The Experts below are selected from a list of 36915 Experts worldwide ranked by ideXlab platform
Hamid Garmestani - One of the best experts on this subject based on the ideXlab platform.
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Adhesion Energy in carbon nanotube-polyethylene composite: Effect of chirality
Journal of Applied Physics, 2005Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid GarmestaniAbstract:This work presents a study of the Adhesion Energy between carbon nanotube-polyethylene matrix based on molecular dynamics simulations. Specifically, the study focuses on the influence of carbon nanotube chirality on Adhesion Energy. It is observed that composites that utilize nanotubes with smaller chiral angles achieve higher Adhesion Energy, and tend to have smaller diameter and longer cylindrical axes compared to those with larger chiral angles. A zigzag nanotube (zero-chiral angle) undergoes considerable deformation to achieve an equilibrium configuration that has relatively maximum Adhesion Energy. On the other hand, the armchair nanotube (30° chiral angle) deforms moderately to reach equilibrium with minimal Adhesion bonds to the polyethylene matrix.
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Adhesion Energy of Single Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
Materials, 2005Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid GarmestaniAbstract:In this paper, we investigate the Adhesion Energy at the interface between single wall carbon nanotubes and polyethylene matrix with and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, the polyethylene, and the composite.
Marwan Al-haik - One of the best experts on this subject based on the ideXlab platform.
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Adhesion Energy of Single-Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
Journal of Computational and Theoretical Nanoscience, 2006Co-Authors: Marwan Al-haik, M. Y. HussainiAbstract:In this paper, we investigate the Adhesion Energy at the interface between single-wall carbon nanotubes (SWCNT) and polyethylene matrixwith and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, polyethylene, and composite.
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Adhesion Energy in carbon nanotube-polyethylene composite: Effect of chirality
Journal of Applied Physics, 2005Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid GarmestaniAbstract:This work presents a study of the Adhesion Energy between carbon nanotube-polyethylene matrix based on molecular dynamics simulations. Specifically, the study focuses on the influence of carbon nanotube chirality on Adhesion Energy. It is observed that composites that utilize nanotubes with smaller chiral angles achieve higher Adhesion Energy, and tend to have smaller diameter and longer cylindrical axes compared to those with larger chiral angles. A zigzag nanotube (zero-chiral angle) undergoes considerable deformation to achieve an equilibrium configuration that has relatively maximum Adhesion Energy. On the other hand, the armchair nanotube (30° chiral angle) deforms moderately to reach equilibrium with minimal Adhesion bonds to the polyethylene matrix.
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Adhesion Energy of Single Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
Materials, 2005Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid GarmestaniAbstract:In this paper, we investigate the Adhesion Energy at the interface between single wall carbon nanotubes and polyethylene matrix with and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, the polyethylene, and the composite.
Ludovic Bellon - One of the best experts on this subject based on the ideXlab platform.
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Adhesion Energy of single wall carbon nanotube loops on various substrates
Journal of Applied Physics, 2015Co-Authors: Anthony Ayari, Ludovic BellonAbstract:The physics of Adhesion of one-dimensional nano structures such as nanotubes, nano wires, and biopolymers on different substrates is of great interest for the study of biological Adhesion and the development of nano electronics and nano mechanics. In this paper, we present force spectroscopy experiments of individual single wall carbon nanotube loops using a home-made interferometric atomic force microscope. Characteristic force plateaus during the peeling process allow the quantitative measurement of the Adhesion Energy per unit length on various substrates: graphite, mica, platinum, gold, and silicon. Moreover, using a time-frequency analysis of the deflection of the cantilever, we estimate the dynamic stiffness of the contact, providing more information on the nanotube configurations and its intrinsic mechanical properties.
