The Experts below are selected from a list of 25362 Experts worldwide ranked by ideXlab platform
M. A. Hein - One of the best experts on this subject based on the ideXlab platform.
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Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
2019 IEEE MTT-S International Microwave Symposium (IMS), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The ongoing technical need for miniaturisation and the increasing number of wireless standards and frequency bands implemented in modern radio-frequency (RF) transceiver systems drive the need for highly integrated circuit technologies with high performance. Especially low-phase noise oscillators, which are required at nearly all frequencies in multi-band RF modules, often consist of components using different technologies, e.g., micro-electromechanical systems (MEMS) resonators and microelectronic circuits, usually with one resonator per output frequency. This paper presents the compact implementation of a multi-frequency MEMS oscillator on a silicon-Ceramic Composite substrate, tailored to the construction of multi-physical RF modules. MEMS devices and microelectronic circuits are fabricated and assembled on opposite sides of the same substrate, in order to nearly halve the substrate area used. The benefits of integrated circuits for switching, frequency doubling, and dividing increase the scope of functions by keeping the module size nearly constant. This results in a highly integrated oscillator module with optimised phase-noise performance.
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Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
2019 Joint Conference of the IEEE International Frequency Control Symposium and European Frequency and Time Forum (EFTF IFC), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The valuable performance figures of micro-electromechanical systems (MEMS) offer many improvements in the field of radio-frequency (RF) circuits for mobile communications compared to conventional microelectronic approaches. Especially, MEMS oscillators exhibit low phase noise together with a small form factor that are necessary for highly-integrated RF transceiver systems. However, the top-down design of the MEMS resonators in oscillator circuits is not yet as well established as of microelectronic circuits. Furthermore, special attention has to be paid to the layout of RF-MEMS circuits in the design phase to achieve a compact device with good RF performance. This paper presents a novel method for the cross-hierarchical design of multi-physical oscillators on a unique silicon-Ceramic Composite substrate, beginning on top-level and ending with the compact oscillator implementation. An optimisation method is included, which results in a low phase noise of -84 dBc/Hz at a 1 kHz offset from the frequency of oscillation at 578 MHz.
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Design and implementation of a MEMS-based RF oscillator on a unique silicon-Ceramic Composite substrate
2018 11th German Microwave Conference (GeMiC), 2018Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:In times, where the number of communication standards in mobile devices is growing, parameters like functional density, integrability, and power consumption become more and more important. Especially high frequencies and low channel bandwidths are the challenges that increase the need for new technology approaches and integration techniques. Micro-electromechanical systems (MEMS)-based designs can overcome traditional design trade-offs by high resonant frequencies and simultaneously high quality factors and small geometrical dimensions. This paper reports the design, implementation, and packaging of a compact MEMS-oscillator module on a silicon-Ceramic Composite substrate. First measurements show a good phase-noise performance, i.e. -80 dBc/Hz at an offset of 1 kHz. This underlines the capabilities of MEMS oscillators on this unique substrate: a small module size and low phase noise by reducing the substrate influence present in conventional oscillator designs.
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Hybrid-integrated RF MEMS-based reference oscillator using a silicon-Ceramic Composite substrate
2016 German Microwave Conference (GeMiC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:In this paper, the design of a RF MEMS oscillator on a silicon-Ceramic Composite substrate using a high-Q Lamb-wave resonator as frequency-selective device is described. The MEMS resonator is designed on a 1.8 μm thick piezoelectric AlN layer, deposited on silicon using thin-film processes. The finite-element simulation results of the resonator structure are presented, and the derivation of the electrical equivalent-circuit is described. The active part of the MEMS oscillator, which was laid out in a Pierce topology, has been integrated in an application-specific integrated circuit fabricated in CMOS technology. Both, amplifying and frequency-selective parts are hybrid-integrated on a unique silicon-Ceramic Composite substrate, which enables a very compact high-quality module design with minimal parasitics. The MEMS oscillator serves as a technology demonstrator combining the advantages of microelectronic and microelectromechanical components towards a compact and power-efficient hybrid technology, e.g. for mobile communications or wireless sensors.
