The Experts below are selected from a list of 10638 Experts worldwide ranked by ideXlab platform
Koji Sugioka - One of the best experts on this subject based on the ideXlab platform.
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Progress in Ultrafast laser processing and future prospects
Nanophotonics, 2017Co-Authors: Koji SugiokaAbstract:AbstractThe unique characteristics of Ultrafast Lasers have rapidly revolutionized materials processing after their first demonstration in 1987. The ultrashort pulse width of the laser suppresses heat diffusion to the surroundings of the processed region, which minimizes the formation of a heat-affected zone and thereby enables ultrahigh precision micro- and nanofabrication of various materials. In addition, the extremely high peak intensity can induce nonlinear multiphoton absorption, which extends the diversity of materials that can be processed to transparent materials such as glass. Nonlinear multiphoton absorption enables three-dimensional (3D) micro- and nanofabrication by irradiation with tightly focused femtosecond laser pulses inside transparent materials. Thus, Ultrafast Lasers are currently widely used for both fundamental research and practical applications. This review presents progress in Ultrafast laser processing, including micromachining, surface micro- and nanostructuring, nanoablation, and 3D and volume processing. Advanced technologies that promise to enhance the performance of Ultrafast laser processing, such as hybrid additive and subtractive processing, and shaped beam processing are discussed. Commercial and industrial applications of Ultrafast laser processing are also introduced. Finally, future prospects of the technology are given with a summary.
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Ultrafast Lasers-reliable tools for advanced materials processing
Light: Science & Applications, 2014Co-Authors: Koji Sugioka, Ya ChengAbstract:The unique characteristics of Ultrafast Lasers, such as picosecond and femtosecond Lasers, have opened up new avenues in materials processing that employ ultrashort pulse widths and extremely high peak intensities. Thus, Ultrafast Lasers are currently used widely for both fundamental research and practical applications. This review describes the characteristics of Ultrafast laser processing and the recent advancements and applications of both surface and volume processing. Surface processing includes micromachining, micro- and nanostructuring, and nanoablation, while volume processing includes two-photon polymerization and three-dimensional (3D) processing within transparent materials. Commercial and industrial applications of Ultrafast laser processing are also introduced, and a summary of the technology with future outlooks are also given. Scientists in Asia have reviewed the role of Ultrafast Lasers in materials processing. Koji Sugioka from RIKEN in Japan and Ya Cheng from the Shanghai Institute of Optics and Fine Mechanics in China describe how femtosecond and picosecond Lasers can be used to perform useful tasks in both surface and volume processing. Such Lasers can cut, drill and ablate a variety of materials with high precision, including metals, semiconductors, ceramics and glasses. They can also polymerize organic materials that contain a suitable photosensitizer and can three-dimensionally process inside transparent materials such as glass, and are already being used to fabricate medical stents, repair photomasks, drill ink-jet nozzles and pattern solar cells. The researchers also explain the characteristics of such Lasers and the interaction of ultrashort, intense pulses of light with matter.
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Ultrafast Laser Micro- and Nano-Processing of Glasses
Lasers in Materials Science, 2014Co-Authors: Koji SugiokaAbstract:Ultrafast Lasers can perform high-quality, high-precision surface micromachining of glasses through multiphoton absorption. When an Ultrafast laser beam with a moderate pulse energy is focused into glass, multiphoton absorption is confined to a region near the focal point inside the glass. Ultrafast Lasers can thus perform internal modification of glass as well as surface processing. Internal modification is widely used to write 3D optical waveguides and to fabricate micro-optical components and microfluidic channels buried inside glass, enabling functional microdevices such as 3D photonic, microfluidic, and optofluidic devices to be fabricated. Glass bonding based on internal melting is another interesting application of Ultrafast Lasers. Tailoring the temporal profiles of Ultrafast laser pulses can improve the quality and efficiency of Ultrafast laser processing and enhance the fabrication resolution. This chapter comprehensively reviews several applications of surface and volume processing of glass, including surface micromachining and the fabrication of photonic, microfluidic, and optofluidic devices. It also discusses pulse-shaping techniques for achieving high-quality, high-efficiency, and high-resolution processing.
