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Abrasive Polishing

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Yongwei Zhu – One of the best experts on this subject based on the ideXlab platform.

  • Mechanical removal of SiC by multi-Abrasive particles in fixed Abrasive Polishing using molecular dynamics simulation
    Computational Materials Science, 2021
    Co-Authors: Piao Zhou, Nannan Zhu, Fengli Niu, Yongwei Zhu
    Abstract:

    Abstract Molecular dynamics (MD) as a powerful simulation tool revealed the mechanistic removal behaviors of SiC substrates using a fixed Abrasive Polishing (FAP) with randomly distributed multi-Abrasive particles in a single cycle scratching at nano-scales. This study presents features of surface morphology, subsurface damage and temperature distribution of SiC substrates in nano-abrading. It is demonstrated that the exposed height and Abrasive distribution of multi Abrasives in a single pad asperity (SPA) dominates the removal behaviors of SiC substrates. MD simulation reveals that the random distribution of diamond Abrasives in FAP pad would worsen the processing quality. Our investigation sheds new insights into the mechanical removal mechanisms of SiC in FAP at an asperity-scale.

  • Molecular Dynamics Study on Sub-Nanoscale Removal Mechanism of 3C-SIC in a Fixed Abrasive Polishing
    2020 China Semiconductor Technology International Conference (CSTIC), 2020
    Co-Authors: Piao Zhou, Yongwei Zhu, Tao Sun
    Abstract:

    The mechanical removal mechanism of silicon carbide crystal is investigated by Molecular Dynamics (MD) simulation in a fixed Abrasive Polishing. Special attention is paid to the effect of the sub-nano scratching depth on the mechanical removal behavior. It was found that only the amorphous phase transition occurs in SiC. The temperature, subsurface damage depth and removal rate of SiC substrates increase with the increase of scratching depth. Furthermore, the result shows that the scratching force increases as the scratching depth increases.

  • Silica-assisted fixed agglomerated diamond Abrasive Polishing
    Journal of Manufacturing Processes, 2020
    Co-Authors: Jiapeng Chen, Yongwei Zhu, Yanan Peng, Jitong Guo, Ding Cong
    Abstract:

    Abstract The fixed agglomerated diamond Abrasive pad had been used to planarize ultra-hard and brittle materials such as sapphire and SiC. However, the processing stability and surface integrity of sapphire remain to be improved. A silica-assisted fixed agglomerated diamond Abrasive Polishing (SA-FADAP) process was developed to solve the above mentioned problems. The material removal mechanism of the SA-FADAP was explored by analyzing material removal rate gradient (MRRG), surface topography of workpieces, the pad abrasion, and wear debris in the slurry wastes. The effects of silica grains on the self-conditioning processes of fixed agglomerated diamond Abrasive pads were discussed. The efficient and stable SA-FADAP was mainly realized by the chemical-mechanical interaction produced by agglomerated diamond Abrasives and silica Polishing slurry.

Hua Guo – One of the best experts on this subject based on the ideXlab platform.

Jiang Guo – One of the best experts on this subject based on the ideXlab platform.

  • Finishing of rectangular microfeatures by localized vibration-assisted magnetic Abrasive Polishing method
    Journal of Manufacturing Processes, 2020
    Co-Authors: Jiang Guo, Wenhe Feng, Henry Jia Hua Jong, Hirofumi Suzuki, Renke Kang
    Abstract:

    Abstract Rectangular microfeatures have been adopted in many precision mechanical components for optics, microfluidics and surface engineering applications. Recently, precision machining technologies such as cutting and milling have been increasingly employed for fabricating these microfeatures in size of tens to hundreds of micrometers. However, due to the limitation of the achievable surface quality attributed to burrs and tool marks, a post Polishing process becomes an indispensable step. For microfeatures, form dominates the function while surface quality affects the performance. Therefore, improving surface quality without deteriorating form accuracy is the key challenge to polish microfeatures. Thus, this paper presents an analytical and experimental investigation on finishing of rectangular microfeatures by using localized vibration-assisted magnetic Abrasive Polishing (VAMAP) method, aiming to achieve surface quality improvement without deteriorating the form of microfeatures. The suitable magnetic field distribution was determined through comparing different configurations of pole and magnet. Polishing force and lifetime of Abrasives were quantitatively evaluated. The results demonstrated that the method was applicable to curved rectangular microfeatures for both ferromagnetic and non-ferromagnetic materials. The surface quality was improved that the burrs and tool marks were removed while the form of microfeatures was well maintained.

