Adhesion Energy - Explore the Science & Experts | ideXlab

Scan Science and Technology

Contact Leading Edge Experts & Companies

Adhesion Energy

The Experts below are selected from a list of 36915 Experts worldwide ranked by ideXlab platform

Adhesion Energy – Free Register to Access Experts & Abstracts

Hamid Garmestani – One of the best experts on this subject based on the ideXlab platform.

  • Adhesion Energy in carbon nanotube-polyethylene composite: Effect of chirality
    Journal of Applied Physics, 2005
    Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid Garmestani
    Abstract:

    This work presents a study of the Adhesion Energy between carbon nanotube-polyethylene matrix based on molecular dynamics simulations. Specifically, the study focuses on the influence of carbon nanotube chirality on Adhesion Energy. It is observed that composites that utilize nanotubes with smaller chiral angles achieve higher Adhesion Energy, and tend to have smaller diameter and longer cylindrical axes compared to those with larger chiral angles. A zigzag nanotube (zero-chiral angle) undergoes considerable deformation to achieve an equilibrium configuration that has relatively maximum Adhesion Energy. On the other hand, the armchair nanotube (30° chiral angle) deforms moderately to reach equilibrium with minimal Adhesion bonds to the polyethylene matrix.

  • Adhesion Energy of Single Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
    Materials, 2005
    Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid Garmestani
    Abstract:

    In this paper, we investigate the Adhesion Energy at the interface between single wall carbon nanotubes and polyethylene matrix with and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, the polyethylene, and the composite.

Marwan Al-haik – One of the best experts on this subject based on the ideXlab platform.

  • Adhesion Energy of Single-Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
    Journal of Computational and Theoretical Nanoscience, 2006
    Co-Authors: Marwan Al-haik, M. Y. Hussaini
    Abstract:

    In this paper, we investigate the Adhesion Energy at the interface between single-wall carbon nanotubes (SWCNT) and polyethylene matrixwith and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, polyethylene, and composite.

  • Adhesion Energy in carbon nanotube-polyethylene composite: Effect of chirality
    Journal of Applied Physics, 2005
    Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid Garmestani
    Abstract:

    This work presents a study of the Adhesion Energy between carbon nanotube-polyethylene matrix based on molecular dynamics simulations. Specifically, the study focuses on the influence of carbon nanotube chirality on Adhesion Energy. It is observed that composites that utilize nanotubes with smaller chiral angles achieve higher Adhesion Energy, and tend to have smaller diameter and longer cylindrical axes compared to those with larger chiral angles. A zigzag nanotube (zero-chiral angle) undergoes considerable deformation to achieve an equilibrium configuration that has relatively maximum Adhesion Energy. On the other hand, the armchair nanotube (30° chiral angle) deforms moderately to reach equilibrium with minimal Adhesion bonds to the polyethylene matrix.

  • Adhesion Energy of Single Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
    Materials, 2005
    Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid Garmestani
    Abstract:

    In this paper, we investigate the Adhesion Energy at the interface between single wall carbon nanotubes and polyethylene matrix with and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, the polyethylene, and the composite.

Ludovic Bellon – One of the best experts on this subject based on the ideXlab platform.

  • Adhesion Energy of single wall carbon nanotube loops on various substrates
    Journal of Applied Physics, 2015
    Co-Authors: Anthony Ayari, Ludovic Bellon
    Abstract:

    The physics of Adhesion of one-dimensional nano structures such as nanotubes, nano wires, and biopolymers on different substrates is of great interest for the study of biological Adhesion and the development of nano electronics and nano mechanics. In this paper, we present force spectroscopy experiments of individual single wall carbon nanotube loops using a home-made interferometric atomic force microscope. Characteristic force plateaus during the peeling process allow the quantitative measurement of the Adhesion Energy per unit length on various substrates: graphite, mica, platinum, gold, and silicon. Moreover, using a time-frequency analysis of the deflection of the cantilever, we estimate the dynamic stiffness of the contact, providing more information on the nanotube configurations and its intrinsic mechanical properties.

  • Adhesion Energy of single wall carbon nanotube loops on various substrates
    arXiv: Materials Science, 2014
    Co-Authors: Anthony Ayari, Ludovic Bellon
    Abstract:

    The physics of Adhesion of one-dimensional nano structures such as nanotubes, nano wires, and biopolymers on different material substrates is of great interest for the study of biological Adhesion and the development of nano electronics and nano mechanics. In this paper, we present force spectroscopy experiments of a single wall carbon nanotube loop using our home-made interferometric atomic force microscope. Characteristic force plateaux during the peeling process allows us to access to quantitative values of the Adhesion Energy per unit length on various substrates: graphite, mica, platinum, gold and silicon. By combining a time-frequency analysis of the deflexion of the cantilever, we access to the dynamic stiffness of the contact, providing more information on the nanotube configurations and its intrinsic mechanical properties.