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Compact low phase-noise MEMS-based RF oscillator on a dedicated silicon-Ceramic Composite substrate
2016 46th European Microwave Conference (EuMC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:Over the last few years, a unique silicon-Ceramic Composite substrate technology has been developed, where a silicon wafer can be directly bonded to a stack of low-temperature co-fired Ceramic layers. With this approach, a Composite substrate is constructed which combines the advantages of two versatile materials for the design of integrated RF modules: the superior electrical performance of low-temperature co-fired Ceramic technology for the realisation of three-dimensional passive RF and microwave circuitry, and the unique possibilities for the integration of microelectromechanical systems on the silicon wafer. Additionally, it is feasible to fabricate CMOS integrated circuits directly on the silicon wafer. Within this work, the powerful concept of the silicon-Ceramic Composite substrate is explained and illustrated in terms of a compact MEMS resonator-based RF oscillator module.
J. Müller - One of the best experts on this subject based on the ideXlab platform.
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Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
2019 IEEE MTT-S International Microwave Symposium (IMS), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The ongoing technical need for miniaturisation and the increasing number of wireless standards and frequency bands implemented in modern radio-frequency (RF) transceiver systems drive the need for highly integrated circuit technologies with high performance. Especially low-phase noise oscillators, which are required at nearly all frequencies in multi-band RF modules, often consist of components using different technologies, e.g., micro-electromechanical systems (MEMS) resonators and microelectronic circuits, usually with one resonator per output frequency. This paper presents the compact implementation of a multi-frequency MEMS oscillator on a silicon-Ceramic Composite substrate, tailored to the construction of multi-physical RF modules. MEMS devices and microelectronic circuits are fabricated and assembled on opposite sides of the same substrate, in order to nearly halve the substrate area used. The benefits of integrated circuits for switching, frequency doubling, and dividing increase the scope of functions by keeping the module size nearly constant. This results in a highly integrated oscillator module with optimised phase-noise performance.
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Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
2019 Joint Conference of the IEEE International Frequency Control Symposium and European Frequency and Time Forum (EFTF IFC), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The valuable performance figures of micro-electromechanical systems (MEMS) offer many improvements in the field of radio-frequency (RF) circuits for mobile communications compared to conventional microelectronic approaches. Especially, MEMS oscillators exhibit low phase noise together with a small form factor that are necessary for highly-integrated RF transceiver systems. However, the top-down design of the MEMS resonators in oscillator circuits is not yet as well established as of microelectronic circuits. Furthermore, special attention has to be paid to the layout of RF-MEMS circuits in the design phase to achieve a compact device with good RF performance. This paper presents a novel method for the cross-hierarchical design of multi-physical oscillators on a unique silicon-Ceramic Composite substrate, beginning on top-level and ending with the compact oscillator implementation. An optimisation method is included, which results in a low phase noise of -84 dBc/Hz at a 1 kHz offset from the frequency of oscillation at 578 MHz.
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Active Cooling Using Fluid Channels in a Silicon-Ceramic Composite Substrate
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019Co-Authors: M. Fischer, T. Werthes, C. Kleinholz, J. MüllerAbstract:The silicon-Ceramic Composite substrate (SiCer) allows the combination of MEMS and LTCC technologies in one wafer substrate. The expansion coefficient of the specially developed LTCC is adapted to that of the silicon over a wide temperature range, allowing cofiring of silicon and LTCC for achieving a strong bond interface. The combined very different substrate properties greatly increase the technological potential for the design of new sensor applications. In addition to the implementation of micromechanical components in the silicon layer with simultaneous wiring and electronic integration in the LTCC layer, it is also possible to realize fluid channels in both layers and connect them to each other. The bond connection between silicon and LTCC is considered hermetic above a certain bond frame width. In the first part of this paper, the technology for the generation of channels in the SiCer substrate is presented and a measurement method for determining the gas tightness or the leak rate of the bond connection is shown. In the second part, the technology for the setup of an active fluidic cooling system (water based) in a SiCer substrate is presented. The test module is fluidically and electrically connected in a special test bench. The silicon area in the middle of the module, exposed by DRIE (deep reactive ion etching), contains the cooling channels as well as a mounted thermal test die simulating a lossy component and to measure the temperature on the silicon die.
