The Experts below are selected from a list of 7899 Experts worldwide ranked by ideXlab platform
Masao Sakane - One of the best experts on this subject based on the ideXlab platform.
-
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering, 2020Co-Authors: Shengde Zhang, Shinsuke Ogawa, Masao SakaneAbstract:This paper describes the Creep-Fatigue life assessment of Sn-3.0Ag-0.5Cu solder under pull-push loading using fast-fast, fast-slow, slow-fast and strain-hold strain waveforms. Strain controlled Creep-Fatigue tests were carried out using solid bar specimen, and the effect of strain waveform on the Creep-Fatigue life was discussed. Creep-Fatigue damage was evaluated by the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, the strain range partitioning method and the grain boundary sliding model. The strain range partitioning method and the grain boundary sliding model only predicted the Creep-Fatigue lives within a small scatter.
-
Multiaxial study of notched component of Sn-3.5Ag solder in Creep-Fatigue
2013Co-Authors: Mineo Nozaki, Shengde Zhang, Masao Sakane, Kaoru KobayashiAbstract:This paper studies the Creep-Fatigue crack initiation and failure lives of Sn-3.5Ag solder notched specimens considering the multiaxial strain at the notch root. Push-pull Creep-Fatigue tests were performed using three circumferential notched specimens under four kinds of Creep-Fatigue strain waveforms. The multiaxial strain states were analyzed by finite element (FE) analysis at the notched section in Creep-Fatigue loading. Couples of Creep-Fatigue damage laws were applied to evaluate the crack initiation and failure lives based on the multiaxial strains obtained by the FE analysis. Von Mises equivalent strain at the notch root estimated the crack initiation lives with a large scatter as well as the failure lives. Instead, the mean value of von Mises equivalent strain over the cross section of the notch root estimated the crack initiation and failure lives with a small scatter. INTRODUCTION Solder connections in electronic devices undergo low cycle fatigue damage due to the mismatch of thermal expansion coefficient of connecting parts. Solders significantly creep at room temperature, so that solder connections are exposed to Creep-Fatigue damage during the operation of electronic devices. Solder connections usually have geometrical discontinuities like grooves and fillets that work as notches, and cracks usually initiate and propagate from these geometrical discontinuities. Ball grid alleys and flip-chip joints, for example, mostly have notches with small radius in solder balls near copper pads. Creep-Fatigue cracks initiate at the notches and propagate in the solder balls resulting in the open circuit of the joints. Strain state at the notched part is mostly multiaxial so that studies of notch effect taking account of multiaxial strains are essential for the quality assurance of solder connections used in electronic devices. The objective of this paper is to study the notch effect on Creep-Fatigue life of
-
5014 - CREEP AND Creep-Fatigue STANDARD TESTING FOR SOLDERS - JSMS RECOMMENDATION –
2013Co-Authors: Masao Sakane, Haruo Nose, Hiroyuki Takahashi, Makoto Kitano, Yutaka Tsukada, A.s. FrolovAbstract:This paper presents the creep and Creep-Fatigue standard testing methods for solders recommended by the subcommittee of the Japan Society of Materials Science. The collaborative experiments were carried out for Sn-37Pb and Sn-3.5Ag based on the standard methods. Stable creep and Creep-Fatigue data were obtained that demonstrated the standard methods generated the reliable creep and Creep-Fatigue data. Life prediction methods for creep and Creep-Fatigue were discussed based on the generated data.
-
Creep-Fatigue life assessment for three kinds of solders
Materials at High Temperatures, 2012Co-Authors: Shengde Zhang, Masao SakaneAbstract:This paper presents a Creep-Fatigue life evaluation for three kinds of solders of Sn–37Pb, Sn– 3.5Ag and Sn – 3.0Ag – 0.5Cu. Strain controlled push – pull Creep-Fatigue tests were performed for solid bar specimens under fast–fast, fast–slow, slow–fast and strain–hold strain waveforms and the effect of strain waveforms on Creep-Fatigue lives is discussed. Sn– 3.5Ag and Sn– 3.0Ag – 0.5Cu solders showed stronger Creep-Fatigue resistance compared to Sn –37Pb solder. The applicability of the linear damage rule, the strain range partitioning method and the grain boundary sliding model is discussed for predicting Creep-Fatigue lives of the three solders. The strain range partitioning method and the grain boundary sliding model satisfactorily predicted Creep-Fatigue lives within a small scatter.
