The Experts below are selected from a list of 2692662 Experts worldwide ranked by ideXlab platform
Shan X. Wang - One of the best experts on this subject based on the ideXlab platform.
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Epigenetic changes of mesenchymal stem cells in three‐dimensional (3d) spheroids
Journal of cellular and molecular medicine, 2014Co-Authors: Ling Guo, Ying Zhou, Shan X. WangAbstract:Mesenchymal stem cells (MSCs) hold profound promise in tissue repair/regeneration. However, MSCs undergo remarkable spontaneous differentiation and aging during monolayer culture expansion. In this study, we found that 2-3 days of Three-Dimensional (3d) spheroid culture of human MSCs (hMSCs) that had been expanded in monolayer for six passages increased their clonogenicity and differentiation potency to neuronal cells. Moreover, in accordance with these changes, the expression levels of miRNA which were involved in stem cell potency were changed and levels of histone H3 acetylation in K9 in promoter regions of Oct4, Sox2 and Nanog were elevated. Our results indicate that spheroid culture increases their multi-potency and changes the epigenetic status of pluripotent genes in hMSCs.
Giuseppe Navarra - One of the best experts on this subject based on the ideXlab platform.
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Three-Dimensional (3d) Versus Two-Dimensional (2D) Laparoscopic Bariatric Surgery: a Single-Surgeon Prospective Randomized Comparative Study
Obesity surgery, 2015Co-Authors: Giuseppe Currò, Giuseppe La Malfa, Antonio Caizzone, Valentina Rampulla, Giuseppe NavarraAbstract:Background To address the issue whether Three-Dimensional (3d) offers real operative time advantages to the laparoscopic surgical procedure, we have designed a single-surgeon prospective randomized comparison of 3d versus two-dimensional (2D) imaging during two different bariatric procedures.
Ronald J. Gutmann - One of the best experts on this subject based on the ideXlab platform.
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Global Planarization Requirements for Wafer-Level Three-Dimensional (3d) ICs
World Tribology Congress III Volume 2, 2005Co-Authors: Ronald J. Gutmann, J. J. McmahonAbstract:Planarization needs for integrated circuit (IC) technology focus on feature-scale (100nm–1μm) and die-scale (5mm-20mm) dimensions. As Three-Dimensional (3d) integration moves from die-by-die assembly to wafer-level integration to provide a higher density of low electrical parasitic vertical interconnects (or vias), wafer-level planarization needs to be considered. Planarization needs depend upon the 3d technology platform approach (such as (1) blanket bonding followed by inter-wafer interconnect processing or via-first processing followed by bonding and thinning to expose the vias and (2) the number of wafers in a 3d stack) and the processing conditions used in fabricating the wafers to be 3d integrated (in particular, the built-in stress levels and post-bonding thermal processing budget). This invited presentation includes a summary of the current interest in wafer-level 3d integration in both the academic and industrial research community. Wafer-level planarization issues with different technology platforms are presented, and the limited results presented in the literature to date are summarized. The importance of wafer-level planarization compared to bonding, thinning and wafer-to-wafer alignment is discussed.
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Planarization Issues in Wafer-Level Three-Dimensional (3d) Integration
MRS Proceedings, 2004Co-Authors: G. Rajagopalan, M. Gupta, Timothy S. Cale, Ronald J. GutmannAbstract:Monolithic wafer-level Three-Dimensional (3d) ICs based upon bonding of processed wafers and die-to-wafer 3d ICs based upon bonding die to a host wafer require additional planarization considerations compared to conventional planar ICs and wafer-scale packaging. Various planarization issues are described, focusing on the more stringent technology requirements of monolithic wafer-level 3d ICs. The specific 3d IC technology approach considered here consists of wafer bonding with dielectric adhesives, a three-step thinning process of grinding, polishing and etching, and an inter-wafer interconnect process using copper damascene patterning. The use of a bonding adhesive to relax pre-bonding wafer planarization requirements is a key to process compatibility with standard IC processes. Minimizing edge chipping during wafer thinning requires understanding of the relationships between wafer bonding, thinning and pre-bonding IC processes. The advantage of silicon-on-insulator technology in alleviating planarization issues with wafer thinning for 3d ICs is described.
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Three-Dimensional (3d) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY PEP & Adhesives in Electronics. Pr, 1Co-Authors: Ronald J. Gutmann, Yongchai Kwon, John F. Mcdonald, Timothy S. CaleAbstract:Three-Dimensional (3d) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3d integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.
Victoria M. Virador - One of the best experts on this subject based on the ideXlab platform.
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In vitro Three-Dimensional (3d) models in cancer research: An update
Molecular Carcinogenesis, 2013Co-Authors: Lauren C. Kimlin, Giovanna Casagrande, Victoria M. ViradorAbstract:Tissues are Three-Dimensional (3d) entities as is the tumor that arises within them. Though disaggregated cancerous tissues have produced numerous cell lines for basic and applied research, it is generally agreed that these lines are poor models of in vivo phenomena. In this review we focus on in vitro 3d models used in cancer research, particularly their contribution to molecular studies of the early stages of metastasis, angiogenesis, the tumor microenvironment, and cancer stem cells. We present a summary of the various formats used in the field of tissue bioengineering as they apply to mechanistic modeling of cancer stages or processes. In addition we list studies that model specific types of malignancies, highlight drastic differences in results between 3d in vitro models and classical monolayer culturing techniques, and establish the need for standardization of 3d models for meaningful preclinical and therapeutic testing.
Ling Guo - One of the best experts on this subject based on the ideXlab platform.
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Epigenetic changes of mesenchymal stem cells in three‐dimensional (3d) spheroids
Journal of cellular and molecular medicine, 2014Co-Authors: Ling Guo, Ying Zhou, Shan X. WangAbstract:Mesenchymal stem cells (MSCs) hold profound promise in tissue repair/regeneration. However, MSCs undergo remarkable spontaneous differentiation and aging during monolayer culture expansion. In this study, we found that 2-3 days of Three-Dimensional (3d) spheroid culture of human MSCs (hMSCs) that had been expanded in monolayer for six passages increased their clonogenicity and differentiation potency to neuronal cells. Moreover, in accordance with these changes, the expression levels of miRNA which were involved in stem cell potency were changed and levels of histone H3 acetylation in K9 in promoter regions of Oct4, Sox2 and Nanog were elevated. Our results indicate that spheroid culture increases their multi-potency and changes the epigenetic status of pluripotent genes in hMSCs.