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Adhesion Energy of single wall carbon nanotube loops on various substrates
arXiv: Materials Science, 2014Co-Authors: Anthony Ayari, Ludovic BellonAbstract:The physics of Adhesion of one-dimensional nano structures such as nanotubes, nano wires, and biopolymers on different material substrates is of great interest for the study of biological Adhesion and the development of nano electronics and nano mechanics. In this paper, we present force spectroscopy experiments of a single wall carbon nanotube loop using our home-made interferometric atomic force microscope. Characteristic force plateaux during the peeling process allows us to access to quantitative values of the Adhesion Energy per unit length on various substrates: graphite, mica, platinum, gold and silicon. By combining a time-frequency analysis of the deflexion of the cantilever, we access to the dynamic stiffness of the contact, providing more information on the nanotube configurations and its intrinsic mechanical properties.
M. Y. Hussaini - One of the best experts on this subject based on the ideXlab platform.
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Adhesion Energy of Single-Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
Journal of Computational and Theoretical Nanoscience, 2006Co-Authors: Marwan Al-haik, M. Y. HussainiAbstract:In this paper, we investigate the Adhesion Energy at the interface between single-wall carbon nanotubes (SWCNT) and polyethylene matrixwith and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, polyethylene, and composite.
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Adhesion Energy in carbon nanotube-polyethylene composite: Effect of chirality
Journal of Applied Physics, 2005Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid GarmestaniAbstract:This work presents a study of the Adhesion Energy between carbon nanotube-polyethylene matrix based on molecular dynamics simulations. Specifically, the study focuses on the influence of carbon nanotube chirality on Adhesion Energy. It is observed that composites that utilize nanotubes with smaller chiral angles achieve higher Adhesion Energy, and tend to have smaller diameter and longer cylindrical axes compared to those with larger chiral angles. A zigzag nanotube (zero-chiral angle) undergoes considerable deformation to achieve an equilibrium configuration that has relatively maximum Adhesion Energy. On the other hand, the armchair nanotube (30° chiral angle) deforms moderately to reach equilibrium with minimal Adhesion bonds to the polyethylene matrix.
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Adhesion Energy of Single Wall Carbon Nanotube-Polyethylene Composite: Effect of Magnetic Field
Materials, 2005Co-Authors: Marwan Al-haik, M. Y. Hussaini, Hamid GarmestaniAbstract:In this paper, we investigate the Adhesion Energy at the interface between single wall carbon nanotubes and polyethylene matrix with and without an external magnetic field. The carbon nanotubes are of two different chiralities—armchair (10, 10), and zigzag (10, 0), and the external high magnetic field is of 25 Tesla intensity. The study employs molecular dynamics simulations and concludes that the magnetic field decreases the interfacial Adhesion Energy although it increases the individual potential energies of the nanotubes, the polyethylene, and the composite.
Young-bae Park - One of the best experts on this subject based on the ideXlab platform.
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A study on the interfacial Adhesion Energy between capping layer and dielectric for cu interconnects
Microelectronics Reliability, 2021Co-Authors: Cheol Ho Kim, Kirak Son, Gahui Kim, Sung Tae Kim, Sol-kyu Lee, So-yeon Lee, Young-bae Park, Young-chang JooAbstract:Abstract Recently, Cu interconnect and low-k materials have been applied to reduce the interconnect resistive-capacitive delay issue. However, as the process node size is reduced to a few nanometers, high leakage currents appear through the dielectric under high electric fields. Therefore, issues of Cu diffusion at the interface between the dielectric and the capping layer have been reported. This study investigated interfacial Adhesion Energy change at the film level between dielectric (low-k, tetraethyl orthosilicate (TEOS)) and capping layer (SiCN, SiN) taking into account the correlation between interfacial Adhesion Energy and interconnect reliability. In the capping layer/low-k interface, when low-k is applied to the top layer, it shows high interfacial Adhesion Energy (> 34.31 ± 3.49 J/m2) due to the presence of an O-rich thin layer. But when low-k is applied to the bottom layer, due to the Si C bond, it shows low interfacial Adhesion Energy ( 32.54 ± 1.97 J/m2) regardless of the stacking order and CMP process. It clearly shows that low-k dielectrics will affect the deterioration of the interfacial Adhesion Energy and O-rich layer will greatly improve the interfacial Adhesion Energy in dielectric/capping layers.
