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Zhong Jue - One of the best experts on this subject based on the ideXlab platform.

  • Features of Thermosonic Flip Chip Bonding
    2006 7th International Conference on Electronic Packaging Technology, 2006
    Co-Authors: Li Junhui, Han Lei, Zhong Jue
    Abstract:

    Ultrasonic features in Bonding area are of interests for researchers in the field of microelectronics packaging. In this study, the interface characteristics of Bonding were detected by using XD7100 X-ray, the velocity of ultrasonic vibration at Bonding tool was determined with a PSV-400-M2 High Frequency (1.5 MHz) Laser Doppler Vibrometer, micro-characteristics of the specimens of thermosonic flip Chip Bonding were inspected by using a high resolution transmission electron microscope. Results show that bubbles at the interfaces of reflow soldering flip Chip were observed, however they were not discovered during thermosonic flip Chip, the interface characteristics of thermosonic flip Chip is better than that of reflow soldering flip Chip. The acceleration of the ultrasonic vibration was about 500000 m/s2 for a 62.73 kHz Bonding frequency. This strong mechanical effect activates dislocations in the metal crystalline lattice and enhances atomic diffusion across the Bonding interfaces, and these differ from melting mechanism of reflow soldering.

  • Synchronization Trigger System Design of the Thermosonic Flip-Chip Bonding
    2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005
    Co-Authors: Li Jianping, Wang Fu-liang, Han Lei, Huo Jun-ya, Zhong Jue
    Abstract:

    The stability and the delay time of the scan working model trigger system and the interrupt working model trigger system were compared and studied by the experiment of synchronization trigger of the thermosonic flip-Chip Bonding. It is found that the interrupt working model trigger system's stability was better than the scan working model trigger system's. It's biggest delay time, average delay time and the standard deviation of the delay time were all shorter than the scan working model trigger system's, especially the standard deviation just as small as 0.5mus. The result indicates that the delay time of the interrupt working model trigger system is 9mus less than a time cycle of the thermosonic and it's every time's delay time is invariableness. The interrupt working model trigger system is superior to the scan working model trigger system. It is also confirmed that the interrupt working model trigger system can used as a precise synchronization trigger system by triggering the thermosonic flip-Chip Bonding's data acquisition system, the press measure system and the polytec vibration measure system

  • Synchronization trigger system design of thermosonic flip-Chip Bonding
    2005
    Co-Authors: Zhong Jue
    Abstract:

    The stability and the delay time of the scan working model trigger system and the interrupt working model trigger system were compared and studied by the experiment of synchronization trigger of the thermosonic flip-Chip Bonding. It is found that the stability of the interrupt working model trigger system is better than that of the scan working model trigger system. The biggest value, average value and the standard deviation of the delay time are all smaller than those of the scan working model trigger system, especially the standard deviation is just as small as 0.5μs. The result indicates that the delay time of the interrupt working model trigger system is 9 μs, which is less than a cycle of the thermosonic and invariableness. The interrupt working model trigger system is superior to that of the scan working model trigger system. It is also confirmed that it can be used as a precise synchronization trigger system by triggering the thermosonic flip-Chip Bonding’s data acquisition system and polytec vibration measure system.

Chang-woo Lee - One of the best experts on this subject based on the ideXlab platform.

  • Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
    Journal of the Korean Welding and Joining Society, 2011
    Co-Authors: Young-kyu Lee, Sehoon Yoo, Chang-woo Lee
    Abstract:

    Abstract The effect of flip Chip Bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip Chip Bonding temperature was performed at 260℃ and 300℃ with various Bonding times of 5, 10, and 20 sec. AuSn, AuSn 2 and AuSn 4 IMCs were formed at the interface of joints and (Au, Cu) 6 Sn 5 IMC was observed near Cu pad side in the joint. At Bonding temperature of 260℃, AuSn 4 IMC was dominant in the joint compared to other Au-Sn IMCs as Bonding time increased. At Bonding temperature of 300℃, AuSn 2 IMC clusters, which were surrounded by AuSn 4 IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased Bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between AuSn 2 and AuSn 4 IMCs regardless Bonding conditions.Key Words : Au stud bump, Flip Chip Bonding, Interfacial reaction, Bonding strength

