The Experts below are selected from a list of 5034 Experts worldwide ranked by ideXlab platform
Aaron J Shenhar - One of the best experts on this subject based on the ideXlab platform.
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why projects fail how contingency theory can provide new insights a comparative Analysis of nasa s mars climate orbiter loss
International Journal of Project Management, 2009Co-Authors: Brian Sauser, Richard R Reilly, Aaron J ShenharAbstract:Abstract When important projects fail, the investigation is often focused on the engineering and technical reasons for the failure. That was the case in NASA’s Mars Climate Orbiter (MCO) that was lost in space after completing its nine-month journey to Mars. Yet, in many cases the root cause of the failure is not technical, but managerial. Often the problem is rooted in management’s failure to select the right approach to the specific project. The objective of this paper is to enrich our understanding of project failure due to managerial reasons by utilizing different contingency theory frameworks for a retrospective look at unsuccessful projects and perhaps more important, potential prevention of future failures. The evolving field of project management contingency theory provides an opportunity at this time to re-examine the concept of fit between project characteristics and project management, and offer deeper insights on why projects fail. After outlining several existing contingency studies, we use three distinct frameworks for analyzing the MCO project. These frameworks include Henderson and Clark’s categorization of change and innovation, Shenhar and Dvir’s NTCP diamond framework, and Pich, Loch, and De Meyer’s strategies for managing uncertainty. While each framework provides a different perspective, collectively, they demonstrate that in the MCO program, the choices made by managers, or more accurately, the constraints imposed on them under the policy of ‘better, faster, cheaper’, led the program to its inevitable failure. This paper shows that project management contingency theory can indeed provide new insights for a deeper understanding of project failure. Furthermore, it suggests implications for a richer Upfront Analysis of a project’s unique characteristics of uncertainty and risk, as well as additional directions of research. Such research may help establish new and different conceptions on project success and failure beyond the traditional success factors, and subsequently develop more refined contingency frameworks. The results of such research may enable future project managers to rely less on heuristics and possibly lead to a new application of “project management design.”
Brian Sauser - One of the best experts on this subject based on the ideXlab platform.
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why projects fail how contingency theory can provide new insights a comparative Analysis of nasa s mars climate orbiter loss
International Journal of Project Management, 2009Co-Authors: Brian Sauser, Richard R Reilly, Aaron J ShenharAbstract:Abstract When important projects fail, the investigation is often focused on the engineering and technical reasons for the failure. That was the case in NASA’s Mars Climate Orbiter (MCO) that was lost in space after completing its nine-month journey to Mars. Yet, in many cases the root cause of the failure is not technical, but managerial. Often the problem is rooted in management’s failure to select the right approach to the specific project. The objective of this paper is to enrich our understanding of project failure due to managerial reasons by utilizing different contingency theory frameworks for a retrospective look at unsuccessful projects and perhaps more important, potential prevention of future failures. The evolving field of project management contingency theory provides an opportunity at this time to re-examine the concept of fit between project characteristics and project management, and offer deeper insights on why projects fail. After outlining several existing contingency studies, we use three distinct frameworks for analyzing the MCO project. These frameworks include Henderson and Clark’s categorization of change and innovation, Shenhar and Dvir’s NTCP diamond framework, and Pich, Loch, and De Meyer’s strategies for managing uncertainty. While each framework provides a different perspective, collectively, they demonstrate that in the MCO program, the choices made by managers, or more accurately, the constraints imposed on them under the policy of ‘better, faster, cheaper’, led the program to its inevitable failure. This paper shows that project management contingency theory can indeed provide new insights for a deeper understanding of project failure. Furthermore, it suggests implications for a richer Upfront Analysis of a project’s unique characteristics of uncertainty and risk, as well as additional directions of research. Such research may help establish new and different conceptions on project success and failure beyond the traditional success factors, and subsequently develop more refined contingency frameworks. The results of such research may enable future project managers to rely less on heuristics and possibly lead to a new application of “project management design.”
Richard R Reilly - One of the best experts on this subject based on the ideXlab platform.
