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Ball Grid Arrays

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Kazuhiro Nogita – One of the best experts on this subject based on the ideXlab platform.

  • shear and tensile impact strength of lead free solder Ball Grid Arrays placed on ni p au surface finished substrates
    Materials Science and Engineering B-advanced Functional Solid-state Materials, 2010
    Co-Authors: Hideaki Tsukamoto, Tetsuro Nishimura, Shoichi Suenaga, Kazuhiro Nogita

    Abstract:

    This study aims to investigate the shear and tensile impact behavior of Ball Grid Arrays (BGAs) placed on Ni (P)/Au surface-finished substrates considering the microstructure and compositions of intermetallic compounds (IMCs) formed at the solder/substrate interfaces. Tests were conducted on as-reflowed and aged samples with four different compositions of solders such as Ni-doped and non-Ni-doped Sn-0.7 wt.%Cu, Sn-37 wt.%Pb and Sn-3.0 wt.%Ag-0.5 wt.%Cu, over a wide range of displacement rates from 10 to 4000 mm/s in shear and from 1 to 400 mm/s in tensile tests. In shear tests, there was almost no difference between as-reflowed and aged samples at low displacement rates in all the samples, while at high displacement rates the aged samples showed better properties than as-reflowed ones, in particular, in Ni-doped Sn-0.7wt%Cu samples. In tensile tests, the aging treatments had little effect on the strength for any compositions of solders at low and high displacement rates. Sn-3.0 wt.%Ag-0.5 wt.%Cu samples with any heat treatments showed the least resistance to both shear and tensile loadings at any displacement rates.

  • nanoindentation characterization of intermetallic compounds formed between sn cu ni Ball Grid Arrays and cu substrates
    Materials Science and Engineering B-advanced Functional Solid-state Materials, 2009
    Co-Authors: Hideaki Tsukamoto, Zhigang Dong, Ha Huang, Tetsuro Nishimura, Kazuhiro Nogita

    Abstract:

    The formation of intermetallic compounds (IMCs) at the solder-substrate interface is essential in the manufacturing of solder joints. In this study, the effect of Ni addition into Sn-Cu lead-free solders on mechanical properties of the IMCs formed at the interface between solder Ball Grid Arrays (BGAs) and Cu substrates, which experienced multiple reflows, were investigated. The results from nanoindentation tests showed that elastic modulus and hardness of (Cu,Ni)(6)Sn(5) were higher than those of Cu(6)Sn(5). The hardnesses of (Cu,Ni)(6)Sn(5) were more scattered compared to those of Cu(6)Sn(5). which may be attributed to the crystallographic characteristics such as growth texture of the IMCs. (C) 2009 Elsevier B.V. All rights reserved.

Hideaki Tsukamoto – One of the best experts on this subject based on the ideXlab platform.

  • shear and tensile impact strength of lead free solder Ball Grid Arrays placed on ni p au surface finished substrates
    Materials Science and Engineering B-advanced Functional Solid-state Materials, 2010
    Co-Authors: Hideaki Tsukamoto, Tetsuro Nishimura, Shoichi Suenaga, Kazuhiro Nogita

    Abstract:

    This study aims to investigate the shear and tensile impact behavior of Ball Grid Arrays (BGAs) placed on Ni (P)/Au surface-finished substrates considering the microstructure and compositions of intermetallic compounds (IMCs) formed at the solder/substrate interfaces. Tests were conducted on as-reflowed and aged samples with four different compositions of solders such as Ni-doped and non-Ni-doped Sn-0.7 wt.%Cu, Sn-37 wt.%Pb and Sn-3.0 wt.%Ag-0.5 wt.%Cu, over a wide range of displacement rates from 10 to 4000 mm/s in shear and from 1 to 400 mm/s in tensile tests. In shear tests, there was almost no difference between as-reflowed and aged samples at low displacement rates in all the samples, while at high displacement rates the aged samples showed better properties than as-reflowed ones, in particular, in Ni-doped Sn-0.7wt%Cu samples. In tensile tests, the aging treatments had little effect on the strength for any compositions of solders at low and high displacement rates. Sn-3.0 wt.%Ag-0.5 wt.%Cu samples with any heat treatments showed the least resistance to both shear and tensile loadings at any displacement rates.

