The Experts below are selected from a list of 36138 Experts worldwide ranked by ideXlab platform
Chunqing Wang - One of the best experts on this subject based on the ideXlab platform.
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computer simulation of three dimensional castellated Solder Joint geometry in surface mount technology
Modelling and Simulation in Materials Science and Engineering, 1998Co-Authors: Guozhong Wang, Zhaonian Cheng, Chunqing WangAbstract:In this paper, the problem of the 3D castellated Solder Joint geometry of a leadless chip component in surface mount technology is investigated using the minimum potential energy theorem; the method of simulation of 3D Solder Joint geometry as a function of parameters of the design and manufacturing process through the Surface Evolver program is presented. The effects of Solder volume, pad extension and stand-off height on Solder Joint geometry are analysed. In addition, a primary estimate of optimal Solder volume and pad extension is obtained. Experimental verification shows that there is good agreement between experimental results and calculated ones.
Guangchen Xu - One of the best experts on this subject based on the ideXlab platform.
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effect of rare earth on mechanical creep fatigue property of snagcu Solder Joint
Journal of Alloys and Compounds, 2009Co-Authors: Weimin Xiao, Guangchen XuAbstract:Abstract In this paper, the effects of rare earth (RE) element additions on the mechanical creep–fatigue property of the Sn3.8Ag0.7Cu Solder Joint have been investigated. The results show that adding a small amount of the RE elements can evidently increase the creep–fatigue rupture lifetime of the Sn3.8Ag0.7Cu Solder Joint. The increase in the creep–fatigue property can be attributed to the reduction of the creep–fatigue damages and the change of microcrack propagation site during the fracture process, which depends on the refining of intermetallic compounds due to the RE elements. In addition, it is also found that adding the RE elements decreases the strain amplitude of the Solder Joint under the constant stress amplitude.
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Effect of rare earth on mechanical creep–fatigue property of SnAgCu Solder Joint
Journal of Alloys and Compounds, 2009Co-Authors: Weimin Xiao, Guangchen XuAbstract:Abstract In this paper, the effects of rare earth (RE) element additions on the mechanical creep–fatigue property of the Sn3.8Ag0.7Cu Solder Joint have been investigated. The results show that adding a small amount of the RE elements can evidently increase the creep–fatigue rupture lifetime of the Sn3.8Ag0.7Cu Solder Joint. The increase in the creep–fatigue property can be attributed to the reduction of the creep–fatigue damages and the change of microcrack propagation site during the fracture process, which depends on the refining of intermetallic compounds due to the RE elements. In addition, it is also found that adding the RE elements decreases the strain amplitude of the Solder Joint under the constant stress amplitude.
Guozhong Wang - One of the best experts on this subject based on the ideXlab platform.
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computer simulation of three dimensional castellated Solder Joint geometry in surface mount technology
Modelling and Simulation in Materials Science and Engineering, 1998Co-Authors: Guozhong Wang, Zhaonian Cheng, Chunqing WangAbstract:In this paper, the problem of the 3D castellated Solder Joint geometry of a leadless chip component in surface mount technology is investigated using the minimum potential energy theorem; the method of simulation of 3D Solder Joint geometry as a function of parameters of the design and manufacturing process through the Surface Evolver program is presented. The effects of Solder volume, pad extension and stand-off height on Solder Joint geometry are analysed. In addition, a primary estimate of optimal Solder volume and pad extension is obtained. Experimental verification shows that there is good agreement between experimental results and calculated ones.
Zhaonian Cheng - One of the best experts on this subject based on the ideXlab platform.
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computer simulation of three dimensional castellated Solder Joint geometry in surface mount technology
Modelling and Simulation in Materials Science and Engineering, 1998Co-Authors: Guozhong Wang, Zhaonian Cheng, Chunqing WangAbstract:In this paper, the problem of the 3D castellated Solder Joint geometry of a leadless chip component in surface mount technology is investigated using the minimum potential energy theorem; the method of simulation of 3D Solder Joint geometry as a function of parameters of the design and manufacturing process through the Surface Evolver program is presented. The effects of Solder volume, pad extension and stand-off height on Solder Joint geometry are analysed. In addition, a primary estimate of optimal Solder volume and pad extension is obtained. Experimental verification shows that there is good agreement between experimental results and calculated ones.
Weimin Xiao - One of the best experts on this subject based on the ideXlab platform.
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effect of rare earth on mechanical creep fatigue property of snagcu Solder Joint
Journal of Alloys and Compounds, 2009Co-Authors: Weimin Xiao, Guangchen XuAbstract:Abstract In this paper, the effects of rare earth (RE) element additions on the mechanical creep–fatigue property of the Sn3.8Ag0.7Cu Solder Joint have been investigated. The results show that adding a small amount of the RE elements can evidently increase the creep–fatigue rupture lifetime of the Sn3.8Ag0.7Cu Solder Joint. The increase in the creep–fatigue property can be attributed to the reduction of the creep–fatigue damages and the change of microcrack propagation site during the fracture process, which depends on the refining of intermetallic compounds due to the RE elements. In addition, it is also found that adding the RE elements decreases the strain amplitude of the Solder Joint under the constant stress amplitude.
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Effect of rare earth on mechanical creep–fatigue property of SnAgCu Solder Joint
Journal of Alloys and Compounds, 2009Co-Authors: Weimin Xiao, Guangchen XuAbstract:Abstract In this paper, the effects of rare earth (RE) element additions on the mechanical creep–fatigue property of the Sn3.8Ag0.7Cu Solder Joint have been investigated. The results show that adding a small amount of the RE elements can evidently increase the creep–fatigue rupture lifetime of the Sn3.8Ag0.7Cu Solder Joint. The increase in the creep–fatigue property can be attributed to the reduction of the creep–fatigue damages and the change of microcrack propagation site during the fracture process, which depends on the refining of intermetallic compounds due to the RE elements. In addition, it is also found that adding the RE elements decreases the strain amplitude of the Solder Joint under the constant stress amplitude.