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V. I. Dybkov - One of the best experts on this subject based on the ideXlab platform.
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doi:10.4028/www.scientific.net/SSP.138.153 Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders
2014Co-Authors: V. I. DybkovAbstract:Abstract. The Ni3Sn4 intermetallic layer occurs at the interface of nickel and the saturated or undersaturated Sn-base Solder Melt at 250-450 °C and dipping times of 300 to 2400 s. Mathematical equations are proposed to evaluate the thickness of the Ni3Sn4 layer formed under conditions of simultaneous dissolution in the undersaturated Solder Melt
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Interfacial interaction of solid cobalt with liquid Pb-free Sn–Bi–In–Zn–Sb Soldering alloys
Journal of Materials Science, 2009Co-Authors: V. I. Dybkov, V. G. Khoruzha, V. R. Sidorko, K. A. Meleshevich, A. V. Samelyuk, D. C. Berry, Kate BarmakAbstract:Dissolution kinetics of cobalt in liquid 87.5%Sn–7.5%Bi–3%In–1%Zn–1%Sb and 80%Sn–15%Bi–3%In–1%Zn–1%Sb Soldering alloys and phase formation at the cobalt–Solder interface have been investigated in the temperature range of 250–450 °C. The temperature dependence of the cobalt solubility in Soldering alloys was found to obey a relation of the Arrhenius type c _s = 4.06 × 10^2 exp (−46300/ RT ) mass% for the former alloy and c _s = 5.46 × 10^2 exp (−49200/ RT ) mass% for the latter, where R is in J mol^−1 K^−1 and T in K. For tin, the appropriate equation is c _s = 4.08 × 10^2 exp (−45200/ RT ) mass%. The dissolution rate constants are rather close for these Soldering alloys and vary in the range (1–9) × 10^−5 m s^−1 at disc rotational speeds of 6.45–82.4 rad s^−1. For both alloys, the CoSn_3 intermetallic layer is formed at the interface of cobalt and the saturated or undersaturated Solder Melt at 250 °C and dipping times up to 1800 s, whereas the CoSn_2 intermetallic layer occurs at higher temperatures of 300–450 °C. Formation of an additional intermetallic layer (around 1.5 μm thick) of the CoSn compound was only observed at 450 °C and a dipping time of 1800 s. A simple mathematical equation is proposed to evaluate the intermetallic-layer thickness in the case of undersaturated Melts. The tensile strength of the cobalt-to-Solder joints is 95–107 MPa, with the relative elongation being 2.0–2.6%.
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The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid Solder
JOM, 2009Co-Authors: V. I. DybkovAbstract:During Soldering, intermetallic layers can occur at the interface of a solid metal and the saturated or undersaturated Solder Melt. In systems with a considerable solubility in the liquid state, dissolution causes a manifold drop in layer thickness. Mathematical equations are proposed to evaluate the thickness of any intermetallic layer formed under conditions of simultaneous dissolution in the undersaturated Solder Melt. The main features of reactive phase formation at the solid metalliquid Solder interface are illustrated using the Co-Sn couple with the growing CoSn_3 (250°C) and CoSn_2 (350°C and 450°C) layers as examples.
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Effect of Dissolution on the Ni3Sn4 Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders
Solid State Phenomena, 2008Co-Authors: V. I. DybkovAbstract:The Ni3Sn4 intermetallic layer occurs at the interface of nickel and the saturated or undersaturated Sn-base Solder Melt at 250-450 °C and dipping times of 300 to 2400 s. Mathematical equations are proposed to evaluate the thickness of the Ni3Sn4 layer formed under conditions of simultaneous dissolution in the undersaturated Solder Melt.
George Kaptay - One of the best experts on this subject based on the ideXlab platform.
