The Experts below are selected from a list of 3348 Experts worldwide ranked by ideXlab platform

Frank Endres - One of the best experts on this subject based on the ideXlab platform.

  • Electrodeposition from Ionic Liquids - Electrodeposition from Ionic Liquids
    2008
    Co-Authors: Frank Endres, Douglas R Macfarlane, Andrew P Abbott
    Abstract:

    PREFACE BASIC CONSIDERATIONS of DEPOSITION IN IONIC LIQUIDS SYNTHESIS of IONIC LIQUIDS AlCl3 Based First Generation Ionic Liquids Air and Water Stable Ionic Liquids Deep Eutectic Solvents PHYSICOCHEMICAL PROPERTIES of IONIC LIQUIDS Electrodeposition of Metals Metal Deposition in AlCl3 Based Ionic Liquids Metal Deposition in Air and Water Stable Ionic Liquids Metal Deposition in Deep Eutectic Solvents Troublesome Aspects Electrodeposition of ALLOYS Electrodeposition of SEMICONDUCTORS Electrodeposition of CONDUCTING POLYMERS Electrodeposition of NANOCRYSTALLINE Metals AND ALLOYS Electrodeposition ON THE NANOSCALE PLASMA ELECTROCHEMISTRY TECHNICAL ASPECTS Counter Electrode Reactions / Metal Dissolution Reference Electrodes Upscaling Recycling Impurities SURFACE PRETREATMENT / ELECTROPOLISHING PLATING PROTOCOLS FUTURE DIRECTIONS

  • Electrodeposition from ionic liquids
    2008
    Co-Authors: Frank Endres, Douglas R Macfarlane, Andrew P Abbott
    Abstract:

    PREFACE BASIC CONSIDERATIONS of DEPOSITION IN IONIC LIQUIDS SYNTHESIS of IONIC LIQUIDS AlCl3 Based First Generation Ionic Liquids Air and Water Stable Ionic Liquids Deep Eutectic Solvents PHYSICOCHEMICAL PROPERTIES of IONIC LIQUIDS Electrodeposition of Metals Metal Deposition in AlCl3 Based Ionic Liquids Metal Deposition in Air and Water Stable Ionic Liquids Metal Deposition in Deep Eutectic Solvents Troublesome Aspects Electrodeposition of ALLOYS Electrodeposition of SEMICONDUCTORS Electrodeposition of CONDUCTING POLYMERS Electrodeposition of NANOCRYSTALLINE Metals AND ALLOYS Electrodeposition ON THE NANOSCALE PLASMA ELECTROCHEMISTRY TECHNICAL ASPECTS Counter Electrode Reactions / Metal Dissolution Reference Electrodes Upscaling Recycling Impurities SURFACE PRETREATMENT / ELECTROPOLISHING PLATING PROTOCOLS FUTURE DIRECTIONS

  • Electrodeposition of Metals and semiconductors in air and water stable ionic liquids
    ChemPhysChem, 2006
    Co-Authors: Sherif Zein El Abedin, Frank Endres
    Abstract:

    : In addition to their stability, the advantages of air- and water-stable ionic liquids over chloroaluminate ionic liquids, which were intensively investigated in the past, are that they are easy to dry, purify, and handle. Moreover, some of these ionic liquids have an extremely large electrochemical window of more than 5 V, and hence they give access to the Electrodeposition of many Metals and semiconductors, such as Ta, Ti, Si, and Ge. The results to date for the Electrodeposition of Metals and semiconductors in the most popular air- and water-stable ionic liquids are presented.

  • Electrodeposition of Metals and Semiconductors in Air‐ and Water‐Stable Ionic Liquids
    Chemphyschem : a European journal of chemical physics and physical chemistry, 2006
    Co-Authors: Sherif Zein El Abedin, Frank Endres
    Abstract:

    In addition to their stability, the advantages of air- and water-stable ionic liquids over chloroaluminate ionic liquids, which were intensively investigated in the past, are that they are easy to dry, purify, and handle. Moreover, some of these ionic liquids have an extremely large electrochemical window of more than 5 V, and hence they give access to the Electrodeposition of many Metals and semiconductors, such as Ta, Ti, Si, and Ge. The results to date for the Electrodeposition of Metals and semiconductors in the most popular air- and water-stable ionic liquids are presented.