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Effects of Post-annealing and Co Interlayer Between SiN_x and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections
Electronic Materials Letters, 2020Co-Authors: Hyeonchul Lee, Kirak Son, Gahui Kim, Minsu Jeong, Jeongmin Seo, Taek-soo Kim, Young-bae ParkAbstract:Effects of Co interlayer and 200 °C post-annealing treatment on interfacial Adhesion Energy of SiN_x/Cu structure were systematically investigated. Initial interfacial Adhesion Energy of SiN_x/Cu structure measured by double cantilever beam test was 0.92 J/m^2. The interfacial Adhesion Energy increased to 2.94 J/m^2 with Co interlayer between SiN_x and Cu films. After post-annealing treatment at 200 °C for 500 h, the interfacial Adhesion Energy of SiN_x/Co/Cu structure decreased to 0.95 J/m^2. X-ray photoelectron spectroscopy analysis revealed that the interfacial Adhesion Energy increased for SiN_x/Co/Cu thin films due to CoSi_2 reaction layer at SiN_x/Co interface, but sharply decreased during post-annealing treatment by SiO_2 formation at SiN_x/Co interface. Graphic abstract
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Effects of post-annealing and temperature/humidity treatments on the interfacial Adhesion Energy of the Cu/SiN x interface for Cu interconnects
Japanese Journal of Applied Physics, 2016Co-Authors: Minsu Jeong, Hyeonchul Lee, Byung-hyun Bae, Hee-oh Kang, Wook-jung Hwang, Jun-mo Yang, Young-bae ParkAbstract:The effects of 200 °C post-annealing and 85 °C and 85% relative humidity temperature and humidity (T/H) treatments on the interfacial Adhesion Energy of a Cu/SiN x interface were systematically investigated. The results of a four-point bending test, X-ray photoemission spectroscopy, and high-resolution transmission electron microscopy revealed that the interfacial Adhesion Energy during T/H treatment decreased with time faster than during annealing treatment, which is closely related to the faster Cu oxidation of SiN x /Cu interfaces.
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Effect of Post-Chemical?Mechanical Polishing Surface Treatments on the Interfacial Adhesion Energy between Cu and a Capping Layer
Japanese Journal of Applied Physics, 2013Co-Authors: Jeong-kyu Kim, Hee-oh Kang, Wook-jung Hwang, Jun-mo Yang, Young-bae ParkAbstract:The effect of post-chemical–mechanical polishing (CMP) surface treatments on the interfacial Adhesion energies between electroplated Cu thin film and SiNx capping layer was evaluated using a four-point bending test. The polished Cu surface was treated by one of three methods: no surface treatment, cleaning by plasma with a vacuum break, and cleaning by the wet chemical method. X-ray photoemission spectroscopy (XPS) analysis on the delaminated interfaces, cross-sectional high-resolution transmission electron microscopy (HR-TEM), and also the electron Energy loss spectroscopy (EELS) analysis were performed on the interfaces. The interfacial Adhesion Energy increases with post-CMP cleaning, which is strongly influenced by the effective removal of residual oxygen at the Cu surfaces.
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Interfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru–AlO Thin Film
Japanese Journal of Applied Physics, 2012Co-Authors: Jeong-kyu Kim, Taehoon Cheon, Soo-hyun Kim, Young-bae ParkAbstract:The effect of the composition of Ru–AlO thin films on the interfacial Adhesion Energy of an Ru–AlO thin film deposited by atomic layer deposition (ALD) between Cu and SiO2, which is a potential candidate for a Cu direct-plateable diffusion barrier, was evaluated using a four-point bending test. The interfacial Adhesion Energy increased with increasing AlOx content in the Ru–AlO thin films. The results were quantitatively correlated with the interfacial chemical bonding characteristics analyzed by X-ray photoemission spectroscopy, which showed that the Adhesion Energy is closely related to the formation of strong Al–O–Si bonds at film/substrate interfaces.