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why projects fail how contingency theory can provide new insights a comparative Analysis of nasa s mars climate orbiter loss
International Journal of Project Management, 2009Co-Authors: Brian Sauser, Richard R Reilly, Aaron J ShenharAbstract:Abstract When important projects fail, the investigation is often focused on the engineering and technical reasons for the failure. That was the case in NASA’s Mars Climate Orbiter (MCO) that was lost in space after completing its nine-month journey to Mars. Yet, in many cases the root cause of the failure is not technical, but managerial. Often the problem is rooted in management’s failure to select the right approach to the specific project. The objective of this paper is to enrich our understanding of project failure due to managerial reasons by utilizing different contingency theory frameworks for a retrospective look at unsuccessful projects and perhaps more important, potential prevention of future failures. The evolving field of project management contingency theory provides an opportunity at this time to re-examine the concept of fit between project characteristics and project management, and offer deeper insights on why projects fail. After outlining several existing contingency studies, we use three distinct frameworks for analyzing the MCO project. These frameworks include Henderson and Clark’s categorization of change and innovation, Shenhar and Dvir’s NTCP diamond framework, and Pich, Loch, and De Meyer’s strategies for managing uncertainty. While each framework provides a different perspective, collectively, they demonstrate that in the MCO program, the choices made by managers, or more accurately, the constraints imposed on them under the policy of ‘better, faster, cheaper’, led the program to its inevitable failure. This paper shows that project management contingency theory can indeed provide new insights for a deeper understanding of project failure. Furthermore, it suggests implications for a richer Upfront Analysis of a project’s unique characteristics of uncertainty and risk, as well as additional directions of research. Such research may help establish new and different conceptions on project success and failure beyond the traditional success factors, and subsequently develop more refined contingency frameworks. The results of such research may enable future project managers to rely less on heuristics and possibly lead to a new application of “project management design.”
Liu Kuan - One of the best experts on this subject based on the ideXlab platform.
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Package Design Optimization and Materials Selection for Stack Die BGA Package
2020Co-Authors: Rahul Kapoor, Beng Lim, Liu KuanAbstract:Abstract Due to an expanding consumer electronics market and the need for form factor reduction, stack packages have been gaining popularity in the last 3 years. With the incorporation of silicon die stacking, there is a corresponding increase in bimaterial coupling and interfacial adhesion becomes a prime reliability concern. Interfacial delamination between the diemold compound is an existing issue that limits the package reliability under the exposure of both moisture and thermal excursion. With the requirement for higher solder reflow temperatures for lead-free applications, the problem becomes even more severe. It becomes increasingly important to understand the combined effects of material selection and package structure on the interfacial delamination under temperature excursion in the presence of moisture. This paper presents a detailed Analysis into the effects of packaging materials and structure on interfacial delamination under temperature excursion in the presence of moisture for two die stack fine pitch BGA (D2-FBGA). Upfront Analysis based on thermo-mechanical modeling is performed prior to a full design of experiments (DOE) investigation. The current DOE matrix includes variation in mold compound and geometrical construction in terms of die size and substrate thickness. Test results show that the silicon to package ratio has a strong correlation to die-mold compound delamination and other test factors such as geometrical variations in diestacking and the selection of mold compound influence the intensity of delamination Introduction Semiconductor industry's demand for higher levels of integration, lower costs, and a growing awareness of complete system configuration through SiP solutions [1-3] is enabling wide acceptance of multi-chip packaging. With an increasing importance on form factor reduction, especially in mobile and wireless consumer products, stacked die packages are becoming more common in cell phones, digital cameras and hand-held devices. Electronic packaging techniques that use only planar dimensions are no longer effective enough to answer the requirements of continually shrinking personal electronic products. Using 3-D packaging, devices can be made much smaller and lighter than with planar 2-D packagin
Rahul Kapoor - One of the best experts on this subject based on the ideXlab platform.
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Package Design Optimization and Materials Selection for Stack Die BGA Package
2020Co-Authors: Rahul Kapoor, Beng Lim, Liu KuanAbstract:Abstract Due to an expanding consumer electronics market and the need for form factor reduction, stack packages have been gaining popularity in the last 3 years. With the incorporation of silicon die stacking, there is a corresponding increase in bimaterial coupling and interfacial adhesion becomes a prime reliability concern. Interfacial delamination between the diemold compound is an existing issue that limits the package reliability under the exposure of both moisture and thermal excursion. With the requirement for higher solder reflow temperatures for lead-free applications, the problem becomes even more severe. It becomes increasingly important to understand the combined effects of material selection and package structure on the interfacial delamination under temperature excursion in the presence of moisture. This paper presents a detailed Analysis into the effects of packaging materials and structure on interfacial delamination under temperature excursion in the presence of moisture for two die stack fine pitch BGA (D2-FBGA). Upfront Analysis based on thermo-mechanical modeling is performed prior to a full design of experiments (DOE) investigation. The current DOE matrix includes variation in mold compound and geometrical construction in terms of die size and substrate thickness. Test results show that the silicon to package ratio has a strong correlation to die-mold compound delamination and other test factors such as geometrical variations in diestacking and the selection of mold compound influence the intensity of delamination Introduction Semiconductor industry's demand for higher levels of integration, lower costs, and a growing awareness of complete system configuration through SiP solutions [1-3] is enabling wide acceptance of multi-chip packaging. With an increasing importance on form factor reduction, especially in mobile and wireless consumer products, stacked die packages are becoming more common in cell phones, digital cameras and hand-held devices. Electronic packaging techniques that use only planar dimensions are no longer effective enough to answer the requirements of continually shrinking personal electronic products. Using 3-D packaging, devices can be made much smaller and lighter than with planar 2-D packagin