  • Nanoscale Electrodeposition of Metals and semiconductors from ionic liquids
    Electrochimica Acta, 2003
    Co-Authors: Werner Freyland, C.a. Zell, S. Zein El Abedin, Frank Endres
    Abstract:

    Abstract The electrocrystallization of Ni, Co and their respective alloys with Al and the Electrodeposition of Ge on Au(1 1 1) and Si(1 1 1):H have been studied in the underpotential (UPD) and overpotential (OPD) range. To this end, in situ electrochemical STM and STS measurements have been performed in ionic electrolytes, the room temperature molten salts or ionic liquids AlCl 3 –[BMIm] + Cl − and [BMIm] + PF 6 − . The larger electrochemical windows of these ionic electrolytes in comparison to aqueous media enables the investigation of Electrodeposition of these elements and compounds on a nanometer scale. We present and compare recent results of 2D and 3D phase formation of Ni and Co Electrodeposition. Clear differences are observed in the 2D phase formation—Ni monolayer vs. Co island formation—which are discussed in the light of the distinct values of the interfacial free energies of these two Metals. In the overpotential (OPD) range, Ni deposition proceeds by a columnar growth of 3D Ni clusters along step edges, whereas Co clusters grow homogeneously at potentials below −0.17 V vs. Co/Co(II). Electrodeposition of Ni x Al 1− x and Co x Al 1− x is found to be very similar. In both cases, codeposition starts at a potential clearly positive of the Al/Al(III)-Nernst potential and with increasing Al content smaller grains are observed. The composition of the respective alloy clusters has been probed in situ by STS spectra and it is found that the effective tunneling barriers at different potentials E scale with the cluster composition determined from independent conventional electrochemical and spectroscopic measurements. Finally, we report first investigations of Electrodeposition of ultrathin Ge films with varying thickness on Au(1 1 1) and Si(1 1 1):H. Probing the electronic structure of these films by in situ STS spectra a metal–semiconductor transition is indicated with increasing film thickness above 2–3 nm. This is discussed in comparison with ultrathin Ge films grown by expitaxial vapour deposition.

Sherif Zein El Abedin - One of the best experts on this subject based on the ideXlab platform.

Andrew P Abbott - One of the best experts on this subject based on the ideXlab platform.

  • Study of silver Electrodeposition in deep eutectic solvents using atomic force microscopy
    Transactions of the IMF, 2018
    Co-Authors: Andrew P Abbott, Muhammad Azam, Karl S. Ryder, S. Saleem
    Abstract:

    ABSTRACTThe Electrodeposition of Metals in ionic liquids and deep eutectic solvents leads to deposits with significantly different morphologies to those seen with aqueous solutions. The classical m...

  • the effect of additives on zinc Electrodeposition from deep eutectic solvents
    Electrochimica Acta, 2011
    Co-Authors: Andrew P Abbott, Karl S. Ryder, John C Barron, Gero Frisch, Fernando A Silva
    Abstract:

    Abstract The Electrodeposition of Metals using ionic liquids has received considerable attention during the last ten years. Recent developments have taken these novel electrolytes from laboratory to commercial scale. One of the factors limiting the development into practical plating systems is the understanding of how brighteners function. In this study we describe the addition of three polar additives and their effect upon the nucleation mechanism of zinc and the resultant morphology. It is shown that the structure of the zinc deposits is controlled by double layer properties and it is proposed that the brightening effect of ethylene diamine and ammonia are caused by their ability to inhibit the adsorption of chloride at the electrode surface. The deposition of most Metals using ionic liquids results in apparently amorphous deposits, which tend to be actually nano-crystalline. The additives used in this study produce macro-crystalline deposits, which resemble those obtained from aqueous solutions.