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Design and implementation of a MEMS-based RF oscillator on a unique silicon-Ceramic Composite substrate
2018 11th German Microwave Conference (GeMiC), 2018Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:In times, where the number of communication standards in mobile devices is growing, parameters like functional density, integrability, and power consumption become more and more important. Especially high frequencies and low channel bandwidths are the challenges that increase the need for new technology approaches and integration techniques. Micro-electromechanical systems (MEMS)-based designs can overcome traditional design trade-offs by high resonant frequencies and simultaneously high quality factors and small geometrical dimensions. This paper reports the design, implementation, and packaging of a compact MEMS-oscillator module on a silicon-Ceramic Composite substrate. First measurements show a good phase-noise performance, i.e. -80 dBc/Hz at an offset of 1 kHz. This underlines the capabilities of MEMS oscillators on this unique substrate: a small module size and low phase noise by reducing the substrate influence present in conventional oscillator designs.
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Hybrid-integrated RF MEMS-based reference oscillator using a silicon-Ceramic Composite substrate
2016 German Microwave Conference (GeMiC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:In this paper, the design of a RF MEMS oscillator on a silicon-Ceramic Composite substrate using a high-Q Lamb-wave resonator as frequency-selective device is described. The MEMS resonator is designed on a 1.8 μm thick piezoelectric AlN layer, deposited on silicon using thin-film processes. The finite-element simulation results of the resonator structure are presented, and the derivation of the electrical equivalent-circuit is described. The active part of the MEMS oscillator, which was laid out in a Pierce topology, has been integrated in an application-specific integrated circuit fabricated in CMOS technology. Both, amplifying and frequency-selective parts are hybrid-integrated on a unique silicon-Ceramic Composite substrate, which enables a very compact high-quality module design with minimal parasitics. The MEMS oscillator serves as a technology demonstrator combining the advantages of microelectronic and microelectromechanical components towards a compact and power-efficient hybrid technology, e.g. for mobile communications or wireless sensors.
M. Fischer - One of the best experts on this subject based on the ideXlab platform.
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Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
2019 IEEE MTT-S International Microwave Symposium (IMS), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The ongoing technical need for miniaturisation and the increasing number of wireless standards and frequency bands implemented in modern radio-frequency (RF) transceiver systems drive the need for highly integrated circuit technologies with high performance. Especially low-phase noise oscillators, which are required at nearly all frequencies in multi-band RF modules, often consist of components using different technologies, e.g., micro-electromechanical systems (MEMS) resonators and microelectronic circuits, usually with one resonator per output frequency. This paper presents the compact implementation of a multi-frequency MEMS oscillator on a silicon-Ceramic Composite substrate, tailored to the construction of multi-physical RF modules. MEMS devices and microelectronic circuits are fabricated and assembled on opposite sides of the same substrate, in order to nearly halve the substrate area used. The benefits of integrated circuits for switching, frequency doubling, and dividing increase the scope of functions by keeping the module size nearly constant. This results in a highly integrated oscillator module with optimised phase-noise performance.
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Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
2019 Joint Conference of the IEEE International Frequency Control Symposium and European Frequency and Time Forum (EFTF IFC), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The valuable performance figures of micro-electromechanical systems (MEMS) offer many improvements in the field of radio-frequency (RF) circuits for mobile communications compared to conventional microelectronic approaches. Especially, MEMS oscillators exhibit low phase noise together with a small form factor that are necessary for highly-integrated RF transceiver systems. However, the top-down design of the MEMS resonators in oscillator circuits is not yet as well established as of microelectronic circuits. Furthermore, special attention has to be paid to the layout of RF-MEMS circuits in the design phase to achieve a compact device with good RF performance. This paper presents a novel method for the cross-hierarchical design of multi-physical oscillators on a unique silicon-Ceramic Composite substrate, beginning on top-level and ending with the compact oscillator implementation. An optimisation method is included, which results in a low phase noise of -84 dBc/Hz at a 1 kHz offset from the frequency of oscillation at 578 MHz.
