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John D. Floros - One of the best experts on this subject based on the ideXlab platform.
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Film Composition Effects on Diffusion of Potassium Sorbate Through Whey Protein Films
Journal of Food Science, 2003Co-Authors: M. Ozdemir, John D. FlorosAbstract:ABSTRACT: The effect of film composition on potassium Sorbate diffusion in whey protein films was studied using mixture response surface methodology. The model developed for potassium Sorbate diffusivity was statistically significant (P < 0.01) with no significant lack of fit. The diffusivities of potassium Sorbate in the films at 25 °C varied between 5.4 and 9.8 × 10−11 m2/s. Amounts of protein, sorbitol, beeswax, and potassium Sorbate in the films significantly affected potassium Sorbate diffusion coefficients. Increasing the relative amounts of protein and beeswax in the films decreased potassium Sorbate diffusivity, while increasing the relative amounts of sorbitol and initial potassium Sorbate in the films increased the diffusion of potassium Sorbate. Strong interactions were observed between protein and beeswax, and potassium Sorbate and beeswax. Keywords: edible films, whey protein, potassium Sorbate, diffusivity, mixture design
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analysis and modeling of potassium Sorbate diffusion through edible whey protein films
Journal of Food Engineering, 2001Co-Authors: M. Ozdemir, John D. FlorosAbstract:Abstract The mechanism of potassium Sorbate release from edible whey protein films was investigated. Anomalous or non-Fickian diffusion mechanism with diffusional exponents ( n ) between 0.55 and 0.86 were found. A model describing the diffusion of potassium Sorbate from whey protein films that swelled due to countercurrent diffusion of solvent was used to determine potassium Sorbate and solvent diffusion coefficients. The diffusivities of potassium Sorbate at 25°C ranged from 5.38 to 9.76×10 −11 m 2 /s, while those of the solvent from 1.29 to 7.43×10 −10 m 2 /s, depending on film composition.
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potassium Sorbate diffusivity in american processed and mozzarella cheeses
Journal of Food Science, 1998Co-Authors: John D. FlorosAbstract:The diffusivity of potassium Sorbate in cheeses was determined by using diffusion models and computer programming for examining the residual surface concentration and the penetration of surface-applied potassium Sorbate into cheese. To determine diffusivity, the concentration of potassium Sorbate in sliced cheese was measured by penetration time and distance from surface. The diffusivity was calculated by nonlinear regression with experimental data based on Fick's law. The diffusivity of potassium Sorbate through American processed cheese was 1.31x10 -6 cm 2 /sec and for Mozzarella cheese 6.74x10 -7 cm 2 /sec. This indicated that Mozzarella cheese would maintain surface concentration of potassium Sorbate above the critical fungistatic level two times longer than American processed cheese.
M. Ozdemir - One of the best experts on this subject based on the ideXlab platform.
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A Mathematical Model for Potassium Sorbate Diffusion Through Whey Protein Films
Drying Technology, 2006Co-Authors: Hasan Sadikoglu, Deniz Sen, M. OzdemirAbstract:A mathematical model was constructed and solved to quantitatively describe the dynamic behavior of the potassium Sorbate diffusion through whey protein films. The model results were compared with the experimental data of the potassium Sorbate diffusion through whey protein films, and excellent agreements between the experimental data and the model results are observed. The experimental data for potassium Sorbate diffusion through whey protein films were used for mathematical model of potassium Sorbate diffusion through whey protein films and the determination of both potassium Sorbate and solvent diffusion coefficients. The diffusivities of potassium Sorbate at 25°C ranged from 4.12 to 9.34 × 10−11 m2/s, while that of the solvent was between 1.38 and 8.74 × 10−10 m2/s, depending on the film composition.