-
Notch effect on creep–fatigue life for Sn–3.5Ag solder
Engineering Fracture Mechanics, 2011Co-Authors: Mineo Nozaki, Shengde Zhang, Masao Sakane, Kaoru KobayashiAbstract:Abstract This paper studies the creep–fatigue crack initiation and failure lives of Sn–3.5Ag solder notched specimens focused on the multiaxial strain at the notch root. Push–pull creep–fatigue tests were performed using three circumferential notched specimens using four kinds of creep–fatigue strain waveforms. Multiaxial strains at the notched section were calculated by finite element (FE) analysis under four kinds of creep–fatigue loading. Creep–fatigue damage laws were applied for evaluating the crack initiation and failure lives using the multiaxial strains obtained by the FE analysis. von Mises equivalent strain at the notch root estimated the crack initiation lives with a large scatter as well as the failure lives. Instead, the mean value of von Mises equivalent strain over the cross section of the notch root estimated the crack initiation and failure lives with a small scatter.
Shengde Zhang - One of the best experts on this subject based on the ideXlab platform.
-
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering, 2020Co-Authors: Shengde Zhang, Shinsuke Ogawa, Masao SakaneAbstract:This paper describes the Creep-Fatigue life assessment of Sn-3.0Ag-0.5Cu solder under pull-push loading using fast-fast, fast-slow, slow-fast and strain-hold strain waveforms. Strain controlled Creep-Fatigue tests were carried out using solid bar specimen, and the effect of strain waveform on the Creep-Fatigue life was discussed. Creep-Fatigue damage was evaluated by the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, the strain range partitioning method and the grain boundary sliding model. The strain range partitioning method and the grain boundary sliding model only predicted the Creep-Fatigue lives within a small scatter.
-
Multiaxial study of notched component of Sn-3.5Ag solder in Creep-Fatigue
2013Co-Authors: Mineo Nozaki, Shengde Zhang, Masao Sakane, Kaoru KobayashiAbstract:This paper studies the Creep-Fatigue crack initiation and failure lives of Sn-3.5Ag solder notched specimens considering the multiaxial strain at the notch root. Push-pull Creep-Fatigue tests were performed using three circumferential notched specimens under four kinds of Creep-Fatigue strain waveforms. The multiaxial strain states were analyzed by finite element (FE) analysis at the notched section in Creep-Fatigue loading. Couples of Creep-Fatigue damage laws were applied to evaluate the crack initiation and failure lives based on the multiaxial strains obtained by the FE analysis. Von Mises equivalent strain at the notch root estimated the crack initiation lives with a large scatter as well as the failure lives. Instead, the mean value of von Mises equivalent strain over the cross section of the notch root estimated the crack initiation and failure lives with a small scatter. INTRODUCTION Solder connections in electronic devices undergo low cycle fatigue damage due to the mismatch of thermal expansion coefficient of connecting parts. Solders significantly creep at room temperature, so that solder connections are exposed to Creep-Fatigue damage during the operation of electronic devices. Solder connections usually have geometrical discontinuities like grooves and fillets that work as notches, and cracks usually initiate and propagate from these geometrical discontinuities. Ball grid alleys and flip-chip joints, for example, mostly have notches with small radius in solder balls near copper pads. Creep-Fatigue cracks initiate at the notches and propagate in the solder balls resulting in the open circuit of the joints. Strain state at the notched part is mostly multiaxial so that studies of notch effect taking account of multiaxial strains are essential for the quality assurance of solder connections used in electronic devices. The objective of this paper is to study the notch effect on Creep-Fatigue life of
-
Creep-Fatigue life assessment for three kinds of solders
Materials at High Temperatures, 2012Co-Authors: Shengde Zhang, Masao SakaneAbstract:This paper presents a Creep-Fatigue life evaluation for three kinds of solders of Sn–37Pb, Sn– 3.5Ag and Sn – 3.0Ag – 0.5Cu. Strain controlled push – pull Creep-Fatigue tests were performed for solid bar specimens under fast–fast, fast–slow, slow–fast and strain–hold strain waveforms and the effect of strain waveforms on Creep-Fatigue lives is discussed. Sn– 3.5Ag and Sn– 3.0Ag – 0.5Cu solders showed stronger Creep-Fatigue resistance compared to Sn –37Pb solder. The applicability of the linear damage rule, the strain range partitioning method and the grain boundary sliding model is discussed for predicting Creep-Fatigue lives of the three solders. The strain range partitioning method and the grain boundary sliding model satisfactorily predicted Creep-Fatigue lives within a small scatter.