M. Y. Hussaini – One of the best experts on this subject based on the ideXlab platform.

  • Adhesion Energy of Single-Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
    Journal of Computational and Theoretical Nanoscience, 2006
    Co-Authors: Marwan Al-haik, M. Y. Hussaini
    Abstract:

    In this paper, we investigate the Adhesion Energy at the interface between single-wall carbon nanotubes (SWCNT) and polyethylene matrixwith and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, polyethylene, and composite.

  • Adhesion Energy in carbon nanotube-polyethylene composite: Effect of chirality
    Journal of Applied Physics, 2005
    Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid Garmestani
    Abstract:

    This work presents a study of the Adhesion Energy between carbon nanotube-polyethylene matrix based on molecular dynamics simulations. Specifically, the study focuses on the influence of carbon nanotube chirality on Adhesion Energy. It is observed that composites that utilize nanotubes with smaller chiral angles achieve higher Adhesion Energy, and tend to have smaller diameter and longer cylindrical axes compared to those with larger chiral angles. A zigzag nanotube (zero-chiral angle) undergoes considerable deformation to achieve an equilibrium configuration that has relatively maximum Adhesion Energy. On the other hand, the armchair nanotube (30° chiral angle) deforms moderately to reach equilibrium with minimal Adhesion bonds to the polyethylene matrix.

  • Adhesion Energy of Single Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
    Materials, 2005
    Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid Garmestani
    Abstract:

    In this paper, we investigate the Adhesion Energy at the interface between single wall carbon nanotubes and polyethylene matrix with and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, the polyethylene, and the composite.

Young-bae Park – One of the best experts on this subject based on the ideXlab platform.

  • A study on the interfacial Adhesion Energy between capping layer and dielectric for cu interconnects
    Microelectronics Reliability, 2021
    Co-Authors: Cheol Ho Kim, Kirak Son, Gahui Kim, Sung Tae Kim, Sol-kyu Lee, So-yeon Lee, Young-bae Park, Young-chang Joo
    Abstract:

    Abstract Recently, Cu interconnect and low-k materials have been applied to reduce the interconnect resistive-capacitive delay issue. However, as the process node size is reduced to a few nanometers, high leakage currents appear through the dielectric under high electric fields. Therefore, issues of Cu diffusion at the interface between the dielectric and the capping layer have been reported. This study investigated interfacial Adhesion Energy change at the film level between dielectric (low-k, tetraethyl orthosilicate (TEOS)) and capping layer (SiCN, SiN) taking into account the correlation between interfacial Adhesion Energy and interconnect reliability. In the capping layer/low-k interface, when low-k is applied to the top layer, it shows high interfacial Adhesion Energy (> 34.31 ± 3.49 J/m2) due to the presence of an O-rich thin layer. But when low-k is applied to the bottom layer, due to the Si C bond, it shows low interfacial Adhesion Energy ( 32.54 ± 1.97 J/m2) regardless of the stacking order and CMP process. It clearly shows that low-k dielectrics will affect the deterioration of the interfacial Adhesion Energy and O-rich layer will greatly improve the interfacial Adhesion Energy in dielectric/capping layers.

  • Effects of Post-annealing and Co Interlayer Between SiN_x and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections
    Electronic Materials Letters, 2020
    Co-Authors: Hyeonchul Lee, Kirak Son, Gahui Kim, Minsu Jeong, Jeongmin Seo, Taek-soo Kim, Young-bae Park
    Abstract:

    Effects of Co interlayer and 200 °C post-annealing treatment on interfacial Adhesion Energy of SiN_x/Cu structure were systematically investigated. Initial interfacial Adhesion Energy of SiN_x/Cu structure measured by double cantilever beam test was 0.92 J/m^2. The interfacial Adhesion Energy increased to 2.94 J/m^2 with Co interlayer between SiN_x and Cu films. After post-annealing treatment at 200 °C for 500 h, the interfacial Adhesion Energy of SiN_x/Co/Cu structure decreased to 0.95 J/m^2. X-ray photoelectron specspectroscopy analysis revealed that the interfacial Adhesion Energy increased for SiN_x/Co/Cu thin films due to CoSi_2 reaction layer at SiN_x/Co interface, but sharply decreased during post-annealing treatment by SiO_2 formation at SiN_x/Co interface. Graphic abstract

  • Effects of post-annealing and temperature/humidity treatments on the interfacial Adhesion Energy of the Cu/SiN x interface for Cu interconnects
    Japanese Journal of Applied Physics, 2016
    Co-Authors: Minsu Jeong, Hyeonchul Lee, Byung-hyun Bae, Hee-oh Kang, Wook-jung Hwang, Jun-mo Yang, Young-bae Park
    Abstract:

    The effects of 200 °C post-annealing and 85 °C and 85% relative humidity temperature and humidity (T/H) treatments on the interfacial Adhesion Energy of a Cu/SiN x interface were systematically investigated. The results of a four-point bending test, X-ray photoemission spectroscopy, and high-resolution transmission elecelectron microscopy revealed that the interfacial Adhesion Energy during T/H treatment decreased with time faster than during annealing treatment, which is closely related to the faster Cu oxidation of SiN x /Cu interfaces.