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Active Cooling Using Fluid Channels in a Silicon-Ceramic Composite Substrate
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019Co-Authors: M. Fischer, T. Werthes, C. Kleinholz, J. MüllerAbstract:The silicon-Ceramic Composite substrate (SiCer) allows the combination of MEMS and LTCC technologies in one wafer substrate. The expansion coefficient of the specially developed LTCC is adapted to that of the silicon over a wide temperature range, allowing cofiring of silicon and LTCC for achieving a strong bond interface. The combined very different substrate properties greatly increase the technological potential for the design of new sensor applications. In addition to the implementation of micromechanical components in the silicon layer with simultaneous wiring and electronic integration in the LTCC layer, it is also possible to realize fluid channels in both layers and connect them to each other. The bond connection between silicon and LTCC is considered hermetic above a certain bond frame width. In the first part of this paper, the technology for the generation of channels in the SiCer substrate is presented and a measurement method for determining the gas tightness or the leak rate of the bond connection is shown. In the second part, the technology for the setup of an active fluidic cooling system (water based) in a SiCer substrate is presented. The test module is fluidically and electrically connected in a special test bench. The silicon area in the middle of the module, exposed by DRIE (deep reactive ion etching), contains the cooling channels as well as a mounted thermal test die simulating a lossy component and to measure the temperature on the silicon die.
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Design and implementation of a MEMS-based RF oscillator on a unique silicon-Ceramic Composite substrate
2018 11th German Microwave Conference (GeMiC), 2018Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:In times, where the number of communication standards in mobile devices is growing, parameters like functional density, integrability, and power consumption become more and more important. Especially high frequencies and low channel bandwidths are the challenges that increase the need for new technology approaches and integration techniques. Micro-electromechanical systems (MEMS)-based designs can overcome traditional design trade-offs by high resonant frequencies and simultaneously high quality factors and small geometrical dimensions. This paper reports the design, implementation, and packaging of a compact MEMS-oscillator module on a silicon-Ceramic Composite substrate. First measurements show a good phase-noise performance, i.e. -80 dBc/Hz at an offset of 1 kHz. This underlines the capabilities of MEMS oscillators on this unique substrate: a small module size and low phase noise by reducing the substrate influence present in conventional oscillator designs.
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Hybrid-integrated RF MEMS-based reference oscillator using a silicon-Ceramic Composite substrate
2016 German Microwave Conference (GeMiC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:In this paper, the design of a RF MEMS oscillator on a silicon-Ceramic Composite substrate using a high-Q Lamb-wave resonator as frequency-selective device is described. The MEMS resonator is designed on a 1.8 μm thick piezoelectric AlN layer, deposited on silicon using thin-film processes. The finite-element simulation results of the resonator structure are presented, and the derivation of the electrical equivalent-circuit is described. The active part of the MEMS oscillator, which was laid out in a Pierce topology, has been integrated in an application-specific integrated circuit fabricated in CMOS technology. Both, amplifying and frequency-selective parts are hybrid-integrated on a unique silicon-Ceramic Composite substrate, which enables a very compact high-quality module design with minimal parasitics. The MEMS oscillator serves as a technology demonstrator combining the advantages of microelectronic and microelectromechanical components towards a compact and power-efficient hybrid technology, e.g. for mobile communications or wireless sensors.
J. Stegner - One of the best experts on this subject based on the ideXlab platform.
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Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
2019 IEEE MTT-S International Microwave Symposium (IMS), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The ongoing technical need for miniaturisation and the increasing number of wireless standards and frequency bands implemented in modern radio-frequency (RF) transceiver systems drive the need for highly integrated circuit technologies with high performance. Especially low-phase noise oscillators, which are required at nearly all frequencies in multi-band RF modules, often consist of components using different technologies, e.g., micro-electromechanical systems (MEMS) resonators and microelectronic circuits, usually with one resonator per output frequency. This paper presents the compact implementation of a multi-frequency MEMS oscillator on a silicon-Ceramic Composite substrate, tailored to the construction of multi-physical RF modules. MEMS devices and microelectronic circuits are fabricated and assembled on opposite sides of the same substrate, in order to nearly halve the substrate area used. The benefits of integrated circuits for switching, frequency doubling, and dividing increase the scope of functions by keeping the module size nearly constant. This results in a highly integrated oscillator module with optimised phase-noise performance.