  • Joint properties of Au stud bumps joined with Sn-3.5Ag solder by flip Chip Bonding
    2011 IEEE 13th Electronics Packaging Technology Conference, 2011
    Co-Authors: Young-kyu Lee, Yong-ho Ko, Sehoon Yoo, Chang-woo Lee
    Abstract:

    Joint properties of Au stud bumps joined with Sn-3.5Ag solder by flip Chip Bonding were investigated. Au stud bumps were bonded on SOP (solder on pad) at Bonding temperature of 260°C and 300°C for 10sec, respectively. Aging treatment was carried out at 150°C for 100 and 300 hrs. After flip Chip Bonding, intermetallic compounds (IMCs) of AuSn, AuSn2, and AuSn4 were formed at interface between Au stud bump and Sn-3.5Ag solder. At Bonding temperature of 300°C, AuSn2 IMC clusters, which were surrounded by AuSn4 IMC, were observed in the Sn-3.5Ag solder bumps. Also, (Au, Cu)6Sn5 IMC was formed at Sn/Cu interface. After flip Chip Bonding, Bonding strength was approximately 22.5gf/bump. A typical fracture surface of as-bonded samples was intergranular fracture between AuSn2 and AuSn4 IMCs. Such phenomenon was similar for all specimens irrespective of Bonding temperature. As aging time increased, AuSn and AuSn2 IMCs continuously grew while AuSn4 IMC decreased. After 300 hrs aging, thickness of AuSn2 IMC was higher than that of other Au-Sn IMCs. The Bonding strength was decreased as aging time increased. After 100 hrs aging treatment, the Bonding strength of 300°C flip Chip Bonding sample was lower than that of 260°C sample due to fast growth rate of AuSn and AuSn2 IMCs. Initial joint microstructures after flip Chip Bonding were closely related to the Bonding strengths of aged samples.

Wang Fu-liang - One of the best experts on this subject based on the ideXlab platform.

  • Synchronization Trigger System Design of the Thermosonic Flip-Chip Bonding
    2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005
    Co-Authors: Li Jianping, Wang Fu-liang, Han Lei, Huo Jun-ya, Zhong Jue
    Abstract:

    The stability and the delay time of the scan working model trigger system and the interrupt working model trigger system were compared and studied by the experiment of synchronization trigger of the thermosonic flip-Chip Bonding. It is found that the interrupt working model trigger system's stability was better than the scan working model trigger system's. It's biggest delay time, average delay time and the standard deviation of the delay time were all shorter than the scan working model trigger system's, especially the standard deviation just as small as 0.5mus. The result indicates that the delay time of the interrupt working model trigger system is 9mus less than a time cycle of the thermosonic and it's every time's delay time is invariableness. The interrupt working model trigger system is superior to the scan working model trigger system. It is also confirmed that the interrupt working model trigger system can used as a precise synchronization trigger system by triggering the thermosonic flip-Chip Bonding's data acquisition system, the press measure system and the polytec vibration measure system

  • Present Development of Thermosonic Flip-Chip Bonding Process
    Electronics Process Technology, 2004
    Co-Authors: Wang Fu-liang
    Abstract:

    A new Chip Bonding process that is called thermosonic flip-Chip Bonding is described.Based on comparing with the other similar Chip Bonding processes,summarize the characteristic and advantage of thermosonic flip Chip Bonding,and depict the current technology development and theoretical study situation of this process in detail.At last point out this process is a potential new process in the electronic packaging.

Young-kyu Lee - One of the best experts on this subject based on the ideXlab platform.

  • Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
    Journal of the Korean Welding and Joining Society, 2011
    Co-Authors: Young-kyu Lee, Sehoon Yoo, Chang-woo Lee
    Abstract:

    Abstract The effect of flip Chip Bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip Chip Bonding temperature was performed at 260℃ and 300℃ with various Bonding times of 5, 10, and 20 sec. AuSn, AuSn 2 and AuSn 4 IMCs were formed at the interface of joints and (Au, Cu) 6 Sn 5 IMC was observed near Cu pad side in the joint. At Bonding temperature of 260℃, AuSn 4 IMC was dominant in the joint compared to other Au-Sn IMCs as Bonding time increased. At Bonding temperature of 300℃, AuSn 2 IMC clusters, which were surrounded by AuSn 4 IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased Bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between AuSn 2 and AuSn 4 IMCs regardless Bonding conditions.Key Words : Au stud bump, Flip Chip Bonding, Interfacial reaction, Bonding strength

