The Experts below are selected from a list of 246 Experts worldwide ranked by ideXlab platform
Martin W. Bayes - One of the best experts on this subject based on the ideXlab platform.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Crystal P. L. Li, Mark Lefebvre, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Mark Lefebvre, Crystal Li, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling. A new, insoluble anode, DC microvia fill system is now available for high volume manufacturing (HVM), offering additional operating flexibility and end user preference.
Ming-hung Chiang - One of the best experts on this subject based on the ideXlab platform.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Crystal P. L. Li, Mark Lefebvre, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Mark Lefebvre, Crystal Li, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling. A new, insoluble anode, DC microvia fill system is now available for high volume manufacturing (HVM), offering additional operating flexibility and end user preference.
Hsien-chang Chen - One of the best experts on this subject based on the ideXlab platform.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Crystal P. L. Li, Mark Lefebvre, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Mark Lefebvre, Crystal Li, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling. A new, insoluble anode, DC microvia fill system is now available for high volume manufacturing (HVM), offering additional operating flexibility and end user preference.
Mark Lefebvre - One of the best experts on this subject based on the ideXlab platform.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Crystal P. L. Li, Mark Lefebvre, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling.
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Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
2012 7th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2012Co-Authors: Ming-hung Chiang, Hsien-chang Chen, Mark Lefebvre, Crystal Li, Martin W. BayesAbstract:The combination of Specialized Equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling. A new, insoluble anode, DC microvia fill system is now available for high volume manufacturing (HVM), offering additional operating flexibility and end user preference.
Hubboldroger - One of the best experts on this subject based on the ideXlab platform.
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A perceptually validated model for surface depth hallucination
ACM Transactions on Graphics, 2008Co-Authors: Glencrossmashhuda, J Wardgregory, Melendezfrancho, Jaycaroline, Liujun, HubboldrogerAbstract:Capturing detailed surface geometry currently requires Specialized Equipment such as laser range scanners, which despite their high accuracy, leave gaps in the surfaces that must be reconciled with...