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Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
2019 Joint Conference of the IEEE International Frequency Control Symposium and European Frequency and Time Forum (EFTF IFC), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The valuable performance figures of micro-electromechanical systems (MEMS) offer many improvements in the field of radio-frequency (RF) circuits for mobile communications compared to conventional microelectronic approaches. Especially, MEMS oscillators exhibit low phase noise together with a small form factor that are necessary for highly-integrated RF transceiver systems. However, the top-down design of the MEMS resonators in oscillator circuits is not yet as well established as of microelectronic circuits. Furthermore, special attention has to be paid to the layout of RF-MEMS circuits in the design phase to achieve a compact device with good RF performance. This paper presents a novel method for the cross-hierarchical design of multi-physical oscillators on a unique silicon-Ceramic Composite substrate, beginning on top-level and ending with the compact oscillator implementation. An optimisation method is included, which results in a low phase noise of -84 dBc/Hz at a 1 kHz offset from the frequency of oscillation at 578 MHz.
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Design and implementation of a MEMS-based RF oscillator on a unique silicon-Ceramic Composite substrate
2018 11th German Microwave Conference (GeMiC), 2018Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:In times, where the number of communication standards in mobile devices is growing, parameters like functional density, integrability, and power consumption become more and more important. Especially high frequencies and low channel bandwidths are the challenges that increase the need for new technology approaches and integration techniques. Micro-electromechanical systems (MEMS)-based designs can overcome traditional design trade-offs by high resonant frequencies and simultaneously high quality factors and small geometrical dimensions. This paper reports the design, implementation, and packaging of a compact MEMS-oscillator module on a silicon-Ceramic Composite substrate. First measurements show a good phase-noise performance, i.e. -80 dBc/Hz at an offset of 1 kHz. This underlines the capabilities of MEMS oscillators on this unique substrate: a small module size and low phase noise by reducing the substrate influence present in conventional oscillator designs.
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Hybrid-integrated RF MEMS-based reference oscillator using a silicon-Ceramic Composite substrate
2016 German Microwave Conference (GeMiC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:In this paper, the design of a RF MEMS oscillator on a silicon-Ceramic Composite substrate using a high-Q Lamb-wave resonator as frequency-selective device is described. The MEMS resonator is designed on a 1.8 μm thick piezoelectric AlN layer, deposited on silicon using thin-film processes. The finite-element simulation results of the resonator structure are presented, and the derivation of the electrical equivalent-circuit is described. The active part of the MEMS oscillator, which was laid out in a Pierce topology, has been integrated in an application-specific integrated circuit fabricated in CMOS technology. Both, amplifying and frequency-selective parts are hybrid-integrated on a unique silicon-Ceramic Composite substrate, which enables a very compact high-quality module design with minimal parasitics. The MEMS oscillator serves as a technology demonstrator combining the advantages of microelectronic and microelectromechanical components towards a compact and power-efficient hybrid technology, e.g. for mobile communications or wireless sensors.
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Compact low phase-noise MEMS-based RF oscillator on a dedicated silicon-Ceramic Composite substrate
2016 46th European Microwave Conference (EuMC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:Over the last few years, a unique silicon-Ceramic Composite substrate technology has been developed, where a silicon wafer can be directly bonded to a stack of low-temperature co-fired Ceramic layers. With this approach, a Composite substrate is constructed which combines the advantages of two versatile materials for the design of integrated RF modules: the superior electrical performance of low-temperature co-fired Ceramic technology for the realisation of three-dimensional passive RF and microwave circuitry, and the unique possibilities for the integration of microelectromechanical systems on the silicon wafer. Additionally, it is feasible to fabricate CMOS integrated circuits directly on the silicon wafer. Within this work, the powerful concept of the silicon-Ceramic Composite substrate is explained and illustrated in terms of a compact MEMS resonator-based RF oscillator module.
STEFAN GROPP - One of the best experts on this subject based on the ideXlab platform.
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Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
2019 IEEE MTT-S International Microwave Symposium (IMS), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The ongoing technical need for miniaturisation and the increasing number of wireless standards and frequency bands implemented in modern radio-frequency (RF) transceiver systems drive the need for highly integrated circuit technologies with high performance. Especially low-phase noise oscillators, which are required at nearly all frequencies in multi-band RF modules, often consist of components using different technologies, e.g., micro-electromechanical systems (MEMS) resonators and microelectronic circuits, usually with one resonator per output frequency. This paper presents the compact implementation of a multi-frequency MEMS oscillator on a silicon-Ceramic Composite substrate, tailored to the construction of multi-physical RF modules. MEMS devices and microelectronic circuits are fabricated and assembled on opposite sides of the same substrate, in order to nearly halve the substrate area used. The benefits of integrated circuits for switching, frequency doubling, and dividing increase the scope of functions by keeping the module size nearly constant. This results in a highly integrated oscillator module with optimised phase-noise performance.