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The behaviour of steel coated with TiB2 in Sn-Ag-Cu Melt
Materials Science and Technology, 2019Co-Authors: Márton Benke, Zsolt Sályi, V. Takáts, Attila Csik, Peter Rugoczky, George KaptayAbstract:ABSTRACTThe behaviour of TiB2 coated steel in Sn-Ag–Cu based Solder Melt was investigated. The samples were subjected to immersion tests in static Solder Melt for 40 days at 593 K. The reactions at the Solder/native oxide layer covered TiB2/substrate and Solder/oxide layer-free TiB2/substrate interfaces were investigated with X-ray diffraction, secondary neutral mass spectrometry, X-ray photoelectron spectroscopy, scanning electron microscopy and energy dispersive spectroscopy. The thermodynamic background of possible reactions is also presented. It was found that neither oxide covered, nor oxide layer-free TiB2 showed any observable reaction with the Sn-Ag–Cu Solder Melt.
Márton Benke - One of the best experts on this subject based on the ideXlab platform.
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The behaviour of steel coated with TiB2 in Sn-Ag-Cu Melt
Materials Science and Technology, 2019Co-Authors: Márton Benke, Zsolt Sályi, V. Takáts, Attila Csik, Peter Rugoczky, George KaptayAbstract:ABSTRACTThe behaviour of TiB2 coated steel in Sn-Ag–Cu based Solder Melt was investigated. The samples were subjected to immersion tests in static Solder Melt for 40 days at 593 K. The reactions at the Solder/native oxide layer covered TiB2/substrate and Solder/oxide layer-free TiB2/substrate interfaces were investigated with X-ray diffraction, secondary neutral mass spectrometry, X-ray photoelectron spectroscopy, scanning electron microscopy and energy dispersive spectroscopy. The thermodynamic background of possible reactions is also presented. It was found that neither oxide covered, nor oxide layer-free TiB2 showed any observable reaction with the Sn-Ag–Cu Solder Melt.
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Investigation of dissolution resistance of blank and gas-nitrided carbon steels in stationary SAC305 Solder alloy Melt
Journal of Mining and Metallurgy Section B, 2018Co-Authors: Márton Benke, Zs. Salyi, György KaptayAbstract:The objective of the present study is to investigate the suitability of a series of gas-nitrided steels with varying C content as candidates for wettable selective Soldering tool materials with enhanced lifetime. ? and ?? iron-nitrides were formed by gas nitriding on quenched and tempered DC04, C45, CK60 and S103 type steels. Contact angle measurements revealed that all four nitrided steels exhibit good wetting with SAC305 Solder Melt. In order to investigate the dissolution reactions between the nitrided steels and the Solder alloy, an equipment was assembled in which the samples were submerged into stationary SAC305 Solder Melt for different time durations. Evidences of dissolution reactions and other degradation processes were searched for using scanning electron microscopy and energy dispersive X-ray spectroscopy. It was observed that no Fe dissolution occurred between the samples and stationary SAC305 Solder Melt during continuous tests with durations up to 20 days. Furthermore, no other visible degradation reactions occurred between the samples and Melt during the experiments. It was concluded that gas-nitrided steels show good wetting with Sn-based Solder Melts which is combined with excellent resistance against Fe dissolution in a high Sn-containing molten Solder. Thus, gas-nitrided steels/iron can be potential materials for wettable selective Soldering tools with improved lifetime.
V. N. Semenov - One of the best experts on this subject based on the ideXlab platform.
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Effect of copper-silver Solder Melt on the properties of high-strength and high-temperature alloys and steels
Metal Science and Heat Treatment, 1999Co-Authors: V. N. SemenovAbstract:1. High-temperature steels and alloys fracture in Soldering by a brittle mechanism (this is the most typical for dispersion-hardening alloys). 2. An elevated sensitivity of dispersion-hardening alloys to the action of molten Solder is observed in a specific temperature range where their plasticity falls abruptly upon heating. 3. In Soldering structures by copper-silver Solders, such factors as the multiphase structure, the grain sized>0.1 mm, the duration of contact with the Melt, the hydrogen content exceeding 3×10−4 wt.%, the low-Melting elements Pb, S, and Sn, the mechanical strength concentrators (sealing flanges), and the growth of the deformation rate enhance the embrittlement of the materials, whereas a barrier coating possessing a chemical affinity for the Solder weakens it. The scale factor virtually does not affect the degree of embrittlement. 4. Upon the interaction between the material and the molten Melt, the overstress and the rate of fracture become enhanced and the activation energy and the fracture toughness diminish. These changes are more typical for dispersion-hardening alloys than for steels and homogeneous alloys.