  • nanoindentation characterization of intermetallic compounds formed between sn cu ni Ball Grid Arrays and cu substrates
    Materials Science and Engineering B-advanced Functional Solid-state Materials, 2009
    Co-Authors: Hideaki Tsukamoto, Zhigang Dong, Ha Huang, Tetsuro Nishimura, Kazuhiro Nogita

    Abstract:

    The formation of intermetallic compounds (IMCs) at the solder-substrate interface is essential in the manufacturing of solder joints. In this study, the effect of Ni addition into Sn-Cu lead-free solders on mechanical properties of the IMCs formed at the interface between solder Ball Grid Arrays (BGAs) and Cu substrates, which experienced multiple reflows, were investigated. The results from nanoindentation tests showed that elastic modulus and hardness of (Cu,Ni)(6)Sn(5) were higher than those of Cu(6)Sn(5). The hardnesses of (Cu,Ni)(6)Sn(5) were more scattered compared to those of Cu(6)Sn(5). which may be attributed to the crystallographic characteristics such as growth texture of the IMCs. (C) 2009 Elsevier B.V. All rights reserved.

Nogita K. – One of the best experts on this subject based on the ideXlab platform.

  • Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects
    'Institute of Electrical and Electronics Engineers (IEEE)', 2017
    Co-Authors: Nogita K., Mcdonald S. D., Salleh M. A. A. Mohd, Smith S., Wu Y. Q., Ab Razak A. G., Akaiwa T., Nishimura T.

    Abstract:

    Additions of 1.5wt%Bi to Sn-0.7Cu-0.05Ni (SN100C) were investigated for their influence on mechanical properties and the IMC layer formed between the solder and Cu substrates. Solder Balls of Sn-0.7Cu (Sn07Cu), SN100C, Sn-0.7Cu-0.05Ni-1.5Bi (SN100CV) and Sn-3Ag-0.5Cu (SAC) were reflowed onto Cu Ball Grid Arrays (BGAs). They were examined in the as reflowed condition and after a heat treatment of annealing at 150°C up to 1,500 hours. The mechanical properties of SN100C, SN100CV and SAC solder Balls were investigated by nano-indentation, and cross-sections of the interfacial IMC layer were observed by SEM to determine the morphology and average interfacial IMC layer thickness. It was found that the effect of Bi additions was to increase the lattice parameters and alter the mechanical properties. The near-eutectic microstructure and suppression of Cu Sn at the IMC layer that are associated with Ni additions are not altered by the presence of 1.5wt%Bi

  • The influence of solder composition on the impact strength of lead-free solder Ball Grid array joints
    'Elsevier BV', 2011
    Co-Authors: Tsukamoto H., Nishimura T., Suenaga S., Mcdonald S. D., Sweatma K. W., Nogita K.

    Abstract:

    This study aims to investigate the shear and tensile impact strength of solder Ball attachments. Tests were conducted on Ni-doped and non-Ni-doped Sn–0.7wt.% Cu, Sn–37wt.% Pb and Sn–3.0wt.% Ag–0.7wt.% Cu solder Ball Grid Arrays (BGAs) placed on Cu substrates, which were as-reflowed and aged, over a wide range of displacement rates from 10 to 4000 mm/s in shear and from 1 to 400 mm/s in tensile tests. Ni additions to the Sn–0.7wt.% Cu solders has slowed the growth of the interface intermetallic compounds (IMCs) and made the IMC layer morphology smooth. As-reflowed Ni-doped Sn–0.7wt.% Cu BGA joints show superior properties at high speed shear and tensile impacts compared to the non-Ni-doped Sn–0.7wt.% Cu and Sn–3.0wt.% Ag–0.7wt.% Cu BGAs. Sn–3.0wt.% Ag–0.7wt.% Cu BGAs exhibit the least resistance in both shear and tensile tests among the four compositions of solders, which may result from the cracks in the IMC layers introduced during the reflow processes

  • Shear and tensile impact strength of lead-free solder Ball Grid Arrays placed on Ni (P)/Au surface-finished substrates
    'Elsevier BV', 2010
    Co-Authors: Tsukamoto H., Nishimura T., Suenaga S., Nogita K.

    Abstract:

    This study aims to investigate the shear and tensile impact behavior of Ball Grid Arrays (BGAs) placed on Ni (P)/Au surface-finished substrates considering the microstructure and compositions of intermetallic compounds (IMCs) formed at the solder/substrate interfaces. Tests were conducted on as-reflowed and aged samples with four different compositions of solders such as Ni-doped and non-Ni-doped Sn-0.7 wt.%Cu, Sn-37 wt.%Pb and Sn-3.0 wt.%Ag-0.5 wt.%Cu, over a wide range of displacement rates from 10 to 4000 mm/s in shear and from 1 to 400 mm/s in tensile tests. In shear tests, there was almost no difference between as-reflowed and aged samples at low displacement rates in all the samples, while at high displacement rates the aged samples showed better properties than as-reflowed ones, in particular, in Ni-doped Sn-0.7wt%Cu samples. In tensile tests, the aging treatments had little effect on the strength for any compositions of solders at low and high displacement rates. Sn-3.0 wt.%Ag-0.5 wt.%Cu samples with any heat treatments showed the least resistance to both shear and tensile loadings at any displacement rates