The Experts below are selected from a list of 170559 Experts worldwide ranked by ideXlab platform
Philip A. Mawby - One of the best experts on this subject based on the ideXlab platform.
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Dynamic Thermal Simulation of Power Devices Operating with PWM Signals
2006 25th International Conference on Microelectronics, 2006Co-Authors: Z Zhou, S.n. Jankovic, S.g. Batcup, Petar Igic, Philip A. MawbyAbstract:Fast power devices Thermal Simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic Thermal Simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical Simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the Thermal Simulation. With the proposed method, a relative large Simulation time step can be employed and Simulation speed can be increased dramatically. The method is suitable for a long real time Thermal Simulation for complex power electronics systems
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a fast power loss calculation method for long real time Thermal Simulation of igbt modules for a three phase inverter system
International Journal of Numerical Modelling-electronic Networks Devices and Fields, 2006Co-Authors: Z Zhou, M.s. Khanniche, Petar Igic, Philip A. Mawby, S T Kong, M S TowersAbstract:A fast power losses calculation method for long real time Thermal Simulation of IGBT module for a three-phase inverter system is presented in this paper. The speed-up is obtained by simplifying the representation of the three-phase inverter at the system modelling stage. This allows the inverter system to be simulated predicting the effective voltages and currents whilst using large time-step. An average power losses is calculated during each clock period, using a pre-defined look-up table, which stores the switching and on-state losses generated by either direct measurement or automatically based upon compact models for the semiconductor devices. This Simulation methodology brings together accurate models of the electrical systems performance, state of the art-device compact models and a realistic Simulation of the Thermal performance in a usable period of CPU time and is suitable for a long real time Thermal Simulation of inverter power devices with arbitrary load. Thermal Simulation results show that with the same IGBT characteristics applied, the proposed model can give the almost same Thermal performance compared to the full physically based device modelling approach. Copyright © 2006 John Wiley & Sons, Ltd.
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Large time-scale electro-Thermal Simulation model of Inverter Power Module (IPM) for hybrid vehicle applications
1st IEE Automotive Electronics Conference, 2005Co-Authors: Z Zhou, M.s. Khanniche, Philip A. Mawby, Rajko IgicAbstract:A novel electro-Thermal decoupled approach for large time-scale electro-Thermal Simulation of an inverter power module (IPM) used to drive a permanent magnet synchronous motor (PMSM) is presented. The key assumption is that the inverter drive system electrical performance is not affected by the temperature of the semiconductor power devices; this allows the electrical and Thermal Simulations to be decoupled. Based on this strategy, the electro-Thermal Simulation of the inverter power module is divided into two phases: (1) the overall electrical Simulation of the inverter drive system in the continuous time domain; (2) PWM switching signal based power losses calculation and the Thermal Simulation of the inverter power module. The feature of this method is that the PWM switching signal is reconstructed using continuous smooth time-domain motor voltages obtained from phase (1), so that accurate power loss calculation and Thermal Simulation can be carried out using continuous smooth electrical waveforms. In this way, the conventional approach where devices are represented by switches is avoided and the electrical-Thermal Simulation can be carried out using relatively large Simulation time steps, which allows a significant speed-up of the Simulation. Simulation of over 10 minutes of real time operation has been carried out; the total Simulation is of the order of 1 hr CPU time for a 3.12 GHz CPU 1 Gbyte memory PC.