  • novel rotating vibrating magnetic Abrasive Polishing method for double layered internal surface finishing
    Journal of Materials Processing Technology, 2019
    Co-Authors: Jiang Guo, Kui Liu, Chun Wai Kum, Hirofumi Suzuki, Chennan Sun, Min Hao Goh, Jun Wei, Renke Kang
    Abstract:

    Abstract Components with complex internal surfaces are increasingly important for gas and fluid flow applications in aerospace and automotive industries. Recently, as an emerging manufacturing technology, three-dimensional (3D) additive manufacturing (AM) technology enables one-step fabrication of these complex internal surfaces. Although 3D AM technology eliminates the need for complex assembly process, due to the poor surface and sub-surface integrity, achieving a favourable surface condition is challenging. Therefore, a post-Polishing process is essential for these 3D AM complex internal surfaces. This paper presents a novel rotating-vibrating magnetic Abrasive Polishing method to finish a kind of complex internal surface which has a double-layered tube structure made by selective laser melting (SLM) of Inconel 718. The principle of the method was illustrated and the material removal process was modelled. The feasibility of the method was verified and the surface evolution mechanism under different motions was revealed. The effects of process parameters on material removal and surface quality were evaluated quantitatively. The results showed that material was uniformly removed from both of the external surface of inner tube and internal surface of outer tube. The uneven surface caused by partially melt powders during SLM process was smoothed and the surface roughness was reduced from about 7 μm Ra to less than 1 μm Ra. Relatively higher material removal efficiency and lower surface roughness were obtained through combining rotation and vibration motions. The surface quality was improved representing by the increase of surface nanohardness and release of residual stress after Polishing. There was no subsurface deformation and damage observed so that a damage-free surface was obtained.

  • Novel localized vibration-assisted magnetic Abrasive Polishing method using loose Abrasives for V-groove and Fresnel optics finishing
    Optics express, 2018
    Co-Authors: Jiang Guo, Renke Kang, Henry Jia Hua Jong, Dongming Guo
    Abstract:

    This paper presents a new localized vibration-assisted magnetic Abrasive Polishing (VAMAP) method using loose Abrasives for V-groove and Fresnel optics finishing. The purpose is to improve the surface quality while maintaining the form of the microfeatures. This method allows Abrasives to access the corners of the microfeatures and remove materials locally and uniformly by effectively controlling the magnetic field and vibration which overcomes the limitations of previous research. By using loose Abrasives, the method achieved nanometer level surface roughness and damage-free surface while maintaining the form of the microfeatures. The results show that the surface roughness was reduced to about 7 nm Ra from the initial value of over 10 nm Ra while the microfeatures of V-groove and Fresnel optics were well maintained. At the same time, the surface defects including voids, scratches as well as tool marks were clearly removed.

Piao Zhou – One of the best experts on this subject based on the ideXlab platform.

  • Mechanical removal of SiC by multi-Abrasive particles in fixed Abrasive Polishing using molecular dynamics simulation
    Computational Materials Science, 2021
    Co-Authors: Piao Zhou, Nannan Zhu, Fengli Niu, Yongwei Zhu
    Abstract:

    Abstract Molecular dynamics (MD) as a powerful simulation tool revealed the mechanistic removal behaviors of SiC substrates using a fixed Abrasive Polishing (FAP) with randomly distributed multi-Abrasive particles in a single cycle scratching at nano-scales. This study presents features of surface morphology, subsurface damage and temperature distribution of SiC substrates in nano-abrading. It is demonstrated that the exposed height and Abrasive distribution of multi Abrasives in a single pad asperity (SPA) dominates the removal behaviors of SiC substrates. MD simulation reveals that the random distribution of diamond Abrasives in FAP pad would worsen the processing quality. Our investigation sheds new insights into the mechanical removal mechanisms of SiC in FAP at an asperity-scale.

