The Experts below are selected from a list of 17409 Experts worldwide ranked by ideXlab platform
Baolin Zhang - One of the best experts on this subject based on the ideXlab platform.
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electroless silver coating on fine Copper Powder and its effects on oxidation resistance
Materials Letters, 2003Co-Authors: Xinrui Xu, Hanrui Zhuang, Wenlan Li, Baolin ZhangAbstract:Electroless silver coating on fine Copper Powder (3.4 μm) and its effects on oxidation resistance were investigated by varying the silver contents. As-coated Copper Powders were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). It was found that the uniformity of silver coating was improved with silver content. When the silver content reached 20 wt.%, silver was homogeneously distributed around the Copper particles and few free silver particles were detected. As a result, the sheet resistances of metal films reduced with the silver content (presenting the improvement of oxidation resistance), and at the level of 20 wt.% silver content, it had a minimum value and hardly increased with the increasing oxidation time.
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electroless silver coating on fine Copper Powder and its effects on oxidation resistance
Materials Letters, 2003Co-Authors: Xiaojun Luo, Hanrui Zhuang, Baolin ZhangAbstract:Electroless silver coating on fine Copper Powder (3.4 μm) and its effects on oxidation resistance were investigated by varying the silver contents. As-coated Copper Powders were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). It was found that the uniformity of silver coating was improved with silver content. When the silver content reached 20 wt.%, silver was homogeneously distributed around the Copper particles and few free silver particles were detected. As a result, the sheet resistances of metal films reduced with the silver content (presenting the improvement of oxidation resistance), and at the level of 20 wt.% silver content, it had a minimum value and hardly increased with the increasing oxidation time.
K I Popov - One of the best experts on this subject based on the ideXlab platform.
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morphologies of electrochemically formed Copper Powder particles and their dependence on the quantity of evolved hydrogen
Powder Technology, 2008Co-Authors: Nebojsa D Nikolic, M G Pavlovic, Lj J Pavlovic, K I PopovAbstract:Abstract Copper Powder particles formed by electrolysis under different quantities of evolved hydrogen were analyzed using the scanning electron microscopy (SEM) technique. It was found that the structure of the Powder particles strongly depended on the quantity of evolved hydrogen — that is, two types of Powder particles were formed, depending on the quantity of evolved hydrogen. One type of particle was formed during the electrodeposition of Copper when the quantity of evolved hydrogen was insufficient to change the hydrodynamic conditions in the near-electrode layer. This particle type comprised dendrites constructed of corncob-like structures as the basic element. The other type of particle was cauliflower-like and was formed when the quantity of evolved hydrogen was sufficient to change the hydrodynamic conditions in the near-electrode layer. However, both types of particle consisted of agglomerates of Copper grains. The only difference lay in the size of the Copper grains of which the agglomerates were constituted. The size of the grains was a function of the electrodeposition overpotential and, consequently, the quantity of evolved hydrogen, with a tendency to attain a steady value when the electrodeposition overpotential was increased.
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The apparent density as a function of the specific surface of Copper Powder and the shape of the particle size distribution curve
Journal of The Serbian Chemical Society, 2003Co-Authors: K I Popov, Predrag M. Zivkovic, Snezana B. KrsticAbstract:The relation between the specific surface and apparent density of Copper Powders electrodeposited from acid Copper sulphate solutions is established. It is shown that the apparent density is inversly proportional to the specific surface of Copper Powder. The shape of the particle size distribution curve is also discussed.
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the effect of particle structure on apparent density of electrolytic Copper Powder
Journal of The Serbian Chemical Society, 2001Co-Authors: M G Pavlovic, Lj J Pavlovic, Evica R Ivanovic, V Radmilovic, K I PopovAbstract:The quantitative microstructural analysis and the sieve analysis of Copper Powder as well as the scanning electron microscopy analysis of the Copper Powders particles were performed. It was found that the structure of the Copper Powder particles determines the apparent density of Copper Powder. The Powder particles from the same fractions of different Powders occupy approximately the same volume, but the structure of metallic Copper is very different. This causes the difference in apparent densities of Copper Powder obtained under different conditions. The more dendritic is the structure of Powder particles the smaller is the apparent density of Copper Powder.