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a tutorial on optics for Ultrafast laser materials processing basic microprocessing system to beam shaping and advanced focusing methods
Advanced Optical Technologies, 2012Co-Authors: Koji Sugioka, Ya ChengAbstract:Ultrafast Lasers have excellent characteristics for materials processing in terms of precision and quality. This tutorial paper introduces the basic concepts of ultra- fast laser materials processing and the structure and key components of typical Ultrafast laser microprocessing systems. The emphasis is on the pulse-shaping devices and systems for controlling and manipulating the spatial, temporal, and polarization properties of focused femto- second laser pulses.
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Ultrafast Laser Processing of Glass Down to the Nano-Scale
Laser-Surface Interactions for New Materials Production, 2009Co-Authors: Koji SugiokaAbstract:Ultrafast Lasers can induce strong absorption in materials and even in transparent materials, due to nonlinear multiphoton absorption. By using this phenomenon, surface microstructuring and dicing of glass are successfully demonstrated. When the Ultrafast laser is focused inside a transparent material with adequate pulse energies, absorption can be confined to a region near the focus point allowing for internal processing of the transparent material such as three-dimensional (3D) optical waveguide writing and fabrication of micro-optical components and microchannels buried inside the glass. Another important feature of Ultrafast Lasers is the suppression of heat diffusion to the surroundings of the processed area, which makes nanoscale fabrication possible. In addition, nonlinear multiphoton absorption can further improve the spatial resolution beyond that of the laser. In this chapter, the features of Ultrafast laser processing are first described and clarified. Then, some relevant topics of glass processing including nanoscale fabrication are reviewed.
Frank W Wise - One of the best experts on this subject based on the ideXlab platform.
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several new directions for Ultrafast fiber Lasers invited
Optics Express, 2018Co-Authors: Logan G Wright, Sterling Backus, Pavel Sidorenko, Frank W WiseAbstract:Ultrafast fiber Lasers have the potential to make applications of ultrashort pulses widespread – techniques not only for scientists, but also for doctors, manufacturing engineers, and more. Today, this potential is only realized in refractive surgery and some femtosecond micromachining. The existing market for Ultrafast Lasers remains dominated by solid-state Lasers, primarily Ti:sapphire, due to their superior performance. Recent advances show routes to Ultrafast fiber sources that provide performance and capabilities equal to, and in some cases beyond, those of Ti:sapphire, in compact, versatile, low-cost devices. In this paper, we discuss the prospects for future Ultrafast fiber Lasers built on new kinds of pulse generation that capitalize on nonlinear dynamics. We focus primarily on three promising directions: mode-locked oscillators that use nonlinearity to enhance performance; systems that use nonlinear pulse propagation to achieve ultrashort pulses without a mode-locked oscillator; and multimode fiber Lasers that exploit nonlinearities in space and time to obtain unparalleled control over an electric field.
Eric Mazur - One of the best experts on this subject based on the ideXlab platform.
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Industrial applications of Ultrafast laser processing
MRS Bulletin, 2016Co-Authors: Eric Mottay, Eric Mazur, Xinbing Liu, Haibin Zhang, Reza Sanatinia, Wilhelm PflegingAbstract:Industrial Ultrafast Lasers are a key component of many new industrial manufacturing processes. The virtually athermal nature of the laser–matter interaction process enables high-quality material processing for many different materials with feature size reaching into the nanometer scale. Advances in laser average power and beam-delivery technology have significantly improved the throughput and productivity of real-life industrial and medical applications. In this article, we present key examples of laser processing, including drilling, cutting, and surface processing. In particular, we describe how Ultrafast Lasers can improve vision in patients, extend battery lifetime, improve the efficiency of solar cells and infrared detectors, or be applied in the printing or microelectronics industries. These examples demonstrate how further developments rely on a combination of laser technology, beam handling and delivery, and laser–matter interaction processes.