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Special features of fracture in materials used for Soldering structures
Metal Science and Heat Treatment, 1999Co-Authors: V. N. SemenovAbstract:1. Cracks that appear in Soldering materials of different kind are a result of the simultaneous action of the appearing tensile stresses and the Solder Melt. 2. The appearance of tensile stresses in Soldering is connected with the volume changes; in alloy ÉP202 they are caused by intensification of the decomposition of the solid solution accompanied by the segregation of particles of fine disperse phases and in steel VNS16 they are caused by the segregation of particles of carbide phases and the α→γ transformation. In addition, the appearance of stresses in a specific temperature range is promoted by technological factors, coarse grains, the deformation rate, the presence of hydrogen, etc. 3. The tensile stresses intensify the decomposition of the solid solution accompanied by segregation of hardening phases and their coarsening, especially over grain boundaries. 4. A crack appearing in materials during Soldering has a wedge shape and a sharp notch in the frontal plane; its growth has an intercrystalline nature. The propagating cracks branch due to the pores and cracks appearing in the volume of the metal. 5. The growth of cracks in Soldering occurs from the surface and in the bulk of the material. The growth of a crack from the surface is characterized by jumps due to the repeated processes of accumulation and consumption of elastic energy at the tip of the crack when it propagates and stops respectively. 6. Corrosion and diffusion processes develop in the zone of surface cracks. The corrosion process is characterized by selective dissolution of nickel, which forms the base of alloy ÉP202 and is an alloying element in steel VNS16, in the liquid Solder. The diffusion process is characterized by predominant penetration of copper into the lattice of the materials. Corrosion and diffusion are not observed in fracture zones in the bulk of the specimens.
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Special features of fracture in materials used for Soldering structures
Metal Science and Heat Treatment, 1999Co-Authors: V. N. SemenovAbstract:1. Cracks that appear in Soldering materials of different kind are a result of the simultaneous action of the appearing tensile stresses and the Solder Melt. 2. The appearance of tensile stresses in Soldering is connected with the volume changes; in alloy EP202 they are caused by intensification of the decomposition of the solid solution accompanied by the segregation of particles of fine disperse phases and in steel VNS16 they are caused by the segregation of particles of carbide phases and the α→γ transformation. In addition, the appearance of stresses in a specific temperature range is promoted by technological factors, coarse grains, the deformation rate, the presence of hydrogen, etc. 3. The tensile stresses intensify the decomposition of the solid solution accompanied by segregation of hardening phases and their coarsening, especially over grain boundaries. 4. A crack appearing in materials during Soldering has a wedge shape and a sharp notch in the frontal plane; its growth has an intercrystalline nature. The propagating cracks branch due to the pores and cracks appearing in the volume of the metal. 5. The growth of cracks in Soldering occurs from the surface and in the bulk of the material. The growth of a crack from the surface is characterized by jumps due to the repeated processes of accumulation and consumption of elastic energy at the tip of the crack when it propagates and stops respectively. 6. Corrosion and diffusion processes develop in the zone of surface cracks. The corrosion process is characterized by selective dissolution of nickel, which forms the base of alloy EP202 and is an alloying element in steel VNS16, in the liquid Solder. The diffusion process is characterized by predominant penetration of copper into the lattice of the materials. Corrosion and diffusion are not observed in fracture zones in the bulk of the specimens.
M.a. Korhonen - One of the best experts on this subject based on the ideXlab platform.
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High Sn Solder reaction with Cu metallization
Scripta Materialia, 1996Co-Authors: Tao Liu, Dae-sik Kim, D. Leung, M.a. KorhonenAbstract:Abstract When Sn based Solders or high Sn Solders are reflowed on to thin film Cu metallization, the fast reaction between Cu and Sn can convert the Cu layer completely into an intermetallic layer. After the conversion, prolonged exposure of the intermetallic to Solder Melt can cause dissolution of Cu from the intermetallic to the bulk Solder. Excessive dissolution of the intermetallic from the interface impairs the interface strength, since it results in Solder dewetting at the exposed Cr layer (Solder does not wet Cr surface). Utilization of Cu-Cr phased layer is not sufficient to prevent dewetting from occurring at high Sn Solders.