  • Molecular Dynamics Study on Sub-Nanoscale Removal Mechanism of 3C-SIC in a Fixed Abrasive Polishing
    2020 China Semiconductor Technology International Conference (CSTIC), 2020
    Co-Authors: Piao Zhou, Yongwei Zhu, Tao Sun
    Abstract:

    The mechanical removal mechanism of silicon carbide crystal is investigated by Molecular Dynamics (MD) simulation in a fixed Abrasive Polishing. Special attention is paid to the effect of the sub-nano scratching depth on the mechanical removal behavior. It was found that only the amorphous phase transition occurs in SiC. The temperature, subsurface damage depth and removal rate of SiC substrates increase with the increase of scratching depth. Furthermore, the result shows that the scratching force increases as the scratching depth increases.

  • Molecular dynamics study of the removal mechanism of SiC in a fixed Abrasive Polishing in water lubrication
    Ceramics International, 2020
    Co-Authors: Piao Zhou, Jiapeng Chen, Zikun Wang, Yongwei Zhu
    Abstract:

    Abstract The mechanical removal mechanism of SiC substrates in the water-lubricated environment is investigated by molecular dynamics (MD) simulation. The surface quality, subsurface damage, removal efficiency and structural phase transition of SiC substrates were analyzed in a fixed Abrasive Polishing (FAP) under various water film thickness and external load. In water-lubricated environment, a small number of water molecules are pressed on the interface between the SiC substrates and the diamond Abrasive. The results show that the largest pressing depth decreases with the increase of the water film thickness, contrary to the effect of the external load. The phase transition and the frictional heat both decrease as the pressing depth decreases, which further reduces the stress and temperature of the substrate in the FAP. The water layer has positive impact on the surface roughness and subsurface damage depth. Furthermore, the removal efficiency in the water-lubricated nano-abrading is lower than that in the dry process. Our researches benefit to understand the mechanical removal mechanism of SiC substrates under a water-lubricated environment and give theoretical guide for improving the machining technology of FAP.

Qiufa Luo – One of the best experts on this subject based on the ideXlab platform.

  • Fabrication of a resin-bonded ultra-fine diamond Abrasive Polishing tool by electrophoretic co-deposition for SiC processing
    Precision Engineering, 2017
    Co-Authors: Qiufa Luo, X.y. Mao, Wang Yaguang, Hua Guo
    Abstract:

    Abstract A resin-bonded ultra-fine diamond Abrasive Polishing tool is fabricated by electrophoretic co-deposition (EPcD), and the processing performance of the tool is evaluated in this study. The dispersion stability of suspensions is characterized by a laser particle size analyzer and settlement ratio. The cathodic EPcD of composite powder is realized by adding Al 3+ into the suspension. The sintering temperature of composite coatings is determined by differential thermal analysis/thermogravimetry. The surface morphology of the composite coating is observed under a confocal microscope. Results show that uniform, dense, and smooth coatings with diamond and resin particles distributed homogeneously are obtained from the steel substrate. A large (Φ150 mm) Polishing tool with a 20 μm-thick coating is successfully prepared using the above process. A smooth mirror surface of SiC wafer with a nanoscale roughness (4.3 nm) is achieved after processing with the ultra-fine diamond Abrasive Polishing tool.

  • a comparative study on the material removal mechanisms of 6h sic polished by semi fixed and fixed diamond Abrasive tools
    Wear, 2016
    Co-Authors: Qiufa Luo
    Abstract:

    Abstract Comparative experiments involving processing SiC substrates with the semi-fixed and the fixed diamond Abrasive Polishing tool have been conducted in this study. The material removal mechanisms of SiC substrates are investigated by the surface topography of substrate, the wear appearance of Abrasives in tools and the analysis of wear debris. The results indicate that the removal scale of diamond grits in the fixed Abrasive Polishing film is much larger because of the higher Abrasive protrusion heights. Moreover, the unequal protrusion height of diamond Abrasives can also easily create deep scratches and damages on the substrate surface. However, the removal scale of diamond grits in the semi-fixed Abrasive Polishing film is smaller due to the effect of Abrasive yielding. The obtained smooth and scratch-free surface with nanoscale roughness can shorten the total processing time and cut the cost.