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Ultrafast laser processing of materials: a review
Advances in Optics and Photonics, 2015Co-Authors: Katherine C. Phillips, Eric Mazur, Hemi H. Gandhi, S. K. SundaramAbstract:We present an overview of the different processes that can result from focusing an Ultrafast laser light in the femtosecond–nanosecond time regime on a host of materials, e.g., metals, semiconductors, and insulators. We summarize the physical processes and surface and bulk applications and highlight how femtosecond Lasers can be used to process various materials. Throughout this paper, we will show the advantages and disadvantages of using Ultrafast Lasers compared with Lasers that operate in other regimes and demonstrate their potential for the Ultrafast processing of materials and structures.
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Femtosecond laser micromachining in transparent materials
Nature Photonics, 2008Co-Authors: Rafael R. Gattass, Eric MazurAbstract:Femtosecond laser micromachining can be used either to remove materials or to change a material's properties, and can be applied to both absorptive and transparent substances. Over the past decade, this technique has been used in a broad range of applications, from waveguide fabrication to cell ablation. This review describes the physical mechanisms and the main experimental parameters involved in the femtosecond laser micromachining of transparent materials, and important emerging applications of the technology. Interactions between laser and matter are fascinating and have found a wide range of applications. This article gives an overview of the fundamental physical mechanisms in the processing of transparent materials using Ultrafast Lasers, as well as important emerging applications of the technology.
F. Courvoisier - One of the best experts on this subject based on the ideXlab platform.
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Ultrafast laser processing of glass and sapphire using nondiffracting beams
2018Co-Authors: F. Courvoisier, P.-a. Lacourt, L. Furfaro, Rémi Meyer, Maxime Jacquot, Remo Giust, Ludovic Rapp, Jesus Del Hoyo, Chen Xie, John Michaël DudleyAbstract:Ultrafast Lasers used for micro and nano machining now offer the reliability and performance for mass production. In the particular field of transparent materials processing, a key capability of ultrashort pulses is that they can drill and modify matter from inside the material itself. We demonstrate that using appropriate beam shaping, it is possible to produce voids or nano-channels using a single pulse in even the hardest materials, and this has recently led to major advances in the field of stealth dicing, which is a non-ablative technique used to cleave and separate transparent materials at extremely high processing speeds. We report novel recent developments where Bessel beam have been used to create cracks and cleave sapphire, but also where symmetry has been broken to enhance cleaveability of laser-processed glass.
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Micron-precision in cleaving glass using Ultrafast Bessel beams with engineered transverse beam shapes
2017Co-Authors: Rémi Meyer, P.-a. Lacourt, L. Furfaro, Remo Giust, Jassem Safioui, John Michaël Dudley, F. CourvoisierAbstract:Ultrafast Lasers in association to beam shaping have shown to be excellent candidates for transparent material processing. Non-diffractive solutions such as Bessel beams allows for precise energy deposition since they are robust to undesired non-linear effects and as they do not distort along the propagation. This offers important opportunities in laser-assisted cleaving, i.e. mechanical medium separation after single-pass laser illumination. Here we break the Bessel beam cylindrical symmetry using a novel anisotropic and non-diffractive solutions to investigate both lateral intensity contributions on material response and induced processing effect for non-cylindrical defects. Using such beam shape, we report a strong cleavability enhancement as well as an improvement of the final robustness of the separated glass in comparison with Bessel beams. We demonstrate cleaving for laser-writing speed as high as 25mm/s with ~1μm accuracy over the whole 20mm sample length.
