The Experts below are selected from a list of 115077 Experts worldwide ranked by ideXlab platform
Dezhi Li - One of the best experts on this subject based on the ideXlab platform.
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corrosion characterization of tin lead and lead free Solders in 3 5 wt nacl solution
Corrosion Science, 2008Co-Authors: Dezhi Li, Paul ConwayAbstract:Abstract The corrosion resistance of Sn–Pb and several candidate lead free Solders were investigated in 3.5 wt.% NaCl solution through potentiodynamic polarisation. Results showed that in NaCl solution lead free Solders had better corrosion resistance than Sn–Pb solder and the corrosion resistance of lead free Solders was similar, but the corrosion resistance of Sn–Ag solder was better than that of Sn–Ag–Cu and Sn–Cu Solders. The corrosion products for Sn–Pb solder had a two-layered structure with Sn-rich phases at the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was detrimental to the corrosion property. The corrosion product on the surface of all these Solders was tin oxide chloride hydroxide.
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Corrosion characterization of tin-lead and lead free Solders in 3.5 wt.% NaCl solution
Corrosion Science, 2008Co-Authors: Dezhi Li, Paul P. Conway, Changqing LiuAbstract:The corrosion resistance of Sn-Pb and several candidate lead free Solders were investigated in 3.5 wt.% NaCl solution through potentiodynamic polarisation. Results showed that in NaCl solution lead free Solders had better corrosion resistance than Sn-Pb solder and the corrosion resistance of lead free Solders was similar, but the corrosion resistance of Sn-Ag solder was better than that of Sn-Ag-Cu and Sn-Cu Solders. The corrosion products for Sn-Pb solder had a two-layered structure with Sn-rich phases at the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was detrimental to the corrosion property. The corrosion product on the surface of all these Solders was tin oxide chloride hydroxide. © 2007 Elsevier Ltd. All rights reserved.
Y C Chan - One of the best experts on this subject based on the ideXlab platform.
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growth mechanism of intermetallic compounds and damping properties of sn ag cu 1 wt nano zro2 composite Solders
Microelectronics Reliability, 2014Co-Authors: Asit Kumar Gain, Y C ChanAbstract:Abstract Nano-sized, nonreacting, noncoarsening ZrO 2 ceramic particles reinforced Sn–Ag–Cu composite Solders were prepared by mechanically dispersing nano-particles into Sn–Ag–Cu solder and investigated their microstructure, kinetic analysis and mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics. From microstructures evaluation, it was clear that composite Solders containing ZrO 2 ceramic nano-particles significantly impact on the formation of intermetallic compounds (IMCs) at their interfaces as well as refined microstructure in the solder ball regions. The growth behavior of IMCs layer at the interfaces in composite Solders was lower than that of plain Sn–Ag–Cu Solders. Moreover, after long time aging, some microcracks were clearly observed at the interface due to the formation of excessive IMC layer and softening nature of plain Sn–Ag–Cu solder joints. Mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics were successfully investigated. The experimental results showed that composite solder joints exhibited higher hardness and shear strength as compared to the plain Sn–Ag–Cu solder joints. In addition, composite solder containing ZrO 2 nano-particles exhibited lower damping capacity as compared with plain Sn–Ag–Cu solder due to fine microstructure and uniformly distributed ZrO 2 nano-particles which increase the dislocation density.