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a fast power loss calculation method for long real time Thermal Simulation of igbt modules for a three phase inverter system
European Conference on Power Electronics and Applications, 2005Co-Authors: Z Zhou, M.s. Khanniche, Petar Igic, S T Kong, M S Towers, Philip A. MawbyAbstract:A fast power losses calculation method for long real time Thermal Simulation of IGBT module for a three-phase inverter system is presented in this paper. The speed-up is obtained by simplifying the representation of the three-phase inverter at the system modelling stage this allows a inverter system to be simulated predicting the effective voltages and currents whilst using large time-step. An average power losses is calculated during each clock period, using a pre-defined look-up table, which stores the switching and on-state losses generated by either direct measurement or automatically based upon compact models for the semiconductor devices. This Simulation methodology brings together accurate models of the electrical systems performance, state of the art-device compact models and a realistic Simulation of the Thermal performance in a useable period of CPU time and is suitable for a long real time Thermal Simulation of inverter power devices with arbitrary load. Thermal Simulation results show that with the same IGBT characteristics applied, the proposed model can give the almost same Thermal performance compared to the full physically based device modelling approach
Z Zhou - One of the best experts on this subject based on the ideXlab platform.
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Dynamic Thermal Simulation of Power Devices Operating with PWM Signals in a Three-Phase Inverter Drive System
2006 12th International Power Electronics and Motion Control Conference, 2006Co-Authors: Z Zhou, S.g. Batcup, Salah Khanniche, Nebojsa Jankovic, Petar IgicAbstract:Fast power devices Thermal Simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic Thermal Simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical Simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the Thermal Simulation. With the proposed method, a relative large Simulation time step can be employed and Simulation speed can be increased dramatically. The method is suitable for a long real time Thermal Simulation for complex power electronics systems.
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Dynamic Thermal Simulation of Power Devices Operating with PWM Signals
2006 25th International Conference on Microelectronics, 2006Co-Authors: Z Zhou, S.n. Jankovic, S.g. Batcup, Petar Igic, Philip A. MawbyAbstract:Fast power devices Thermal Simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic Thermal Simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical Simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the Thermal Simulation. With the proposed method, a relative large Simulation time step can be employed and Simulation speed can be increased dramatically. The method is suitable for a long real time Thermal Simulation for complex power electronics systems
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a fast power loss calculation method for long real time Thermal Simulation of igbt modules for a three phase inverter system
International Journal of Numerical Modelling-electronic Networks Devices and Fields, 2006Co-Authors: Z Zhou, M.s. Khanniche, Petar Igic, Philip A. Mawby, S T Kong, M S TowersAbstract:A fast power losses calculation method for long real time Thermal Simulation of IGBT module for a three-phase inverter system is presented in this paper. The speed-up is obtained by simplifying the representation of the three-phase inverter at the system modelling stage. This allows the inverter system to be simulated predicting the effective voltages and currents whilst using large time-step. An average power losses is calculated during each clock period, using a pre-defined look-up table, which stores the switching and on-state losses generated by either direct measurement or automatically based upon compact models for the semiconductor devices. This Simulation methodology brings together accurate models of the electrical systems performance, state of the art-device compact models and a realistic Simulation of the Thermal performance in a usable period of CPU time and is suitable for a long real time Thermal Simulation of inverter power devices with arbitrary load. Thermal Simulation results show that with the same IGBT characteristics applied, the proposed model can give the almost same Thermal performance compared to the full physically based device modelling approach. Copyright © 2006 John Wiley & Sons, Ltd.
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Large time-scale electro-Thermal Simulation model of Inverter Power Module (IPM) for hybrid vehicle applications
1st IEE Automotive Electronics Conference, 2005Co-Authors: Z Zhou, M.s. Khanniche, Philip A. Mawby, Rajko IgicAbstract:A novel electro-Thermal decoupled approach for large time-scale electro-Thermal Simulation of an inverter power module (IPM) used to drive a permanent magnet synchronous motor (PMSM) is presented. The key assumption is that the inverter drive system electrical performance is not affected by the temperature of the semiconductor power devices; this allows the electrical and Thermal Simulations to be decoupled. Based on this strategy, the electro-Thermal Simulation of the inverter power module is divided into two phases: (1) the overall electrical Simulation of the inverter drive system in the continuous time domain; (2) PWM switching signal based power losses calculation and the Thermal Simulation of the inverter power module. The feature of this method is that the PWM switching signal is reconstructed using continuous smooth time-domain motor voltages obtained from phase (1), so that accurate power loss calculation and Thermal Simulation can be carried out using continuous smooth electrical waveforms. In this way, the conventional approach where devices are represented by switches is avoided and the electrical-Thermal Simulation can be carried out using relatively large Simulation time steps, which allows a significant speed-up of the Simulation. Simulation of over 10 minutes of real time operation has been carried out; the total Simulation is of the order of 1 hr CPU time for a 3.12 GHz CPU 1 Gbyte memory PC.