-
Notch effect on creep–fatigue life for Sn–3.5Ag solder
Engineering Fracture Mechanics, 2011Co-Authors: Mineo Nozaki, Shengde Zhang, Masao Sakane, Kaoru KobayashiAbstract:Abstract This paper studies the creep–fatigue crack initiation and failure lives of Sn–3.5Ag solder notched specimens focused on the multiaxial strain at the notch root. Push–pull creep–fatigue tests were performed using three circumferential notched specimens using four kinds of creep–fatigue strain waveforms. Multiaxial strains at the notched section were calculated by finite element (FE) analysis under four kinds of creep–fatigue loading. Creep–fatigue damage laws were applied for evaluating the crack initiation and failure lives using the multiaxial strains obtained by the FE analysis. von Mises equivalent strain at the notch root estimated the crack initiation lives with a large scatter as well as the failure lives. Instead, the mean value of von Mises equivalent strain over the cross section of the notch root estimated the crack initiation and failure lives with a small scatter.
-
Multiaxial creep–fatigue life prediction for cruciform specimen
International Journal of Fatigue, 2007Co-Authors: Shengde Zhang, Masao SakaneAbstract:Abstract This paper describes the high temperature multiaxial creep–fatigue life prediction for type 304 stainless steel. Finite element analyses were performed for determining the stress–strain state in the gage part of a cruciform specimen subjected to creep–fatigue loading under four strain waves at three principal strain ratios. Creep–fatigue lives of cruciform specimens were discussed in relation to the principal stress amplitude calculated by finite element analysis. Creep–fatigue damage was evaluated by linear damage rule and the suitability of three low cycle fatigue and three creep damage parameters was discussed.
V N Shlyannikov - One of the best experts on this subject based on the ideXlab platform.
-
creep fatigue crack growth rate prediction based on fracture damage zone models
Engineering Fracture Mechanics, 2019Co-Authors: V N ShlyannikovAbstract:Abstract Based on a new fracture damage zone formulation and nonlinear elastic–plastic and creep crack tip fields, the prediction of creep–fatigue crack growth rate is studied. A unified crack growth rate equation is derived using the equivalent nonlinear stress intensity factor, monotonic low-cycle fatigue, and creep material properties at an elevated temperature. The crack growth rate model includes the size of the fracture process zone and damage parameters. The predicted creep–fatigue crack growth rates are compared with the experimental data of the 12Cr1MoV power plant steel and good agreement is observed.
-
Creep–fatigue crack growth rate prediction based on fracture damage zone models
Engineering Fracture Mechanics, 2019Co-Authors: V N ShlyannikovAbstract:Abstract Based on a new fracture damage zone formulation and nonlinear elastic–plastic and creep crack tip fields, the prediction of creep–fatigue crack growth rate is studied. A unified crack growth rate equation is derived using the equivalent nonlinear stress intensity factor, monotonic low-cycle fatigue, and creep material properties at an elevated temperature. The crack growth rate model includes the size of the fracture process zone and damage parameters. The predicted creep–fatigue crack growth rates are compared with the experimental data of the 12Cr1MoV power plant steel and good agreement is observed.
Lei Zhao - One of the best experts on this subject based on the ideXlab platform.