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Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite Solders
Microelectronics Reliability, 2014Co-Authors: Asit Kumar Gain, Y C ChanAbstract:Abstract Nano-sized, nonreacting, noncoarsening ZrO 2 ceramic particles reinforced Sn–Ag–Cu composite Solders were prepared by mechanically dispersing nano-particles into Sn–Ag–Cu solder and investigated their microstructure, kinetic analysis and mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics. From microstructures evaluation, it was clear that composite Solders containing ZrO 2 ceramic nano-particles significantly impact on the formation of intermetallic compounds (IMCs) at their interfaces as well as refined microstructure in the solder ball regions. The growth behavior of IMCs layer at the interfaces in composite Solders was lower than that of plain Sn–Ag–Cu Solders. Moreover, after long time aging, some microcracks were clearly observed at the interface due to the formation of excessive IMC layer and softening nature of plain Sn–Ag–Cu solder joints. Mechanical properties i.e., shear strength, hardness and high temperature/mechanical damping characteristics were successfully investigated. The experimental results showed that composite solder joints exhibited higher hardness and shear strength as compared to the plain Sn–Ag–Cu solder joints. In addition, composite solder containing ZrO 2 nano-particles exhibited lower damping capacity as compared with plain Sn–Ag–Cu solder due to fine microstructure and uniformly distributed ZrO 2 nano-particles which increase the dislocation density.
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research advances in nano composite Solders
Microelectronics Reliability, 2009Co-Authors: J Shen, Y C ChanAbstract:Recently, nano-composite Solders have been developed in the electronic packaging materials industry to improve the creep and thermo-mechanical fatigue resistance of solder joints to be used in service at high temperatures and under thermo-mechanical fatigue conditions. This paper reviews the driving force for the development of nano-composite Solders in the electronic packaging industry and the research advances of the composite Solders developed. The rationale for the preparation of nano-composite Solders are presented at first. Examples of two nano-composite solder fabrication methods, a mechanical mixing method and an in-situ method, are explained in detail. The achievements and enhancements in the nano-composite prepared Solders are summarized. The difficulties and problems existing in the fabrication of nano-composite Solders are discussed. Finally, a novel nano-structure composite solder, which attempts to solve the problems encountered in the fabrication of nano-composite Solders, is introduced in detail. Guidelines for the development of nano-composite Solders are then provided.
Paul Conway - One of the best experts on this subject based on the ideXlab platform.
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corrosion characterization of tin lead and lead free Solders in 3 5 wt nacl solution
Corrosion Science, 2008Co-Authors: Dezhi Li, Paul ConwayAbstract:Abstract The corrosion resistance of Sn–Pb and several candidate lead free Solders were investigated in 3.5 wt.% NaCl solution through potentiodynamic polarisation. Results showed that in NaCl solution lead free Solders had better corrosion resistance than Sn–Pb solder and the corrosion resistance of lead free Solders was similar, but the corrosion resistance of Sn–Ag solder was better than that of Sn–Ag–Cu and Sn–Cu Solders. The corrosion products for Sn–Pb solder had a two-layered structure with Sn-rich phases at the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was detrimental to the corrosion property. The corrosion product on the surface of all these Solders was tin oxide chloride hydroxide.
Changqing Liu - One of the best experts on this subject based on the ideXlab platform.
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Corrosion characterization of tin-lead and lead free Solders in 3.5 wt.% NaCl solution
Corrosion Science, 2008Co-Authors: Dezhi Li, Paul P. Conway, Changqing LiuAbstract:The corrosion resistance of Sn-Pb and several candidate lead free Solders were investigated in 3.5 wt.% NaCl solution through potentiodynamic polarisation. Results showed that in NaCl solution lead free Solders had better corrosion resistance than Sn-Pb solder and the corrosion resistance of lead free Solders was similar, but the corrosion resistance of Sn-Ag solder was better than that of Sn-Ag-Cu and Sn-Cu Solders. The corrosion products for Sn-Pb solder had a two-layered structure with Sn-rich phases at the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was detrimental to the corrosion property. The corrosion product on the surface of all these Solders was tin oxide chloride hydroxide. © 2007 Elsevier Ltd. All rights reserved.
Michael Pecht - One of the best experts on this subject based on the ideXlab platform.