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a fast power loss calculation method for long real time Thermal Simulation of igbt modules for a three phase inverter system
European Conference on Power Electronics and Applications, 2005Co-Authors: Z Zhou, M.s. Khanniche, Petar Igic, S T Kong, M S Towers, Philip A. MawbyAbstract:A fast power losses calculation method for long real time Thermal Simulation of IGBT module for a three-phase inverter system is presented in this paper. The speed-up is obtained by simplifying the representation of the three-phase inverter at the system modelling stage this allows a inverter system to be simulated predicting the effective voltages and currents whilst using large time-step. An average power losses is calculated during each clock period, using a pre-defined look-up table, which stores the switching and on-state losses generated by either direct measurement or automatically based upon compact models for the semiconductor devices. This Simulation methodology brings together accurate models of the electrical systems performance, state of the art-device compact models and a realistic Simulation of the Thermal performance in a useable period of CPU time and is suitable for a long real time Thermal Simulation of inverter power devices with arbitrary load. Thermal Simulation results show that with the same IGBT characteristics applied, the proposed model can give the almost same Thermal performance compared to the full physically based device modelling approach
Petar Igic - One of the best experts on this subject based on the ideXlab platform.
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Dynamic Thermal Simulation of Power Devices Operating with PWM Signals in a Three-Phase Inverter Drive System
2006 12th International Power Electronics and Motion Control Conference, 2006Co-Authors: Z Zhou, S.g. Batcup, Salah Khanniche, Nebojsa Jankovic, Petar IgicAbstract:Fast power devices Thermal Simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic Thermal Simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical Simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the Thermal Simulation. With the proposed method, a relative large Simulation time step can be employed and Simulation speed can be increased dramatically. The method is suitable for a long real time Thermal Simulation for complex power electronics systems.
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Dynamic Thermal Simulation of Power Devices Operating with PWM Signals
2006 25th International Conference on Microelectronics, 2006Co-Authors: Z Zhou, S.n. Jankovic, S.g. Batcup, Petar Igic, Philip A. MawbyAbstract:Fast power devices Thermal Simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic Thermal Simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical Simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the Thermal Simulation. With the proposed method, a relative large Simulation time step can be employed and Simulation speed can be increased dramatically. The method is suitable for a long real time Thermal Simulation for complex power electronics systems
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a fast power loss calculation method for long real time Thermal Simulation of igbt modules for a three phase inverter system
International Journal of Numerical Modelling-electronic Networks Devices and Fields, 2006Co-Authors: Z Zhou, M.s. Khanniche, Petar Igic, Philip A. Mawby, S T Kong, M S TowersAbstract:A fast power losses calculation method for long real time Thermal Simulation of IGBT module for a three-phase inverter system is presented in this paper. The speed-up is obtained by simplifying the representation of the three-phase inverter at the system modelling stage. This allows the inverter system to be simulated predicting the effective voltages and currents whilst using large time-step. An average power losses is calculated during each clock period, using a pre-defined look-up table, which stores the switching and on-state losses generated by either direct measurement or automatically based upon compact models for the semiconductor devices. This Simulation methodology brings together accurate models of the electrical systems performance, state of the art-device compact models and a realistic Simulation of the Thermal performance in a usable period of CPU time and is suitable for a long real time Thermal Simulation of inverter power devices with arbitrary load. Thermal Simulation results show that with the same IGBT characteristics applied, the proposed model can give the almost same Thermal performance compared to the full physically based device modelling approach. Copyright © 2006 John Wiley & Sons, Ltd.