Hanrui Zhuang - One of the best experts on this subject based on the ideXlab platform.
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electroless silver coating on fine Copper Powder and its effects on oxidation resistance
Materials Letters, 2003Co-Authors: Xinrui Xu, Hanrui Zhuang, Wenlan Li, Baolin ZhangAbstract:Electroless silver coating on fine Copper Powder (3.4 μm) and its effects on oxidation resistance were investigated by varying the silver contents. As-coated Copper Powders were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). It was found that the uniformity of silver coating was improved with silver content. When the silver content reached 20 wt.%, silver was homogeneously distributed around the Copper particles and few free silver particles were detected. As a result, the sheet resistances of metal films reduced with the silver content (presenting the improvement of oxidation resistance), and at the level of 20 wt.% silver content, it had a minimum value and hardly increased with the increasing oxidation time.
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electroless silver coating on fine Copper Powder and its effects on oxidation resistance
Materials Letters, 2003Co-Authors: Xiaojun Luo, Hanrui Zhuang, Baolin ZhangAbstract:Electroless silver coating on fine Copper Powder (3.4 μm) and its effects on oxidation resistance were investigated by varying the silver contents. As-coated Copper Powders were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). It was found that the uniformity of silver coating was improved with silver content. When the silver content reached 20 wt.%, silver was homogeneously distributed around the Copper particles and few free silver particles were detected. As a result, the sheet resistances of metal films reduced with the silver content (presenting the improvement of oxidation resistance), and at the level of 20 wt.% silver content, it had a minimum value and hardly increased with the increasing oxidation time.
H Krump - One of the best experts on this subject based on the ideXlab platform.
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thermal mechanical and electrical properties of Copper Powder filled low density and linear low density polyethylene composites
Polymer Degradation and Stability, 2006Co-Authors: A S Luyt, J A Molefi, H KrumpAbstract:Abstract Low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE) with different Copper contents were prepared by melt mixing. The Copper Powder particle distributions were found to be relatively uniform at both low and high Copper contents. There was cluster formation of Copper particles at higher Cu contents, as well as the formation of percolation paths of Copper in the PE matrices. The DSC results show that Cu content has little influence on the melting temperatures of LDPE and LLDPE in these composites. From melting enthalpy results it seems as if Copper particles act as nucleating agents, giving rise to increased crystallinities of the polyethylene. The thermal stability of the LDPE filled with Cu Powder is better than that for the unfilled polymer. The LLDPE composites show better stability only at lower Cu contents. Generally, the composites show poorer mechanical properties (except Young's modulus) compared to the unfilled polymers. The thermal and electrical conductivities of the composites were higher than that of the pure polyethylene matrix for both the LDPE and LLDPE. From these results the percolation concentration was determined as 18.7 vol.% Copper for both polymers.
M Esfandeh - One of the best experts on this subject based on the ideXlab platform.
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Copper injection molding using a thermoplastic binder based on paraffin wax
Materials Letters, 2005Co-Authors: L Moballegh, Jalil Morshedian, M EsfandehAbstract:Abstract In this work the processing steps for producing Copper parts by means of metal injection molding technique were investigated. Different feedstocks were prepared from gas atomized Copper Powder and a thermoplastic binder based on paraffin wax. The optimum formulation of 95 / 5 wt/wt (Copper Powder / binder) was selected from rheological investigation and then the suitable feedstock was injected successfully at low pressure. The molded specimens were debinded by solvent debinding followed by thermal debinding methods and were sintered under argon atmosphere. It was observed that injection molding of a feedstock containing 66% by volume of Copper Powder was possible at low pressure and the sintered parts were free from defects and dimensional shrinkage was nearly the same in three dimensions.