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a review of lead free Solders for electronics applications
Microelectronics Reliability, 2017Co-Authors: Shunfeng Cheng, Chien Ming Huang, Michael PechtAbstract:Abstract Ever since RoHS was implemented in 2006, Sn3.0Ag0.5Cu (SAC305) has been the primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs). However, due to the 3.0 wt% Silver (Ag) in SAC305, companies have been looking at less expensive solder alternatives, especially for use in inexpensive products that have short operating lives and are used in mild application conditions. This paper reviews new lead-free solder alternatives and the trends in the industry, including SnCu-based Solders, SnAgCu Solders with Ag content
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A review of lead-free Solders for electronics applications
Microelectronics Reliability, 2017Co-Authors: Shunfeng Cheng, Chien Ming Huang, Michael PechtAbstract:Ever since RoHS was implemented in 2006, Sn3.0Ag0.5Cu (SAC305) has been the primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs). However, due to the 3.0 wt% Silver (Ag) in SAC305, companies have been looking at less expensive solder alternatives, especially for use in inexpensive products that have short operating lives and are used in mild application conditions. This paper reviews new lead-free solder alternatives and the trends in the industry, including SnCu-based Solders, SnAgCu Solders with Ag content < 1.0 wt%, SnAg Solders, and no-Ag low-temperature Solders (e.g., SnBi-based Solders). The analysis is conducted for reflow, wave, and rework conditions and for packaged and flip-chip devices.
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Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application
Proceedings - Electronic Components and Technology Conference, 2016Co-Authors: Milad Mostofizadeh, M. Najari, D Das, Michael Pecht, Laura Katriina FriskAbstract:© 2016 IEEE. The use of sensors has significantly increased in both domestic and industrial applications. In some applications, the sensor component is used along with a heat-sensitive component, therefore, the attachment process using common lead-free Solders that have high melting temperature (e.g., Sn-Ag-Cu, Tm = 217 °C) may be challenging. Among lead-free Solders with low melting temperature, Sn-8%Zn-3%Bi (wt.%), lead-free solder has a rather similar melting temperature to that of typical Sn-Pb Solders. In addition, it offers good mechanical properties. However, the presence of Zn makes it prone to oxidation especially at high temperatures. In this paper, the reliability of sensor attachments using Sn-8%Zn-3%Bi solder and epoxy flux underfill was studied under thermal cycling. Thermal cycling results showed that the lifetime of the lead-free solder joint was lower than that of the Sn-Pb-2Ag solder joints. Failure analysis revealed that the dominant failure mode in lead-free samples was delamination of the sensor pad. In contrast, the failure mode of Sn-36%Pb-2%Ag samples was fatigue crack inside the solder. Additionally, it was found that Sn-Zn-Bi lead-free solder was compatible with epoxy flux underfill.
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Thermal cycling reliability of lead-free Solders (SAC305 and Sn3.5Ag) for high-temperature applications
IEEE Transactions on Device and Materials Reliability, 2011Co-Authors: Elviz George, Diganta Das, Michael Osterman, Michael PechtAbstract:Applications with temperatures higher than the melting point of eutectic tinlead solder (183 °C) require high-melting-point Solders. However, they are expensive and not widely available. With the adoption of lead-free legislation, first in Europe and then in many other countries, the electronics industry has transitioned from eutectic tinlead to lead-free Solders that have higher melting points. This higher melting point presents an opportunity for the manufacturers of high-temperature electronics to shift to mainstream lead-free Solders. In this paper, ball grid arrays (BGAs), quad flat packages, and surface mount resistors assembled with SAC305 (96.5%Sn+3.0%Ag+0.5Cu) and Sn3.5Ag (96.5%Sn+3.5%Ag) solder pastes were subjected to thermal cycling from 40°C to 185 ° C. Commercially available electroless nickel immersion gold board finish was compared to custom Sn-based board finish designed for high temperatures. The data analysis showed that the type of solder paste and board finish used did not have an impact on the reliability of BGA solder joints. The failure analysis revealed the failure site to be on the package side of the solder joint. The evolution of intermetallic compounds after thermal cycling was analyzed. © 2011 IEEE.