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a fast power loss calculation method for long real time Thermal Simulation of igbt modules for a three phase inverter system
European Conference on Power Electronics and Applications, 2005Co-Authors: Z Zhou, M.s. Khanniche, Petar Igic, S T Kong, M S Towers, Philip A. MawbyAbstract:A fast power losses calculation method for long real time Thermal Simulation of IGBT module for a three-phase inverter system is presented in this paper. The speed-up is obtained by simplifying the representation of the three-phase inverter at the system modelling stage this allows a inverter system to be simulated predicting the effective voltages and currents whilst using large time-step. An average power losses is calculated during each clock period, using a pre-defined look-up table, which stores the switching and on-state losses generated by either direct measurement or automatically based upon compact models for the semiconductor devices. This Simulation methodology brings together accurate models of the electrical systems performance, state of the art-device compact models and a realistic Simulation of the Thermal performance in a useable period of CPU time and is suitable for a long real time Thermal Simulation of inverter power devices with arbitrary load. Thermal Simulation results show that with the same IGBT characteristics applied, the proposed model can give the almost same Thermal performance compared to the full physically based device modelling approach
Jiwon Kang - One of the best experts on this subject based on the ideXlab platform.
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medium voltage hts cable Thermal Simulation using pscad emtdc
KEPCO Journal on electric power and energy, 2015Co-Authors: Chaekyun Jung, Yeonwoog Kang, Jiwon KangAbstract:This paper described the medium voltage high temperature superconducting cable Thermal Simulation and its application. New Simulation method for HTS cable modeling using PSCAD/EMTDC is introduced in this paper. The developed Simulation method consists of electrical model part and Thermal model part. In electrical model part, power loss and Thermal capacitance can be calculated in each layer, then the temperature of each layer can be calculated by power loss and Thermal capacitance in Thermal model part. This paper also analyzes the electrical and Thermal characteristic in the case of normal operating condition and transient including single line to ground fault and line to line ground fault using new Simulation method.
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Medium Voltage HTS Cable Thermal Simulation using PSCAD/EMTDC
KEPCO Journal on electric power and energy, 2015Co-Authors: Chaekyun Jung, Yeonwoog Kang, Jiwon KangAbstract:This paper described the medium voltage high temperature superconducting cable Thermal Simulation and its application. New Simulation method for HTS cable modeling using PSCAD/EMTDC is introduced in this paper. The developed Simulation method consists of electrical model part and Thermal model part. In electrical model part, power loss and Thermal capacitance can be calculated in each layer, then the temperature of each layer can be calculated by power loss and Thermal capacitance in Thermal model part. This paper also analyzes the electrical and Thermal characteristic in the case of normal operating condition and transient including single line to ground fault and line to line ground fault using new Simulation method.
Marta Rencz - One of the best experts on this subject based on the ideXlab platform.
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Electro-Thermal Simulation of MEMS elements
2017Co-Authors: Marta Rencz, Andreas Poppe, Vladimir Szekely, Bernard CourtoisAbstract:In this paper we present a new algorithm, developed for the layout based electro-Thermal Simulation of integrated circuits and MEMS. The method uses simultaneous iteration of the Thermal and electrical behavior. The general advantage of this method over simulator coupling is that, it is also suitable to cope with very fast changes. The usual drawback is however, that the Thermal nodes have to be added to the nodes of the electrical network, rendering usually huge networks to be simulated. In our Thermal modeling method the Thermal system is represented by a matrix of Foster networks. The solution of these can be partly pre-calculated, partly separated from the solution of the electrical nodes, resulting in fast and accurate electro-Thermal Simulation. Case studies are presented to show the applicability of the method for the analysis of Thermally operated MEMS elements. The results of the electro-Thermal Simulation of a realized MEMS electro-Thermal converter show very good matching with the results measured on the structure.
