constant materials for interlayer dielectric films in ultralarge-Scale Integrated Circuit (ULSI) multilevel interconnections. The trends of ULSIs in the last decade were briefly described first. Then, the requirements for interlayer dielectric film properties and their formation techniques were explained. They are: (1) a low dielectric constant, (2) a surface planarity, (3) a gap-filling capability, and (4) a low residual stress. In contrast with the requirements, the interlayer dielectric films and related technologies developed in the last decade were reviewed. In the requirements, the low dielectric constant materials are strongly required because the device performance has been limited by signal propagation time and cross-talk in the multilevel interconnections. Furthermore, the low dielectric constant is also required for reduction of power consumption in ULSI operation. Finally, the low dielectric constant materials were summarized, and future trends of the low dielectric constant interlayer dielectric film technologies are discussed.
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Properties of liquid-phase-deposited SiO2 films for interlayer dielectrics in ultralarge-Scale Integrated Circuit multilevel interconnections
Thin Solid Films, 1994Co-Authors: Tetsuya Homma, Y. MuraoAbstract:Abstract Properties of a new fluorinated SiO2 film for interlayer dielectrics in multilevel interconnections of ultralarge-Scale Integrated Circuits (ULSIs) are investigated. The fluorinated SiO2 films are formed at 35 °C by a liquid phase deposition (LPD) technique using a supersaturated hydrofluosilicic acid (H2SiF6) aqueous solution. The LPD SiO2 film surface profiles on polysilicon and aluminum wirings are flat enough, indicating that the LPD technique has good capability for the surface planarization of interlayer dielectric films. The compositions of as-deposited LPD SiO2 films and those annealed at 400 and 900 °C are SiO1.85F0.15, SiO1.85F0.15 and SiO1.90F0.10 respectively. The LPD SiO2 film deposition mechanism is explained as follows: (i) fluorosilanols [FnSi(OH)4−n] formation; (ii) fluorosilanol oligomer formation by a catalytic reaction in the solution; (iii) oligomer adsorption onto the substrate surface; (iv) oligomer polymerization by a catalytic reaction. The absorption peak position, full width at half-maximum (FWHM) and absorption coefficient for the Si-O bond in the Fourier transform infrared spectra for the as-deposited LPD SiO2 films are 9.17 micrometer, 0.83 micrometer and 1.19 × 106 m-1, respectively, indicating that the films are formed by tightly bonded Si-O networks. The as-deposited LPD SiO2 films have a refractive index of 1.433, a density of 2.19 × 103 kg m-3, an etching rate (measured using 1:30 buffered hydrofluoric acid (HF) solution) of 83 nm min-1, and a residual stress of 20 MPa (tensile). The film shrinkages after annealing at 400 and 900 °C are 0.8% and 2.0% respectively. Although these properties are changed by annealing at 400 and 900 °C, these values are still better than those of SiO2 films deposited by chemical vapor deposition (CVD) at 400 °C for use as interlayer dielectric films. The LPD SiO2 films have better electrical properties, such as lower leakage current, higher dielectric breakdown strength (> 6.3 × 108 V m-1) and lower dielectric constant (
Kelvin H. Wagner - One of the best experts on this subject based on the ideXlab platform.
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Winner-take-all spatial light modulator.
Optics letters, 1992Co-Authors: Timothy M. Slagle, Kelvin H. WagnerAbstract:An optical winner-take-all spatial light modulator has been implemented with very-large-Scale Integrated-Circuit/liquid-crystal device technology. One-dimensional arrays varying in size from 2 to 64 units and a 32 × 32 unit two-dimensional array have been fabricated and have demonstrated winner-take-all behavior. These devices have potential uses in optical implementations of correlators, associative memories, and unsupervised learning systems.
Sean W. King - One of the best experts on this subject based on the ideXlab platform.
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Ultraviolet radiation effects on paramagnetic defects in low-κ dielectrics for ultralarge Scale Integrated Circuit interconnects
Applied Physics Letters, 2010Co-Authors: B. C. Bittel, Patrick M. Lenahan, Sean W. KingAbstract:The electronic properties of low-κ interlayer dielectric and etch stop layers are important issues in ultralarge Scale Integrated Circuits development. Leakage currents are critical problems that are not well understood. A topic of current interest is ultraviolet curing of these films. We report on electron spin resonance and electrical measurements of low-κ films with and without ultraviolet exposure. This work provides fundamental understanding of the deep level defects likely involved in leakage currents.
Mingshan Yang - One of the best experts on this subject based on the ideXlab platform.
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Synthesis of Phosphazene Flame Retardant and its Application in Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging
Advanced Materials Research, 2011Co-Authors: Mingshan Yang, Jian-wei LiuAbstract:The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of TPCTP was analyzed by FTIR in this paper. Using TPCTP synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-Scale Integrated Circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by TPCTP was up to UL 94 V0 rating(1.6mm) and the oxygen index of the EMC was up to 34.5%, which indicates that TPCTP has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, TPCTP accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.
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Preparation of Hexaphenylamine Cyclotriphosphazene and its Green Flame Retardance on Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging
Advanced Materials Research, 2011Co-Authors: Mingshan YangAbstract:The hexaphenylamine cyclotriphosphazene (HPACTPZ) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of HPACTPZ was analyzed by FTIR and NMR in this paper. Using HPACTPZ synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-Scale Integrated Circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by HPACTPZ was up to UL 94 V0 rating(3.2mm) and the oxygen index of the EMC was up to 35.8%, which indicates that HPACTPZ has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, HPACTPZ accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.
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Green flame retardance of epoxy molding compound for large-Scale Integrated Circuit packaging
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010Co-Authors: Mingshan Yang, Jian-wei Liu, Linkai LiAbstract:The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of TPCTP was analyzed by FTIR in this paper. Using TPCTP synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-Scale Integrated Circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by TPCTP was up to UL 94 V0 rating(1.6 mm) and the oxygen index of the EMC was up to 34.5%, which indicates that TPCTP has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, TPCTP accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.
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The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-Scale Integrated Circuits Packaging
2007 8th International Conference on Electronic Packaging Technology, 2007Co-Authors: Mingshan Yang, Linkai Li, Jie He, Wenyu XuAbstract:MEP (mono-functional epoxy group prepolymer) was prepared through reacting biphenol with epichlorohydrin, and the structure were determined by FTIR, XRD and polarizing microscope. Epoxy molding composite(EMC) used for the packaging of ultra-large-Scale Integrated Circuit (IC) was prepared by mixing the liquid crystalline epoxy resin with ortho-cresol novolac epoxy (ECN) using high-speed pre- mixing and twin roller mixing and the better formulation and process parameters had been obtained in this paper. The results have shown that the EMC has the ordered domain of liquid crystalline structure.
Timothy M. Slagle - One of the best experts on this subject based on the ideXlab platform.
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Winner-take-all spatial light modulator.
Optics letters, 1992Co-Authors: Timothy M. Slagle, Kelvin H. WagnerAbstract:An optical winner-take-all spatial light modulator has been implemented with very-large-Scale Integrated-Circuit/liquid-crystal device technology. One-dimensional arrays varying in size from 2 to 64 units and a 32 × 32 unit two-dimensional array have been fabricated and have demonstrated winner-take-all behavior. These devices have potential uses in optical implementations of correlators, associative memories, and unsupervised learning systems.