-
A novel creep–fatigue interaction damage model with the stress effect to simulate the creep–fatigue crack growth behavior
International Journal of Mechanical Sciences, 2017Co-Authors: Lianyong Xu, Lei ZhaoAbstract:Abstract In this paper, a novel creep–fatigue interaction damage model was proposed to evaluate damage evolution and crack growth behavior in creep–fatigue regime. The model incorporated the maximum stress effect into the low cycle fatigue damage accumulation and utilized the non-linear summation approach to consider the creep–fatigue interacted effect. The model could predict the relation between (da/dt) avg against ( C t ) avg in creep–fatigue interacted environment and demonstrate the crack growth behavior under pure fatigue condition, which respectively matched well the corresponding experimental results. In addition, the crack growth rate was greatly dependent on the dwell time in creep–fatigue regime. The crack growth rate (d a /d t ) avg was increased with decreasing the hold time at the same ( C t ) avg values. During crack growth process, the creep damage accounted for a larger portion compared with the fatigue damage. Furthermore, in creep–fatigue regime, the effect of the initial crack depth on crack growth behavior was dependent on the hold time while the applied initial stress factor range had slight effect on the crack growth behavior.
-
Finite element simulation of Creep-Fatigue crack growth behavior for P91 steel at 625 °C considering Creep-Fatigue interaction
International Journal of Fatigue, 2017Co-Authors: Hongyang Jing, Lianyong Xu, Dingbang Su, Lei ZhaoAbstract:Abstract A Creep-Fatigue crack growth model considering Creep-Fatigue interactions based on continuum damage mechanics was proposed in this paper. Numerical analyses of Creep-Fatigue crack growth of P91 steel at 625 °C using compact specimens were conducted. The results agreed well with the experiment which indicated its good capability in predicting Creep-Fatigue crack growth behavior. The effects of initial crack depth, specimen dimension and hold time on crack growth behavior were investigated using the model. The results indicated that the increasing initial crack depth and specimen dimension promoted the crack growth rate, while the decreasing hold time accelerated the crack growth.
Robert A. Ainsworth - One of the best experts on this subject based on the ideXlab platform.
-
Design and Assessment for Creep-Fatigue and Creep-Fatigue Crack Growth
Volume 1B: Codes and Standards, 2016Co-Authors: Robert A. AinsworthAbstract:Creep-Fatigue assessments require inputs for both creep damage and fatigue damage. Then these damage terms are combined using some form of interaction diagram to enable estimation of the Creep-Fatigue life. Similarly, Creep-Fatigue crack growth assessments need separate calculations of creep crack growth, fatigue crack growth and again possibly some allowance for interaction in order to obtain the total crack growth. A consequence of these approaches is that uncertainties in creep calculations, uncertainties in fatigue calculations and uncertainties in the form of interaction all lead to significant uncertainties in the overall lifetime or crack growth assessment.This paper first briefly describes how Creep-Fatigue and Creep-Fatigue crack growth assessments are performed using the UK R5 procedure and contrasts the methods with those in other codes. Then, the paper presents the guidance in R5 on addressing the many uncertainties in these assessments and discusses the use of probabilistic methods in order to avoid over-conservative lifetime and crack growth estimates.Copyright © 2016 by ASME
-
Assessment of Creep and Creep-Fatigue Crack Growth Following the R5 Procedures
Flaw Evaluation Service Experience and Reliability, 2003Co-Authors: Robert A. Ainsworth, Peter J. Budden, D. W. Dean, M. P. O’donnell, J. M. H. Dean, I. W. Goodall, D. G. HootonAbstract:Parts of the R5 high temperature assessment procedures address creep and Creep-Fatigue crack growth. The procedures were developed some years ago as separate approaches for creep crack growth (R5 Volume 4) and Creep-Fatigue crack growth (R5 Volume 5). A major revision to these procedures has recently been completed. This unifies the separate approaches into a single procedure for Creep-Fatigue crack growth (R5 Volume 4/5). The revision restructures the procedure for easier application and includes a number of technical developments, including criteria for deciding when Creep-Fatigue interactions are important. This paper describes in outline the new R5 Creep-Fatigue crack growth procedure.Copyright © 2003 by ASME