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DATE - A Fast Algorithm for the Layout Based Electro-Thermal Simulation
2003 Design Automation and Test in Europe Conference and Exhibition, 2003Co-Authors: Marta Rencz, Vladimir Szekely, Andras PoppeAbstract:A new algorithm has been developed for the layout based direct electro-Thermal Simulation of integrated circuits. The advantage of the direct electro-Thermal Simulation over simulator coupling is, that very fast changes can also be considered, the drawback is that the Thermal nodes are added to the number of nodes of the network to be simulated. The novelties of our method are the modeling and the solution of the Thermal structure. This paper presents the algorithm of the time constant spectrum based FOSTER chain matrix Thermal modeling, and the new algorithm of the coupled electro-Thermal solution, where parts of the network, which represent the Thermal behavior, are not computed in all steps of the iteration. This speeded up algorithm works both in the time-, and in the frequency domain. A Simulation example demonstrates a typical application: the prediction of how the layout arrangement and the packaging of an analogue integrated circuit influence the electrical parameters.
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Electro-Thermal Simulation for the prediction of chip operation within the package
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium 2003., 2003Co-Authors: Marta Rencz, Kholdoun Torki, Andras Poppe, Vladimir Szekely, Bernard CourtoisAbstract:The device level electro-Thermal Simulation of analog circuits and the logical gate level logi-Thermal Simulation of digital circuits are addressed in the paper. After presenting the main algorithms, realization questions are also discussed. For both the electro-Thermal cases, simulated results of realized structures are presented. These are compared with benchmark results, proving the applicability and the accuracy of the methods.
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Algorithmic and modeling aspects in the electro-Thermal Simulation of Thermally operated microsystems
2003Co-Authors: Marta Rencz, Andreas Poppe, Vladimir Szekely, Bernard CourtoisAbstract:A new algorithm has been developed for the layout based electro-Thermal Simulation of integrated circuits and MEMS, using simultaneous iteration. The general advantage of this method over simulator coupling is that, it is also suitable to cope with very fast changes. The usual drawback is however, that the Thermal nodes have to be added to the nodes of the electrical network, rendering usually huge networks to be simulated. In our Thermal modeling method the Thermal system is represented by a matrix of Foster networks. The solution of these can be partly pre-calculated, partly separated from the solution of the electrical nodes, resulting in fast and accurate electroThermal Simulation. In the paper we present a case study, in which the electro-Thermal Simulation results of a realized MEMS electro-Thermal converter show good match with the measured results.
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Friendly tools for the Thermal Simulation of power packages
IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426), 2000Co-Authors: Marta Rencz, Andreas Poppe, Vladimir Szekely, Bernard CourtoisAbstract:Thermal Simulation is a frequently needed task in the design of integrated power packaging. Thermal Simulation is used in the design of new devices, in the design of the placement of the dissipating elements on the chip and for the design of the packages. Thermal simulators can help to find the best mounting solutions for the devices if they have to operate in Thermally strained conditions. Thermal Simulation is usually done using finite element method (FEM) based simulator programs. These are general-purpose expensive simulators, where the general usability comes together with complicated, and usually difficult to learn and difficult to use user interfaces, and these programs are relatively slow and inaccurate. To overcome these problems, we have developed two fast and easy to use 2D and 3D Thermal simulator programs, SUNRED (Szekely and Rencz, 1998) and THERMAN (Csendes et al, 1998; Szekely et al, 1999). In the recent development, the first goal was to create user friendly tools which design engineers are happy to use in Thermal design tasks, since the tools are fast enough to provide answers to their Thermal questions almost immediately. As a result of this feature, the designers can study the effects on the Thermal behavior of all modifications in the geometry of their structure or in the boundary conditions immediately on their computer screen.