  • Joint properties of Au stud bumps joined with Sn-3.5Ag solder by flip Chip Bonding
    2011 IEEE 13th Electronics Packaging Technology Conference, 2011
    Co-Authors: Young-kyu Lee, Yong-ho Ko, Sehoon Yoo, Chang-woo Lee
    Abstract:

    Joint properties of Au stud bumps joined with Sn-3.5Ag solder by flip Chip Bonding were investigated. Au stud bumps were bonded on SOP (solder on pad) at Bonding temperature of 260°C and 300°C for 10sec, respectively. Aging treatment was carried out at 150°C for 100 and 300 hrs. After flip Chip Bonding, intermetallic compounds (IMCs) of AuSn, AuSn2, and AuSn4 were formed at interface between Au stud bump and Sn-3.5Ag solder. At Bonding temperature of 300°C, AuSn2 IMC clusters, which were surrounded by AuSn4 IMC, were observed in the Sn-3.5Ag solder bumps. Also, (Au, Cu)6Sn5 IMC was formed at Sn/Cu interface. After flip Chip Bonding, Bonding strength was approximately 22.5gf/bump. A typical fracture surface of as-bonded samples was intergranular fracture between AuSn2 and AuSn4 IMCs. Such phenomenon was similar for all specimens irrespective of Bonding temperature. As aging time increased, AuSn and AuSn2 IMCs continuously grew while AuSn4 IMC decreased. After 300 hrs aging, thickness of AuSn2 IMC was higher than that of other Au-Sn IMCs. The Bonding strength was decreased as aging time increased. After 100 hrs aging treatment, the Bonding strength of 300°C flip Chip Bonding sample was lower than that of 260°C sample due to fast growth rate of AuSn and AuSn2 IMCs. Initial joint microstructures after flip Chip Bonding were closely related to the Bonding strengths of aged samples.

T. Ishida - One of the best experts on this subject based on the ideXlab platform.

  • Packaging properties of ALIVH-CSP using SBB flip-Chip Bonding technology
    IEEE Transactions on Advanced Packaging, 1999
    Co-Authors: M. Itagaki, K. Amami, Y. Tomura, S. Yuhaku, Y. Ishimaru, Y. Bessho, K. Eda, T. Ishida
    Abstract:

    A new Chip scale package (CSP) using an organic laminated substrate called /spl mu/CSP was developed, which was fabricated using ALIVH substrate as a interposer and stud-bump-Bonding (SBB) flip-Chip technology. The ALIVH substrate is a multilayered organic substrate with inner via holes in any layer. The newly developed CSP-L using ALIVH substrate realized a miniaturization of its package size to the same as a CSP using a ceramic substrate (CSP-C). In order to perform the SBB flip-Chip Bonding onto the ALIVH substrate, an excellent coplanarity of the substrate surface was required. The required coplanarity was obtained using a fixture during the SBB flip-Chip Bonding process. The first-level packaging reliability and the second-level packaging reliability onto ALIVH mother board were evaluated. The resulting reliabilities were good enough to apply to practical use.

  • Packaging properties of ALIVH-CSP using SBB flip-Chip Bonding technology
    Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154), 1998
    Co-Authors: M. Itagaki, K. Amami, Y. Tomura, S. Yuhaku, Y. Bessho, K. Eda, O. Noda, T. Ishida
    Abstract:

    A new Chip scale package (CSP) using an organic laminated substrate (CSP-L) was developed, which was fabricated using an ALIVH (any layer inner via hole) substrate as an interposer and stud-bump-Bonding (SBB) flip-Chip technology. The ALIVH substrate is a multilayered organic substrate with inner via holes in any layer. The newly developed CSP-L using the ALIVH substrate realized package size miniaturization on the same scale as a CSP using a ceramic substrate (CSP-C). The SBB flip-Chip Bonding on the ALIVH substrate required an excellent substrate surface coplanarity. The required coplanarity was obtained using a fixture during the SBB flip-Chip Bonding process. The first-level packaging reliability and the second-level packaging reliability on a glass-epoxy motherboard were evaluated. The resulting reliabilities were good enough for practical applications.