  • Electrodeposition from ionic liquids
    2008
    Co-Authors: Frank Endres, Douglas R Macfarlane, Andrew P Abbott
    Abstract:

    PREFACE BASIC CONSIDERATIONS of DEPOSITION IN IONIC LIQUIDS SYNTHESIS of IONIC LIQUIDS AlCl3 Based First Generation Ionic Liquids Air and Water Stable Ionic Liquids Deep Eutectic Solvents PHYSICOCHEMICAL PROPERTIES of IONIC LIQUIDS Electrodeposition of Metals Metal Deposition in AlCl3 Based Ionic Liquids Metal Deposition in Air and Water Stable Ionic Liquids Metal Deposition in Deep Eutectic Solvents Troublesome Aspects Electrodeposition of ALLOYS Electrodeposition of SEMICONDUCTORS Electrodeposition of CONDUCTING POLYMERS Electrodeposition of NANOCRYSTALLINE Metals AND ALLOYS Electrodeposition ON THE NANOSCALE PLASMA ELECTROCHEMISTRY TECHNICAL ASPECTS Counter Electrode Reactions / Metal Dissolution Reference Electrodes Upscaling Recycling Impurities SURFACE PRETREATMENT / ELECTROPOLISHING PLATING PROTOCOLS FUTURE DIRECTIONS

  • Electrodeposition from Ionic Liquids - Electrodeposition from Ionic Liquids
    2008
    Co-Authors: Frank Endres, Douglas R Macfarlane, Andrew P Abbott
    Abstract:

    PREFACE BASIC CONSIDERATIONS of DEPOSITION IN IONIC LIQUIDS SYNTHESIS of IONIC LIQUIDS AlCl3 Based First Generation Ionic Liquids Air and Water Stable Ionic Liquids Deep Eutectic Solvents PHYSICOCHEMICAL PROPERTIES of IONIC LIQUIDS Electrodeposition of Metals Metal Deposition in AlCl3 Based Ionic Liquids Metal Deposition in Air and Water Stable Ionic Liquids Metal Deposition in Deep Eutectic Solvents Troublesome Aspects Electrodeposition of ALLOYS Electrodeposition of SEMICONDUCTORS Electrodeposition of CONDUCTING POLYMERS Electrodeposition of NANOCRYSTALLINE Metals AND ALLOYS Electrodeposition ON THE NANOSCALE PLASMA ELECTROCHEMISTRY TECHNICAL ASPECTS Counter Electrode Reactions / Metal Dissolution Reference Electrodes Upscaling Recycling Impurities SURFACE PRETREATMENT / ELECTROPOLISHING PLATING PROTOCOLS FUTURE DIRECTIONS

  • Application of ionic liquids to the Electrodeposition of Metals
    Physical Chemistry Chemical Physics, 2006
    Co-Authors: Andrew P Abbott, Katy J Mckenzie
    Abstract:

    The Electrodeposition of most of technologically important Metals has been shown to be possible from a wide range of room temperature molten salts, more commonly known today as 'ionic liquids'. These liquids are currently under intense scrutiny for a wide variety of applications some of which have already been commercialized. Despite the fact that Electrodeposition was the first application studied in these liquids no metal deposition processes have as yet been developed to an industrial scale. This review addresses the practical and theoretical aspects that need to be considered when choosing ionic liquids for metal deposition. It details the current understanding of the physical and chemical properties of these interesting fluids and highlights the areas that need to be considered to develop practical electroplating systems. The effect of composition and temperature on viscosity and conductivity are discussed together with the fundamental approaches required to synthesise new liquids.

Nebojša D. Nikolić - One of the best experts on this subject based on the ideXlab platform.