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Film Composition Effects on Diffusion of Potassium Sorbate Through Whey Protein Films
Journal of Food Science, 2003Co-Authors: M. Ozdemir, John D. FlorosAbstract:ABSTRACT: The effect of film composition on potassium Sorbate diffusion in whey protein films was studied using mixture response surface methodology. The model developed for potassium Sorbate diffusivity was statistically significant (P < 0.01) with no significant lack of fit. The diffusivities of potassium Sorbate in the films at 25 °C varied between 5.4 and 9.8 × 10−11 m2/s. Amounts of protein, sorbitol, beeswax, and potassium Sorbate in the films significantly affected potassium Sorbate diffusion coefficients. Increasing the relative amounts of protein and beeswax in the films decreased potassium Sorbate diffusivity, while increasing the relative amounts of sorbitol and initial potassium Sorbate in the films increased the diffusion of potassium Sorbate. Strong interactions were observed between protein and beeswax, and potassium Sorbate and beeswax. Keywords: edible films, whey protein, potassium Sorbate, diffusivity, mixture design
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analysis and modeling of potassium Sorbate diffusion through edible whey protein films
Journal of Food Engineering, 2001Co-Authors: M. Ozdemir, John D. FlorosAbstract:Abstract The mechanism of potassium Sorbate release from edible whey protein films was investigated. Anomalous or non-Fickian diffusion mechanism with diffusional exponents ( n ) between 0.55 and 0.86 were found. A model describing the diffusion of potassium Sorbate from whey protein films that swelled due to countercurrent diffusion of solvent was used to determine potassium Sorbate and solvent diffusion coefficients. The diffusivities of potassium Sorbate at 25°C ranged from 5.38 to 9.76×10 −11 m 2 /s, while those of the solvent from 1.29 to 7.43×10 −10 m 2 /s, depending on film composition.
Yair Eineli - One of the best experts on this subject based on the ideXlab platform.
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reprint of potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
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potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
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potassium Sorbate a new aqueous copper corrosion inhibitor electrochemical and spectroscopic studies
Electrochimica Acta, 2007Co-Authors: Esta Abelev, David Starosvetsky, Yair EineliAbstract:This work presents the novel nature of 2,4-hexadienoic acid potassium salt (potassium Sorbate (KCH3CH CHCH CHCO2)) as an effective copper aqueous corrosion inhibitor. The influence of pH and potassium Sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in potassium Sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of potassium Sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-Sorbate at the metal surface.
Joko Nugroho Wahyu Karyadi - One of the best experts on this subject based on the ideXlab platform.
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kinetika pertumbuhan mikrobia dan kemunduran mutu bakso daging terlapisi pati umbi kimpul xanthosoma sagittifolium yang diinkorporasi kalium sorbat
Jurnal Agritech Fakultas Teknologi Pertanian UGM, 2015Co-Authors: Warkoyo Warkoyo, Budi Rahardjo, Djagal Wiseso Marseno, Joko Nugroho Wahyu KaryadiAbstract:The rapidity of microbial growth as damage agents indicates quality deterioration of food as its substrate. The presence of active coatings on the surface of the food material will affect to both of microbial growth rapidity and food quality deterioration. The objectives of this research were to determine the kinetics of microbial growth and quality deterioration of X. sagittifolium starch-based coated meatballs incorporated with potassium Sorbate. Various potassium Sorbate concentration onedible coatings were tested in the research. Observation parameters included the number of microbes, protein content, TVB-N, weight losses, and texture. The results showed that the addition of potassium Sorbate significantly affected the number of microbes, TVB-N, and texture. However, it did not significantly affect to the protein content and weight losses of meatballs. The number of microbes increased exponentially with the inhibition rate of 0.101 times of potassium Sorbate concentration, while TVB-N and the texture of meatballs changed linearly with the inhibition rate of 0.584 and 0.036 times of potassium Sorbate concentration respectively. The active starch-based edible coatings with 0.6% potassium Sorbate incorporated increased the shelf life of meatballs up to 4 days, while the meatballs without coating only lasted less than 1 day. ABSTRAK Kecepatan pertumbuhan mikrobia sebagai agen kerusakan dapat mengindikasikan kemunduran mutupangan sebagai substratnya. Adanya pelapis aktif pada permukaan bahan makanan akan mempengaruhi keduanya.Tujuan penelitian ini adalah untuk menentukan kinetika pertumbuhan mikrobia, dan kemunduran mutu bakso terlapisi pati umbi kimpul (X. sagittifolium) yang diinkorporasi kalium sorbat. Perlakuan yang dicoba dalam penelitian ini adalah konsentrasi kalium sorbat yang berbeda pada pelapis edible. Parameter pengamatan meliputi jumlah mikrobia, kadar protein, TVB-N, susut berat, dan tekstur.Hasil penelitian menunjukkan bahwa penambahan kalium sorbat berpengaruh nyata terhadap jumlah mikrobia, TVB-N, dan tekstur, serta berpengaruh tidak nyata terhadap kadar protein dan susut berat bakso. Jumlah mikrobia meningkat secara eksponensial dengan laju penghambatan 0,101 kali konsentrasi kalium sorbat, sementara TVB-N, dan tekstur bakso berubah secara linier dengan laju penghambatan masing-masing sebesar 0,584 dan 0,036 kali konsentrasi kalium sorbat. Pelapis edible aktif berbasis pati X. sagittifolium yang diinkorporasi kalium sorbat 0,6% dapat meningkatkan umur simpan bakso sampai 4 hari, sementara bakso tanpa pelapis hanya bertahan kurang dari 1 hari.