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Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
2019 Joint Conference of the IEEE International Frequency Control Symposium and European Frequency and Time Forum (EFTF IFC), 2019Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:The valuable performance figures of micro-electromechanical systems (MEMS) offer many improvements in the field of radio-frequency (RF) circuits for mobile communications compared to conventional microelectronic approaches. Especially, MEMS oscillators exhibit low phase noise together with a small form factor that are necessary for highly-integrated RF transceiver systems. However, the top-down design of the MEMS resonators in oscillator circuits is not yet as well established as of microelectronic circuits. Furthermore, special attention has to be paid to the layout of RF-MEMS circuits in the design phase to achieve a compact device with good RF performance. This paper presents a novel method for the cross-hierarchical design of multi-physical oscillators on a unique silicon-Ceramic Composite substrate, beginning on top-level and ending with the compact oscillator implementation. An optimisation method is included, which results in a low phase noise of -84 dBc/Hz at a 1 kHz offset from the frequency of oscillation at 578 MHz.
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Design and implementation of a MEMS-based RF oscillator on a unique silicon-Ceramic Composite substrate
2018 11th German Microwave Conference (GeMiC), 2018Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, M. A. HeinAbstract:In times, where the number of communication standards in mobile devices is growing, parameters like functional density, integrability, and power consumption become more and more important. Especially high frequencies and low channel bandwidths are the challenges that increase the need for new technology approaches and integration techniques. Micro-electromechanical systems (MEMS)-based designs can overcome traditional design trade-offs by high resonant frequencies and simultaneously high quality factors and small geometrical dimensions. This paper reports the design, implementation, and packaging of a compact MEMS-oscillator module on a silicon-Ceramic Composite substrate. First measurements show a good phase-noise performance, i.e. -80 dBc/Hz at an offset of 1 kHz. This underlines the capabilities of MEMS oscillators on this unique substrate: a small module size and low phase noise by reducing the substrate influence present in conventional oscillator designs.
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Hybrid-integrated RF MEMS-based reference oscillator using a silicon-Ceramic Composite substrate
2016 German Microwave Conference (GeMiC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:In this paper, the design of a RF MEMS oscillator on a silicon-Ceramic Composite substrate using a high-Q Lamb-wave resonator as frequency-selective device is described. The MEMS resonator is designed on a 1.8 μm thick piezoelectric AlN layer, deposited on silicon using thin-film processes. The finite-element simulation results of the resonator structure are presented, and the derivation of the electrical equivalent-circuit is described. The active part of the MEMS oscillator, which was laid out in a Pierce topology, has been integrated in an application-specific integrated circuit fabricated in CMOS technology. Both, amplifying and frequency-selective parts are hybrid-integrated on a unique silicon-Ceramic Composite substrate, which enables a very compact high-quality module design with minimal parasitics. The MEMS oscillator serves as a technology demonstrator combining the advantages of microelectronic and microelectromechanical components towards a compact and power-efficient hybrid technology, e.g. for mobile communications or wireless sensors.
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Compact low phase-noise MEMS-based RF oscillator on a dedicated silicon-Ceramic Composite substrate
2016 46th European Microwave Conference (EuMC), 2016Co-Authors: J. Stegner, Max Hoffmann, M. Fischer, STEFAN GROPP, Uwe Stehr, J. Müller, D. Podoskin, M. A. HeinAbstract:Over the last few years, a unique silicon-Ceramic Composite substrate technology has been developed, where a silicon wafer can be directly bonded to a stack of low-temperature co-fired Ceramic layers. With this approach, a Composite substrate is constructed which combines the advantages of two versatile materials for the design of integrated RF modules: the superior electrical performance of low-temperature co-fired Ceramic technology for the realisation of three-dimensional passive RF and microwave circuitry, and the unique possibilities for the integration of microelectromechanical systems on the silicon wafer. Additionally, it is feasible to fabricate CMOS integrated circuits directly on the silicon wafer. Within this work, the powerful concept of the silicon-Ceramic Composite substrate is explained and illustrated in terms of a compact MEMS resonator-based RF oscillator module.