  • Electrodeposition of Metals with Hydrogen Evolution
    Morphology of Electrochemically and Chemically Deposited Metals, 2016
    Co-Authors: K.i. Popov, Stojan S. Djokić, Nebojša D. Nikolić, Vladimir D. Jović
    Abstract:

    Hydrogen generated during Electrodeposition processes can achieve a significant influence on morphology of electrodeposited metal. This effect is especially important during Electrodeposition of Metals characterized by low (so-called the, like Cu) and very low (so-called the, like Ni, Co, Fe, Pt, Cr) overpotentials for hydrogen discharge [1]. In the case of Cu, hydrogen evolution commences at some overpotential belonging to the plateau of the limiting diffusion current density. The increase of the overpotential intensifies this reaction (see Fig. 1.10a). For copper solution containing 0.10 M CuSO4 in 0.50 M H2SO4, the plateau of the limiting diffusion current density corresponds to the range of overpotentials between 300 and 750 mV, and hydrogen evolution as the second reaction commences at an overpotential of 590 mV [2]. The quantity of evolved hydrogen is determined by the current efficiency for hydrogen evolution reaction, ηI,av(H2). As presented in Table 5.1, the current efficiency of hydrogen evolution increases with an increase in overpotential.

  • The Cathodic Polarization Curves in Electrodeposition of Metals
    Morphology of Electrochemically and Chemically Deposited Metals, 2016
    Co-Authors: K.i. Popov, Stojan S. Djokić, Nebojša D. Nikolić, Vladimir D. Jović
    Abstract:

    Morphology is probably the most important property of electrodeposited Metals. It depends mainly on the kinetic parameters of the deposition process and on the deposition overpotential or current density. The morphology of an electrodeposited metal also depends on the deposition time until the deposit has attained its final form.

  • Polarization curves in the ohmic controlled Electrodeposition of Metals
    Electrochimica Acta, 2009
    Co-Authors: K.i. Popov, Predrag M. Živković, S.b. Krstić, Nebojša D. Nikolić
    Abstract:

    Abstract The conditions under which ohmic controlled metal Electrodeposition occurs are discussed using a simple mathematical model. It is shown that ohmic controlled Electrodeposition can be operative if the value of the exchange current density for the Electrodeposition process is more than 10 times larger than the corresponding value of the limiting diffusion current density. In this case, a linear dependence of the current density on overpotential up to the value of the limiting diffusion current density can be observed. On the other hand, the initiation of dendrite growth under these circumstances is possible, even at very low values of overpotential, at the moment when the limiting diffusion current density is attained in potentiostatic Electrodeposition. In this way, instead of a limiting diffusion current density plateau, an inflection point on the polarization curve can be observed, since dendritic growth is followed by an increase in the deposition current density. At the same time, it is shown that the ensemble of tips of dendrites can behave as an ensemble of microelectrodes working independently under mixed or activation control due to the absence of a common diffusion layer. This was confirmed by deposition of copper on a copper dendritic electrode and by silver Electrodeposition from a silver nitrate solution onto a graphite substrate.

Agustin Costagarcia - One of the best experts on this subject based on the ideXlab platform.

  • effect of Metals on silver Electrodeposition application to the detection of cisplatin
    Electrochimica Acta, 2005
    Co-Authors: David Hernandezsantos, Maria Begona Gonzalezgarcia, Agustin Costagarcia
    Abstract:

    Abstract In the present work, the influence of several Metals (Co, Ru, Pd, Os, Pt, Cu, Pb), deposited on a carbon paste electrode, towards silver Electrodeposition was tested. First, adequate conditions for the Electrodeposition of Metals on the electrode were found. Then, the cyclic voltammograms registered (silver deposition curves and analytical signals) showed that Co, Cu, Pt and Pd were able to accelerate silver Electrodeposition. Finally, a valid methodology for the detection of cisplatin was established. It is based on the deposition of silver on a Pt (from cisplatin) modified electrode and the analytical signal corresponds to the anodic stripping of the deposited silver. A limit of detection of 3.2 × 10 −9  mol dm −3 (1 ng cm −3 ) cisplatin was obtained.