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Single-shot Ultrafast laser processing of high-aspect-ratio nanochannels using elliptical Bessel beams
Optics Letters, 2017Co-Authors: Rémi Meyer, P.-a. Lacourt, L. Furfaro, Maxime Jacquot, Remo Giust, Jassem Safioui, Ludovic Rapp, John Michaël Dudley, F. CourvoisierAbstract:Ultrafast Lasers have revolutionized material processing, opening a wealth of new applications in many areas of science. A recent technology that allows the cleaving of transparent materials via non-ablative processes is based on focusing and translating a high-intensity laser beam within a material to induce a well-defined internal stress plane. This then enables material separation without debris generation. Here, we use a non-diffracting beam engineered to have a transverse elliptical spatial profile to generate high-aspect-ratio elliptical channels in glass of a dimension 350 nm×710 nm and subsequent cleaved surface uniformity at the sub-micron level.
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Ultrafast laser structuring of glass and sapphire materials with tailored beams
2016Co-Authors: F. Courvoisier, P.-a. Lacourt, L. Furfaro, Rémi Meyer, Maxime Jacquot, Remo Giust, Ludovic Rapp, Ismail Ouadghiri Idrissi, Luc Froehly, John Michaël DudleyAbstract:Ultrafast Lasers have become a key tool for advanced structuring of glass and other transparent hard and brittle materials. In this context, it is crucial to control the propagation of the laser pulse inside the transparent medium while the complex laser-matter interaction renders it highly nonlinear. We have shown that a particular class of beam shapes, ie "diffraction-free" beams, enables a novel degree of control of light-matter interaction with a quasi-uniform deposition of energy in the material. This enabled for instance high-aspect ratio nanochannel drilling with a single laser pulse in various transparent materials [1]. We reported curved laser processing [2] or high-aspect ratio tubular shape inscription [3]. We will review how the specific structure of nondiffracting and curved beams allows for controlling energy deposition in transparent materials and review their applications to laser materials processing of transparent materials [4].
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Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass
2010Co-Authors: M.k. Bhuyan, F. Courvoisier, P.-a. Lacourt, M. Jacquot, L. Furfaro, M. J. Withford, J.m. DudleyAbstract:Although Ultrafast Lasers have demonstrated much success in structuring and ablating dielectrics on the micrometer scale and below, high aspect ratio structuring remains a challenge. Specifically, microfluidics or lab-on-chip DNA sequencing systems require high aspect ratio sub-10 mu m wide channels with no taper. Micro-dicing also requires machining with vertical walls. Backside water assisted Ultrafast laser processing with Gaussian beams allows the production of high aspect ratio microchannels but requires sub-micron sample positioning and precise control of translation velocity. In this context, we propose a new approach based on Bessel beams that exhibit a focal range exceeding the Rayleigh range by over one order of magnitude. An SLM-based setup allows us to produce a Bessel beam with central core diameter of 1.5 mu m FWHM extending over a longitudinal range of 150 mu m. A working window in the parameter space has been identified that allows the reliable production of high aspect ratio taper-free microchannels without sample translation. We report a systematic investigation of the damage morphology dependence on focusing geometry and energy per pulse.
Ursula Keller - One of the best experts on this subject based on the ideXlab platform.
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Ultrafast Laser Oscillators in the Thin Disk Geometry
Optik & Photonik, 2008Co-Authors: Ursula Keller, Thomas SudmeyerAbstract:One of the major technology trends in laser research is the progress of Ultrafast laser sources from complicated laboratory systems towards compact and reliable instruments. SESAMmodelocked Ultrafast Lasers using the thin disk geometry are a promising technology for this task.
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Recent developments in compact Ultrafast Lasers
Nature, 2003Co-Authors: Ursula KellerAbstract:Ultrafast Lasers, which generate optical pulses in the picosecond and femtosecond range, have progressed over the past decade from complicated and specialized laboratory systems to compact, reliable instruments. Semiconductor Lasers for optical pumping and fast optical saturable absorbers, based on either semiconductor devices or the optical nonlinear Kerr effect, have dramatically improved these Lasers and opened up new frontiers for applications with extremely short temporal resolution (much smaller than 10 fs), extremely high peak optical intensities (greater than 10 TW/cm2) and extremely fast pulse repetition rates (greater than 100 GHz).