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sifat fisik mekanik dan barrier edible film berbasis pati umbi kimpul xanthosoma sagittifolium yang diinkorporasi dengan kalium sorbat
Jurnal Agritech Fakultas Teknologi Pertanian UGM, 2014Co-Authors: Warkoyo Warkoyo, Budi Rahardjo, Djagal Wiseso Marseno, Joko Nugroho Wahyu KaryadiAbstract:Xanthosoma sagittifolium starch has the potential to be developed as a base for edible film, because it was hydrocolloid compound, as well as renewable natural resources, widely available and easy to obtain its. High amylose content of X. sagittifolium starch (35.34%), twice than cassava starch, so that it possible to produce strong and flexible edible film. The presence of the active ingredient in edible film with different it kinds and amounts would produce different properties too. The purpose of this study was to evaluate the physical, mechanical and barrier properties of active edible film due to variation of concentration of starch and potassium Sorbate. Edible films have produced characteristics for tensile strength from 0.399 to 1.390 MPa, elongation from 14.943 to 31.647%, thickness from 0.065 to 0.081 mm, water vapor transmission rate from 10.095 to 15.247 g.mm/m2.day, solubility from 27.126 to 59.846% and transparency from 0,719 to 1,063. To increase starch made elevation of edible film tensile strength, thickness, WVTR, and the smoothness, as well as decrease its water solubility, while increasing potassium Sorbate would increase elongation and WVTR, as well as decrease the tensile strength. ABSTRAK Pati umbi kimpul (Xanthosoma sagittifolium) mempunyai potensi untuk dikembangkan sebagai bahan dasar edible film, karena pati merupakan senyawa hidrokoloid, sebagai sumber daya alam yang dapat diperbaharui, tersedia secara luas dan mudah didapat. Kandungan amilosa pati umbi kimpul cukup tinggi (35,34%), dua kali lebih besar dibandingkan amilosa pati ubi kayu, memungkinkan untuk menghasilkan edible film yang kuat dan fleksibel. Keberadaan kalium sorbat dalam edible film dengan jumlah yang berbeda akan menghasilkan sifat yang berbeda pula. Tujuan penelitian ini adalah untuk mengetahui sifat fisik, mekanik dan barrier edible film aktif akibat variasi konsentrasi pati umbi kimpul dan kalium sorbat. Edible film yang dihasilkan mempunyai karakter kuat tarik 0,399-1,390 MPa, persen pemanjangan 14,943-31,647%, ketebalan 0,065-0,081 mm, WVTR 10,095-15,247 g.mm/m2.hari, kelarutan 27,126-59,846% dan transparansi 0,719-1,063. Penambahan pati menyebabkan kuat tarik, ketebalan, laju transmisi uap air, dan kehalusan permukaan edible film meningkat, tetapi kelarutannya dalam air menurun, sedangkan penambahan kalium sorbat dalam edible film menyebabkan persen pemanjangan dan laju transmisi uap air meningkat, tetapi kuat tariknya menurun.
Esta Abelev - One of the best experts on this subject based on the ideXlab platform.
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reprint of potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
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potassium Sorbate solutions as copper chemical mechanical planarization cmp based slurries
Electrochimica Acta, 2007Co-Authors: Esta Abelev, Andrew Jonathan Smith, Achim Walter Hassel, Yair EineliAbstract:Abstract Copper depassivation and repassivation characteristics in potassium Sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in Sorbate based solutions is discussed. The repassivation rate of copper in Sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L −1 potassium Sorbate were found to be in the range of 0.5–1.5 ms. An increase in the potassium Sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV Ag/AgCl . The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current ( I max ) values. XPS studies revealed that copper passivation in potassium based solution was due to the formation of a thin film which is constituted of: Cu 2 O, Cu(OH) 2 and Cu(II)-Sorbate, while copper(II)-Sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of potassium Sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.
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potassium Sorbate a new aqueous copper corrosion inhibitor electrochemical and spectroscopic studies
Electrochimica Acta, 2007Co-Authors: Esta Abelev, David Starosvetsky, Yair EineliAbstract:This work presents the novel nature of 2,4-hexadienoic acid potassium salt (potassium Sorbate (KCH3CH CHCH CHCO2)) as an effective copper aqueous corrosion inhibitor. The influence of pH and potassium Sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in potassium Sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of potassium Sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-Sorbate at the metal surface.
